EP0228694A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Process using combination of laser etching and another etchant in formation of conductive through-holes in a dielectric layer
Assignee: EIDP Inc
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Filing: 1986-12-23
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Granted: —
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Expires: 2006-12-23
Abstract
Abstract A conductive through-hole is formed through a dielectric sandwiched between conductors by forming a noncircular hole in a conductor, laser etching a pathway completely through the dielectric, liquid chemical or plasma etching the dielectric layer adjacent the pathway to undercut the conductive layer, and deforming at the conductor which has been undercut during the etching.
Inventors
- 👤 Gordon Sidney Cox Iii
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 00:17
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4084; H05K3/0011; H05K3/0017; H05K3/002; H05K3/0026; H05K3/0032; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/0397; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0554; H05K2203/11; H05K2203/1184; H05K2203/15; H05K2203/1572; H05K3/0035; H05K3/0041
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
106 words
A process for making an electrically conducting path in a dielectric layer sandwiched between two electrically conductive layers comprising (a) forming a hole completely through at least one of the conductive layers: (b) through said hole laser etching the dielectric layer whereby a pathway is formed completely through the dielectric layer without substantially undercutting dielectric material between the two conductive layers; (c) etching the dielectric layer adjacent the pathway to undercut the conductive layer adjacent the hole; (d) deforming the conductive layer which has been undercut toward the other conductive layer, and (e) forming an electrical conducting path between the two conductive layers through the pathway.
Claim 2
Dependent Claim
106 words
A process for making an electrically conducting path in a dielectric layer sandwiched between two electrically conductive layers comprising (a) forming a hole completely through at least one of the conductive layers: (b) through said hole laser etching the dielectric layer whereby a pathway is formed completely through the dielectric layer without substantially undercutting dielectric material between the two conductive layers; (c) etching the dielectric layer adjacent the pathway to undercut the conductive layer adjacent the hole; (d) deforming the conductive layer which has been undercut toward the other conductive layer, and (e) forming an electrical conducting path between the two conductive layers through the pathway.
Claim 3
Dependent Claim
21 words
The process of claim 1 wherein in steps (a) the hole is formed without substantially removing material from the conductive layer.
Claim 4
Dependent Claim
15 words
The process of claim 1 wherein in step (c) the etching is by a plasma.
Claim 5
Dependent Claim
17 words
The process of claim 1 wherein in step (c) the etching is by a chemical liquid etchant.
Claim 6
Dependent Claim
18 words
The process of claim 1 where a hole is formed only in one conductive layer in step (a).
Claim 7
Dependent Claim
28 words
The process of claim 5 wherein the conductive layer which does not have a hole formed therein in step (a) has a thickness not greater than 3.0 mils.
Claim 8
Dependent Claim
11 words
The process of claim 2 wherein the conductive layer is copper.
Claim 9
Dependent Claim
43 words
8 . The process of claim 1 wherein holes are formed in the conductive layers on opposite sides of the polymeric dielectric layer in step (a) and the dielectric layer is etched through the opposite holes in the conductive layers in step (b).
Claim 10
Dependent Claim
21 words
The process of claim 1 wherein the electrical connection in step (d) is formed by contact of the two conductive layers.
Claim 11
Dependent Claim
26 words
The process of claim 1 wherein the formation of the electrical connection includes application of an electrically conductive material to the conductive layer in the pathway.
Claim 12
Dependent Claim
27 words
The process of claim 1 wherein a plurality of holes are simultaneously formed in step (a) and a plurality of pathways are simultaneously formed in step (b).
References Cited (Backward Citations)
No citation records indexed.
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