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EP0223136A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Planar process and structure for spectral filters in an optoelectronic device

Assignee: International Business Machines Corp
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Filing: 1986-10-31
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Granted: —
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Expires: 2006-10-31
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Abstract

Abstract Bandpass or band reject spectral filters (11) for a monolithic optoelectronic device are produced by a planar process com­patible with the semiconductor process utilized to produce the optoelectronic device. The filter (11) is comprised of a number of layers (14-20) of material normally used in a semicon­ductor process. The thickness of layers applied over an imaging is modulated (6,8,10) to create the interference fil­ters with necessary characteristics. In an MOS-type process, a given pixel area consists of a set of layers of silicon oxide, polysilicon and silicon nitride with specific thick­ness dimensions.

Inventors

  • 👤 Christian Daniel Gutleben
  • 👤 Ying Luh Yao

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-05 01:51
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/30; H10F77/306; H10F77/331; H10F77/337; G; G02; G02B; G02B5/00; G02B5/20; G02B5/28; G02B5/285; G02B6/00; G02B6/10; G02B6/12; G02B6/122

Claims Analysis

Total Claims: 18
Claim 1
Independent Claim 67 words
A bandpass spectral filter comprised of: a substrate (12); a first oxide layer (14) of a predetermined thickness formed on said substrate; a polysilicon layer (16) of a predetermined thickness formed on said first oxide layer; a second oxide layer (18) of a predetermined thickness formed on said polysilicon layer; and a nitride layer (20) of a predetermined thickness formed on said second oxide layer (FIG. 2).
Claim 2
Dependent Claim 67 words
A bandpass spectral filter comprised of: a substrate (12); a first oxide layer (14) of a predetermined thickness formed on said substrate; a polysilicon layer (16) of a predetermined thickness formed on said first oxide layer; a second oxide layer (18) of a predetermined thickness formed on said polysilicon layer; and a nitride layer (20) of a predetermined thickness formed on said second oxide layer (FIG. 2).
Claim 3
Dependent Claim 38 words
A band reject spectral filter comprised of: a substrate (30); alternating layers (32-40) of a predetermined thicknesses of nitride and oxide formed on said substrate, with the top and bottom layers each being formed of nitride (FIG. 6).
Claim 4
Dependent Claim 38 words
A band reject spectral filter comprised of: a substrate (30); alternating layers (32-40) of a predetermined thicknesses of nitride and oxide formed on said substrate, with the top and bottom layers each being formed of nitride (FIG. 6).
Claim 5
Dependent Claim 20 words
The combination as recited in claims 1 or 2, wherein said substrate (12, 30) is formed of silicon or glass.
Claim 6
Dependent Claim 24 words
The combination as recited in one of the preceding claims, wherein said nitride layers are silicon nitride and said oxide layers are silicon oxide.
Claim 7
Dependent Claim 25 words
The combination as recited in one of the preceding claims, adapted for a monolithic optoelectronic device wherein the substrate (12, 30) includes a photocollec­tion area.
Claim 8
Dependent Claim 27 words
The combination as recited in one of claims 1 or 2 to 5, wherein said filter is comprised of red, green and blue sections (6, 8, 10).
Claim 9
Dependent Claim 163 words
The combination as recited in claim 6, wherein: said red section (6) has a first silicon oxide layer thickness on the order of 0.085 microns, a polysilicon layer thickness on the order of 0.0975 microns, a second silicon oxide layer thickness on the order of 0.118 microns and a silicon nitride thickness on the order of 0.095 microns; said green section (8) has a first silicon oxide layer thickness on the order of 0.070 microns, a polysilicon layer thickness on the order of 0.0683 microns, a second silicon oxide layer thickness on the order of 0.044 microns and a silicon nitride layer thickness on the order of 0.120 microns; and said blue section (10) has a first silicon oxide layer thickness on the order of 0.125 microns, a polysilicon layer thickness on the order of 0.0370 microns, a se­cond silicon oxide layer thickness on the order of 0.014 microns, and a silicon nitride layer thickness on the order of 0.100 microns (FIG. 2).
Claim 10
Dependent Claim 50 words
The combination as recited in one of the claims 2 to 5, wherein each silicon nitride layer (32, 34, ...) has a layer thickness on the order of 200 microns and each silicon oxide layer (42, 44, ...) has a layer thickness on the order of 125 microns (FIG. 6)
Claim 11
Dependent Claim 19 words
The combination as recited in claim 8, wherein there are five silicon nitride layers and four silicon oxide layers.
Claim 12
Independent Claim 76 words
A method of forming a bandpass spectral filter in an optoelectronic device, comprising the steps of: forming a photocollection area in a semiconductor sub­strate (12); overlaying said substrate with a first layer (14) of silicon oxide; overlaying said first layer of polysilicon with a layer (16) of polysilicon; overlaying said layer of polysilicon with a second layer (18) of silicon oxide; and overlaying said second layer of silicon oxide with a layer (20) of silicon nitride.
Claim 13
Independent Claim 76 words
A method of forming a bandpass spectral filter in an optoelectronic device, comprising the steps of: forming a photocollection area in a semiconductor sub­strate (12); overlaying said substrate with a first layer (14) of silicon oxide; overlaying said first layer of polysilicon with a layer (16) of polysilicon; overlaying said layer of polysilicon with a second layer (18) of silicon oxide; and overlaying said second layer of silicon oxide with a layer (20) of silicon nitride.
Claim 14
Dependent Claim 248 words
The method as recited in claim 10 for forming a multi­layer bandpass spectral filter, comprised of a plurality of red, green and blue sections (6, 8, 10), and includ­ing the steps of: overlaying said substrate (12) with a first layer (14) of silicon oxide having in each red section (6) a layer thickness on the order of 0.070 microns and having in each blue section (10) a layer thickness on the order of 0.125 microns; overlaying said first layer (14) of silicon oxide with a layer (16) of polysilicon having in each red section a layer thickness on the order of 0.975 microns, having in each green section a layer thickness on the order of 0.683 microns ad having in each blue section a layer thickness on the order of 0.037 microns; overlaying said layer (16) of polysilicon with a second layer (18) of silicon oxide having in each red section a layer thickness on the order of 0.118 microns, having in each green section a layer thickness on the order of 0.044 microns and having in each blue section a layer thickness on the order of 0.014 microns; and overlaying said second layer (18) of silicon oxide with a layer (20) of silicon nitride having in each red section a layer thickness on the order of 0.095 microns, having in each green section a layer thickness on the order of 0.120 microns and having in each blue section a layer thickness on the order of 0.100 microns.
Claim 15
Independent Claim 44 words
A method of forming a multilayer band reject filter, said method comprising the steps of: forming alternating layers (32, 42, 34, 44, ...) of nitride and oxide on a substrate (30), with the top and bottom layers (32, 40) each being formed of nitride.
Claim 16
Independent Claim 44 words
A method of forming a multilayer band reject filter, said method comprising the steps of: forming alternating layers (32, 42, 34, 44, ...) of nitride and oxide on a substrate (30), with the top and bottom layers (32, 40) each being formed of nitride.
Claim 17
Independent Claim 38 words
The method as recited in one of the claims 10 to 12, wherein said substrate is formed of silicon or glass, said nitride layers are formed of silicon ntride and said oxide layers are formed of silicon oxide.
Claim 18
Independent Claim 41 words
The method as recited in one of claims 12 or 13, wherein each silicon nitride layer has a layer thickness on the order of 200 microns and each silicon oxide layer has a layer thickness on the order of 125 microns.

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