EP0222072A2
Expired / Lapsed
EP
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Method of loading surface mounted device and an apparatus therefor
Assignee: Hitachi Ltd
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Filing: 1986-08-07
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Granted: —
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Expires: 2006-08-07
Abstract
Abstract A method and an apparatus for cresting surface mounted device such as the IC (31) or the like by the hand (33) of the robot and automatically and accurately loading them onto the contact pattern of the printed board by means of the image processor (7) are disclosed. According to this method, the measurement line (17) is provided onto each image pattern of the pin array of the surface mounted device and the array of the contact pattern of the board, so that it may intersect at right angles with the direction of the pattern, and each position of the pin array and the array of the contact pattern is sought from the variation of the brightness (I,II,...) on that line. In accordance with the result thus obtained, displacement of the position and that of the rotation over the entire surfaced part and the contact pattern are sought and the operation of the robot (1-10) is controlled in accordance with that information.
Inventors
- 👤 Kenji Suzuki
- 👤 Seiji Hata
- 👤 Yoshie Nishida
- 👤 Kyoichi Kawasaki
- 👤 Kenjiro Fujii
- 👤 Yasunori Shimura
- 👤 Shigenori Takeyoshi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 21:04
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/08; H05K13/081; H05K13/0812; H10; H10W; H10W74/00
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
138 words
A method of loading surface mounted device for loading said surface mounted device chucked by the hand of the automatic control apparatus onto the contact pattern on the board by said automatic apparatus, comprising steps of; providing the measurement line on each image pattern of the array of the contact patterns, of the surfaced part, in such a way that it may intersect substantially at right angles with the direction of the pattern, Obtaining each position of said array of the contract pattern from the variation of the brightness distributed on said measurement line, Obtaining the displacements of the position and the rotation of the surfaced parts and the entire contact pattern in accordance with said position, and, Controlling the operation of said automatic apparatus at the time of loading in accordance with the information on said displacements.
Claim 2
Independent Claim
138 words
A method of loading surface mounted device for loading said surface mounted device chucked by the hand of the automatic control apparatus onto the contact pattern on the board by said automatic apparatus, comprising steps of; providing the measurement line on each image pattern of the array of the contact patterns, of the surfaced part, in such a way that it may intersect substantially at right angles with the direction of the pattern, Obtaining each position of said array of the contract pattern from the variation of the brightness distributed on said measurement line, Obtaining the displacements of the position and the rotation of the surfaced parts and the entire contact pattern in accordance with said position, and, Controlling the operation of said automatic apparatus at the time of loading in accordance with the information on said displacements.
Claim 3
Dependent Claim
78 words
A method of loading surface mounted devicve, as defined in Claim 1, wherein said step of obtaining each position of the array of the contact pattern comprises; specifying the position of the edge with respect to each boundary of said array of the contact pattern, calculating the coordinate of the center of the pin array or the contact pattern from said position of the edge, taking into consideration the asymmetry and the partial absence of said contact pattern.
Claim 4
Dependent Claim
45 words
A method of loading surface mounted device, as defined in Claim 1, comprising a further step of detecting the bend of each pin of pin array corresponding to said array of the contact pattern from the variation of the brightness distributed on said measurement line,
Claim 5
Dependent Claim
72 words
A method of loading surface mounted device, as defined in Claim 3, wherein said surfaced part is a flat package IC and said method comprises a step of deciding the lateral bend of pins of said IC which occurs along the arrayed direction of the pin array and a step of deciding the longitudinal bend which emerges in the direction intersecting at right angles with the arrayed direction of the pin array.
Claim 6
Dependent Claim
60 words
A method of loading surfaced mounted device, as defined in Claim 1, wherein the object is illuminated by a plurality of the point light sources continuously disposed around the image pickup lens in such a way that said sources may surround said lens at the time of image pickup for obtaining data on the plane image of said surfaced parts.
Claim 7
Dependent Claim
31 words
A method of loading surface mounted device, as defined in Claim 5, wherein the light emitted from the end surface of the optical fiber is used as said point light source.
Claim 8
Dependent Claim
154 words
A loading apparatus for loading the IC onto the printed board by registering a plurality of the contact patterns on the printed board with a plurality of leads on the IC, comprising; an image pickup means (1,2) for picking up the image of said contact pattern or the leads, a memory means for setting the measurement line onto said picked up contact pattern or leads, and storing the data on the brightness distributed along said measurement line in the order in which patterns or leads are arrayed, a processing means (7) for calculating the coordinate of the center (P) of the contact pattern or lead from the data on the brightness (I,II,..) stored within said memory means, and, a means for specifying the position and the inclination of the printed board or the IC from the coordinate of the center (P) obtained by said processing means to register said printed circuit with said IC.
Claim 9
Dependent Claim
154 words
A loading apparatus for loading the IC onto the printed board by registering a plurality of the contact patterns on the printed board with a plurality of leads on the IC, comprising; an image pickup means (1,2) for picking up the image of said contact pattern or the leads, a memory means for setting the measurement line onto said picked up contact pattern or leads, and storing the data on the brightness distributed along said measurement line in the order in which patterns or leads are arrayed, a processing means (7) for calculating the coordinate of the center (P) of the contact pattern or lead from the data on the brightness (I,II,..) stored within said memory means, and, a means for specifying the position and the inclination of the printed board or the IC from the coordinate of the center (P) obtained by said processing means to register said printed circuit with said IC.
Claim 10
Dependent Claim
65 words
A loading apparatus, as defined in Claim 7, wherein said processing means specifies each edge of the contact pattern or leads from said data on the brightness (I,II) and calculates the coordinate of the center (P) of the contact pattern or the lead from said coordinate of the edge, taking into consideration the asymmetry or the partial absence of said contact pattern or the lead.
Claim 11
Dependent Claim
54 words
A loading apparatus, as defined in Claim 8, wherein, in the presence of said asymmetry and the partial absence, the modification data are previously stored within the memory means, so that the coordinate of the center (P) may be calculated from said modification data and the provisional center of the coordinate of said edge.
Claim 12
Dependent Claim
33 words
A loading apparatus, as defined in Claim 7, wherein a detecting means is provided for detecting the bend of each of said leads in accordance with the data stored within said memory means.
Claim 13
Dependent Claim
59 words
A loading apparatus, as defined in Claim 10, wherein said detecting means comprises a means for detecting the lateral bend which emerges along the arrayed direction of the lead array of the IC (31) and a means for detecting the longitudinal bend which emerges in the direction intersecting at right angles with the arrayed direction of the lead array.
Claim 14
Dependent Claim
60 words
A loading apparatus, as defined in Claim 10, wherein an adsorbing hand (33) is provided for shifting the IC (31) to a predetermined mounting position and positioning it and the bend of said IC (31) is detected in accordance with the data on the picked up plane image of the IC (31) which is positioned and held by said hand.(33)
Claim 15
Dependent Claim
60 words
A loading apparatus, as defined in Claim 7, wherein the object is illuminated by a plurality of the point light sources (38) continuously disposed around the image pickup lens (36) in such a way that they may surround said lens (36) at the time of image pickup for obtaining the data on the image of the plane of said IC.(3l)
Claim 16
Dependent Claim
27 words
A loading apparatus, as defined in Claim 13, wherein the light emitted from the end surface of the optical fiber is used as said point light source.(38)
Claim 17
Dependent Claim
188 words
A loading method for loading the IC onto the board comprising the steps of; (a) when the board is mechanically fixed on the board supply apparatus, the TV camera which is fixed to the hand of the robot being moved onto said board and seeking the position of the contact pattern for loading the IC on the board from the variation of the brightness distributed on the measurement line which is provided in such a way that it may intersect at right angles with the direction of the pattern, (b) the hand being moved to the unit for positioning the gross position of the IC and adsorbing the IC (integrated circuit) from said apparatus, (c) the IC being moved onto the TV camera for detecting the position of the IC, so that the displacement between the IC and the hand is detected, (d) positions of the contact pattern and the IC which are obtained by the image processor being fed back via the robot control device to the robot, so that the IC may be loaded onto the contact pattern on the board in the excellently registered way.
Claim 18
Dependent Claim
188 words
A loading method for loading the IC onto the board comprising the steps of; (a) when the board is mechanically fixed on the board supply apparatus, the TV camera which is fixed to the hand of the robot being moved onto said board and seeking the position of the contact pattern for loading the IC on the board from the variation of the brightness distributed on the measurement line which is provided in such a way that it may intersect at right angles with the direction of the pattern, (b) the hand being moved to the unit for positioning the gross position of the IC and adsorbing the IC (integrated circuit) from said apparatus, (c) the IC being moved onto the TV camera for detecting the position of the IC, so that the displacement between the IC and the hand is detected, (d) positions of the contact pattern and the IC which are obtained by the image processor being fed back via the robot control device to the robot, so that the IC may be loaded onto the contact pattern on the board in the excellently registered way.
References Cited (Backward Citations)
No citation records indexed.
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