Aligned interconnections between logic stages

Claim 1

A method of fabricating integrated IGFET logic circuits from a plurality of interconnected multi-input logic gates, at least some of the input nodes of individual logic gates being common to more than one logic gate, each logic gate including a number of input signal responsive devices for coupling a logic gate voltage node to a first reference voltage node to represent a first logic state and load means for coupling the logic gate voltage node to a second reference voltage node to represent a second logic state, including the steps of: establishing a two-dimensional array of logic gates organized in columns and rows, wherein logic gates having common input nodes with other logic gates are placed in the same row and logic gates lacking common input nodes or having input nodes corresponding to input signals generated by others of the logic gates are placed in columns; aligning the common input devices of logic gates in different columns such that their input nodes are aligned in the row direction; allocating a position in the column direction for each of the remaining input devices and load means; aligning the logic gate voltage nodes, the first reference voltage nodes and the second reference voltage nodes within each logic gate to form three independent sets of linear points running in the column direction; interconnecting any common voltage nodes between adjacent devices and load means within each logic gate by a first level of interconnection means; interconnecting by a second level of interconnecting means the input nodes of the logic gates such that each input node is connected to another input node in a different column of logic gates or is connected to a least one point of an additional independent set of linear points representing a circuit input node running in the column direction or is connected to a logic gate voltage node representative of a circuit output node; providing a plurality of substantially parallel third level interconnecting means aligned substantially in the column direction such that adjacent points within each set of points representintg a common voltage node are interconnected; and providing a plurality of fourth level interconnecting means aligned substantially in the row direction such that all of the third plurality of interconnecting means corresponding to the first reference voltage, the second reference voltage, circuit input nodes and circuit output nodes are independently connected.

Claim 2

A method of fabricating integrated IGFET logic circuits from a plurality of interconnected multi-input logic gates, at least some of the input nodes of individual logic gates being common to more than one logic gate, each logic gate including a number of input signal responsive devices for coupling a logic gate voltage node to a first reference voltage node to represent a first logic state and load means for coupling the logic gate voltage node to a second reference voltage node to represent a second logic state, including the steps of: establishing a two-dimensional array of logic gates organized in columns and rows, wherein logic gates having common input nodes with other logic gates are placed in the same row and logic gates lacking common input nodes or having input nodes corresponding to input signals generated by others of the logic gates are placed in columns; aligning the common input devices of logic gates in different columns such that their input nodes are aligned in the row direction; allocating a position in the column direction for each of the remaining input devices and load means; aligning the logic gate voltage nodes, the first reference voltage nodes and the second reference voltage nodes within each logic gate to form three independent sets of linear points running in the column direction; interconnecting any common voltage nodes between adjacent devices and load means within each logic gate by a first level of interconnection means; interconnecting by a second level of interconnecting means the input nodes of the logic gates such that each input node is connected to another input node in a different column of logic gates or is connected to a least one point of an additional independent set of linear points representing a circuit input node running in the column direction or is connected to a logic gate voltage node representative of a circuit output node; providing a plurality of substantially parallel third level interconnecting means aligned substantially in the column direction such that adjacent points within each set of points representintg a common voltage node are interconnected; and providing a plurality of fourth level interconnecting means aligned substantially in the row direction such that all of the third plurality of interconnecting means corresponding to the first reference voltage, the second reference voltage, circuit input nodes and circuit output nodes are independently connected.

Claim 3

A method of fabricating an integrated circuit, said integrated circuit comprising multiple logic blocks, each said block, receiving as logic signal inputs logic signal outputs of other blocks or logical inputs to said integrated circuit, each block comprising one or more logic circuits, each said logic circuit comprising a load device coupled between a first fixed potential and an output potential and further comprising one or more logic sub-blocks comprising one or more FETs controlled by one or more of said logic signal inputs and coupled to a second fixed potential, said output potential being coupled to a logic signal output of said logic circuit, said method comprising the steps of: establishing a two-dimensional array organized in columns and rows; assigning one or more of said blocks to a column; assigning at least some of said logic sub-blocks to rows so that logic signal inputs of a column are aligned with logic signal outputs of other columns or to logical inputs to other columns to which said logic signal inputs of said column are also connected; establishing in a substrate a semiconducting area for each said logic sub-block and each said load device; aligning along said columns points in said semiconducting areas to be connected to said first fixed potential, to said second fixed potential and to said output potential; depositing a first interconnecting level for establishing gate electrodes off said FETs and for interconnecting one or more columns; depositing an insulating layer over said first interconnecting level; providing contact holes through said insulating layer at said aligned points; and depositing a second interconnecting level along said columns for providing at least three lines overlying said contact holes, said three lines providing said first fixed potential, said second fixed potential and said output potential.

Claim 4

A method of fabricating an integrated circuit, said integrated circuit comprising multiple logic blocks, each said block, receiving as logic signal inputs logic signal outputs of other blocks or logical inputs to said integrated circuit, each block comprising one or more logic circuits, each said logic circuit comprising a load device coupled between a first fixed potential and an output potential and further comprising one or more logic sub-blocks comprising one or more FETs controlled by one or more of said logic signal inputs and coupled to a second fixed potential, said output potential being coupled to a logic signal output of said logic circuit, said method comprising the steps of: establishing a two-dimensional array organized in columns and rows; assigning one or more of said blocks to a column; assigning at least some of said logic sub-blocks to rows so that logic signal inputs of a column are aligned with logic signal outputs of other columns or to logical inputs to other columns to which said logic signal inputs of said column are also connected; establishing in a substrate a semiconducting area for each said logic sub-block and each said load device; aligning along said columns points in said semiconducting areas to be connected to said first fixed potential, to said second fixed potential and to said output potential; depositing a first interconnecting level for establishing gate electrodes off said FETs and for interconnecting one or more columns; depositing an insulating layer over said first interconnecting level; providing contact holes through said insulating layer at said aligned points; and depositing a second interconnecting level along said columns for providing at least three lines overlying said contact holes, said three lines providing said first fixed potential, said second fixed potential and said output potential.

Claim 6

A method as recited in Claims 2 or 3, wherein said deposited first interconnecting levels further interconnects two or more FETs in one of said columns.

Claim 7

A method as recited in one of the preceding claims, further comprising providing contact means between said first inter­connecting level interconnecting two or more FETs and at least one semiconducting area.

Claim 8

A method as recited in one of the preceding claims, wherein said first interconnecting level is polysilicon and said se­cond interconnecting level is a metal.

Claim 9

A method as recited in one of the preceding claims, wherein said first metallization further provides lines for additional voltage nodes within one said logic blocks.