EP0218437A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A microelectronics apparatus and method of interconnecting wiring planes
Assignee: MCNC Research and Development Institute
•
Filing: 1986-09-29
•
Granted: —
•
Expires: 2006-09-29
Abstract
Abstract A method of fabricating customized connections between wiring planes of microelectronics apparatus is disclosed. Hence, a first wiring plane (10) having multiple conductors (11) is formed upon a substrate (S). An insulating layer (20) is formed that overlies and electrically insulates the first wiring plane. A second wiring plane (30) having multiple conductors is formed above the unsulating layer (20) by forming multiple conductors (31) that are electrically connected to the first wiring plane with selected conductors (11) of the first wiring plane being electrically connected to selected conductors (31) of the second wiring plane. The connections may be modified by breaking (at 40) selected ones of the electrical connections between the first and second wiring planes to customize the electrical interconnections.
Inventors
- 👤 Arnold Reisman
- 👤 Carlton M. Osburn
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 02:15
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H05; H05K; H05K1/00; H05K1/02; H05K1/0286; H05K1/0287; H05K1/0289; H10W70/01; H10W70/05; H10W70/092; H10W70/62; H10W70/641; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
112 words
A method of fabricating customized connections between wiring planes of microelectronics apparatus each plane having multiple conductors, the method being characterised by: forming a first wiring plane (10)having multiple conductors (11); forming an insulating layer (20) that overlies and electrically insulates the first wiring plane; forming a second wiring plane 60) that overlies the insulating layer by forming multiple conductors (31) lies are selectively electrically connected to the first wiring plane, selected conductors of each-wiring plane being electrically connected to selected conductors of the other wiring plane; and modifying said connections by electrically disconnecting selected ones of the electrical connections between the first and second wiring planes to customize the electrical connections.
Claim 2
Independent Claim
112 words
A method of fabricating customized connections between wiring planes of microelectronics apparatus each plane having multiple conductors, the method being characterised by: forming a first wiring plane (10)having multiple conductors (11); forming an insulating layer (20) that overlies and electrically insulates the first wiring plane; forming a second wiring plane 60) that overlies the insulating layer by forming multiple conductors (31) lies are selectively electrically connected to the first wiring plane, selected conductors of each-wiring plane being electrically connected to selected conductors of the other wiring plane; and modifying said connections by electrically disconnecting selected ones of the electrical connections between the first and second wiring planes to customize the electrical connections.
Claim 3
Dependent Claim
32 words
The method of Claim 1 wherein the step of forming a second wiring plane further comprises electrically connecting each conductor of each wiring plane to each conductor of the other wiring plane.
Claim 4
Independent Claim
43 words
The method of Claim lor 2 wherein the step of forming an insulating layer further comprises forming openings 22 in said insulating layer at selected locations to expose portions of the conductors of the underlying first wiring plane to accommodate electrical connections therewith.
Claim 5
Dependent Claim
26 words
The method of Claim 1,2 or 3 wherein the step of forming a first wiring plane comprises forming a plurality of generally parallel electrically conductive strips.
Claim 6
Independent Claim
32 words
The method of any preceding claim wherein the step of forming a first wiring plane comprises forming at predetermined locations along each of the conductors interconnection links(14)that are in electrical circuit therewith.
Claim 7
Independent Claim
25 words
The method of any preceding claim wherein the step of forming a second wiring plane comprises forming a plurality of generally parallel electrically conductive strips.
Claim 8
Dependent Claim
36 words
The method of Claim 5 wherein the step of forming a second wiring plane comprises forming a plurality of electrically conductive strips that are electrically connected to the interconnection links formed with the first wiring plane.
Claim 9
Independent Claim
34 words
The method of any preceding claim wherein the step of forming a second wiring plane comprises forming multiple conductors that are angularly oriented with respect to the multiple conductors of the first wiring plane.
Claim 10
Dependent Claim
29 words
The method of Claim 1 wherein the step of forming a second wiring plane comprises electrically connecting the first and second wiring plane conductors proximate selected intersections between them.
Claim 11
Dependent Claim
31 words
The method of Claim 5 or 7 wherein the step of modifying said connections comprises electrically disconnecting said first and second wiring planes by opening the circuit at an interconnection link.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.