Process for the manufacture of substrates to interconnect electronic components and articles made by said process

Claim 1

A process for making substrates for mounting and interconnecting high density components comprising a substrate core,a printed circuit conductor pattern and wire scribed conductors, characterized in that it comprises the steps of - forming on said substrate core at least a first and a second printed circuit pattern electrically insulated from each other; - forming at least one cavity in predetermined locations penetrating said second pattern and substantially ex­posing said first pattern; - providing interfacing means between the said circuit patterns for establishing electrical conduct between respective conductors of the first and second pattern; - applying and affixing filaments over said printed circuit patterns, said filaments comprising a conductive core, thus forming a wire scribed circuit pattern; - applying a substantially smooth, flat, planar coating over the surface provided with said wire scribed circuit pattern thus maintaining the position of the filaments and providing a surface suitable for mounting surface-­mounted components; - forming, at predetermined locations on said planar surface, at least one cavity penetrating said coating and substantially exposing the conductive core of a re­spective conductor filament while maintaining the inte­grity of said wire scribed pattern; and - providing conductive interfacing means between said core of said conductor filament and the external surface of said planar coating.