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EP0214408A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Solid-state image sensor

Assignee: Toshiba Corp
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Filing: 1986-07-15
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Granted: —
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Expires: 2006-07-15
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Abstract

Abstract In a solid-state image sensor, a semiconductor structure having storage sections (2) and a transfer section (3) is formed in a substrate (1) and an insulating film (6,8) is formed on the substrate (1). Charge transfer electrodes (5) are buried in the insulating film (6, 8) above the transfer section (3) and pixel electrodes (11) are formed on the insulating film (6, 8) and are electrically connected to the storage sections (2) through electrodes (7), respectively. A photoconductive film (15) for converting incident light rays to incident light rays to electrical charges is formed on the insulating film (6,8), a barrier layer formed on the film (15) and a transparent electrode is formed on the barrier layer. Electrodes (8) and semiconductor layers (10) are buried in the insulating film (6, 8) such that each of the semiconductor layers (10) is partly contacted to the photoconductive film (15), thereby a diode structure is formed by the photoconductive film (15) and the semiconductor layer (10).

Inventors

  • 👤 Kensaku C/O Patent Division Yano
  • 👤 Takao C/O Patent Division Kon
  • 👤 Masayuki C/O Patent Division Kakegawa

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 14:04
CPC Classifications
H; H10; H10F; H10F39/00; H10F39/10; H10F39/12; H10F39/191

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 280 words
A solid-state image sensor comprising: a photoconductive film (15) for converting incident light rays to electrical charges; a semiconductor substrate (1) having storage sections (2) corresponding to pixels for storing charges and a transfer section (3) for transferring the charges from the storage sections in the form of output image signals; first electrodes (5) each having one end connected to the corresponding storage section (2) and insulated from the transfer section (3), said first electrodes (5) being arranged at predetermined intervals and extending above a semiconductor substrate (1); an insulating film (6, 8) formed on the first electrodes (7) and having a flat surface; second electrodes (11) formed on the flat surface of the first insulating film (6, 8), arranged at predetermined intervals and electrically connected to the first electrodes (5), said photoconductive film (15) being formed on these second electrodes (11); and a barrier layer formed on the photoconductive film (15), forming a barrier protecting the photoconductive film (15); a transparent third electrode (16) formed on the barrier layer; characterized by further comprising: fourth electrodes (9) formed on the first insulating film (6, 8), electrically connected to one another and electrically insulated from the second electrodes (12), each of fourth electrodes (9) having a peripheral region facing the adjacent second electrodes (12); and semiconductor layer (10) formed on the fourth electrodes (9) for preventing one of electrons and holes from passing through the semiconductor layer (10) from the fourth electrode (9) to the photoconductive film (15), allowing the one to pass through the semiconductor layer (10) from the photoconductive film (15) to the fourth electrode (9), said semiconductor layer (10) and said photoconductive film (15) forming a diode structure.
Claim 2
Dependent Claim 280 words
A solid-state image sensor comprising: a photoconductive film (15) for converting incident light rays to electrical charges; a semiconductor substrate (1) having storage sections (2) corresponding to pixels for storing charges and a transfer section (3) for transferring the charges from the storage sections in the form of output image signals; first electrodes (5) each having one end connected to the corresponding storage section (2) and insulated from the transfer section (3), said first electrodes (5) being arranged at predetermined intervals and extending above a semiconductor substrate (1); an insulating film (6, 8) formed on the first electrodes (7) and having a flat surface; second electrodes (11) formed on the flat surface of the first insulating film (6, 8), arranged at predetermined intervals and electrically connected to the first electrodes (5), said photoconductive film (15) being formed on these second electrodes (11); and a barrier layer formed on the photoconductive film (15), forming a barrier protecting the photoconductive film (15); a transparent third electrode (16) formed on the barrier layer; characterized by further comprising: fourth electrodes (9) formed on the first insulating film (6, 8), electrically connected to one another and electrically insulated from the second electrodes (12), each of fourth electrodes (9) having a peripheral region facing the adjacent second electrodes (12); and semiconductor layer (10) formed on the fourth electrodes (9) for preventing one of electrons and holes from passing through the semiconductor layer (10) from the fourth electrode (9) to the photoconductive film (15), allowing the one to pass through the semiconductor layer (10) from the photoconductive film (15) to the fourth electrode (9), said semiconductor layer (10) and said photoconductive film (15) forming a diode structure.
Claim 3
Dependent Claim 27 words
A solid-state image sensor according to claim 1, characterized in that said photoconductive film (15) and said semiconductor layer (10) are made of the same semiconductor material.
Claim 4
Dependent Claim 24 words
A solid-state image sensor according to claim 1, characterized in that said photoconductive film (15) and said semiconductor layer (10) have different conductivity types.
Claim 5
Dependent Claim 43 words
A solid-state image sensor according to claim 1, characterized in that said fourth electrodes (9) and said semiconductor layer (10) are partly embedded in said insulating film (8), and said semiconductor layer (10) has a portion directly connected to said photoconductive film (15).
Claim 6
Dependent Claim 77 words
5 . A solid-state image sensor according to claim 1, characterized in that said insulating film (6, 8, 20) comprises first and second insulating layers (6, 8, 20) formed one upon the other, each of said second electrodes (11) is formed on the first insulating layer (6, 8) and has a peripheral region embedded in the second insulating layer (20), and said fourth electrode (9) and said semiconductor layers (10) are formed on the second insulating layer.
Claim 7
Dependent Claim 26 words
A solid-state image sensor according to claim 1, characterized by further comprising a voltage source (13) for applying a drive voltage to said fourth electrodes (9).
Claim 8
Dependent Claim 27 words
A solid-state image sensor according to claim 1, characterized in that said semiconductor layer (10) and said photoconductive film (15) are made of a hydrogenated amorphous silicon.

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