EP0212764A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
High density, controlled impedance connector
Assignee: Criton Technologies Partn Comp Of Criton Corp Bsb Diversified Co Inc Royal Zenith Corp D/b/a Viking Connectors Co
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Filing: 1986-01-17
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Granted: —
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Expires: 2006-01-17
Abstract
Abstract A high density electrical connector is shown in which discrete dielectric wafers mount several contact elements within grooves on a first surface of the wafer while mounting a single ground plane within a recess on a second surface. This configuration, when the wafers are stacked side-by-side, forms the contacts in a stripline connection in which the impedance of each contact may be controlled. The wafers may be inserted into slots within a housing to form a high density connector for joining a daughter board to a mother board.
Inventors
- 👤 Amir-Akbar Sadigh-Behzadi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-23 12:09
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/70; H01R12/71; H01R12/72; H01R12/721; H01R13/00; H01R13/648; H01R13/658; H01R13/6581; H01R13/6585; H01R13/6586; H01R13/6587
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
85 words
A high density electrical connector with controlled impedance, comprising: a plurality of discrete insulated wafers; a plurality of first conductive elements for carrying electrical signals protectively mounted by each wafer; a single, second conductive element for connection to an electrical ground mounted by each wafer; said plurality of discrete wafers mounted in a stack wherein each single, second conductive element mounted by each wafer is mounted on each side of said plurality of first conductive elements to form stripline connections in a high density stack.
Claim 2
Dependent Claim
85 words
A high density electrical connector with controlled impedance, comprising: a plurality of discrete insulated wafers; a plurality of first conductive elements for carrying electrical signals protectively mounted by each wafer; a single, second conductive element for connection to an electrical ground mounted by each wafer; said plurality of discrete wafers mounted in a stack wherein each single, second conductive element mounted by each wafer is mounted on each side of said plurality of first conductive elements to form stripline connections in a high density stack.
Claim 3
Dependent Claim
39 words
A high density electrical connector as claimed in Claim 1, additionally comprising: said wafers are dielectric; said plurality of first conductive elements are mounted with each wafer; and said single, second conductive element is mounted adjacent to each wafer.
Claim 4
Dependent Claim
52 words
A high density electrical connector, as claimed in Claim 1, additionally comprising: said wafers are dielectric, each having a first and second side; said plurality of first conductive elements are mounted upon said first side of said wafers; said single second conductive element is mounted upon said second side of said wafers.
Claim 5
Dependent Claim
47 words
A high density electrical connector, as claimed in Claim 3, additionally comprising: said wafers having a plurality of grooves in said first side for mounting said first conductive elements therein; and said wafers having a recess in said second side for mounting said second conductive element therein.
Claim 6
Dependent Claim
42 words
A high density electrical connector, as claimed in Claim 1, additionally comprising: a first insulated housing having a plurality of slots therein for receipt of said wafers and said first and second conductive elements within each slot to form an elongated stack.
Claim 7
Dependent Claim
46 words
A high density electrical connector, as claimed in Claim 1, additionally comprising: a second housing having an elongated opening therein for receipt of said first insulated housing; and said second housing having means for mounting a first printed circuit board against a second printed circuit board.
Claim 8
Dependent Claim
28 words
A high density electrical connector, as claimed in Claim 6, wherein: said second housing mounts said first and second printed circuit boards at ninety degrees to each others.
Claim 9
Dependent Claim
27 words
A high density electrical connector, as claimed in Claim 6 wherein: said second housing mounts said first and second printed circuit boards in parallel to each other.
Claim 10
Dependent Claim
32 words
A high density electrical connector, as claimed in Claim 6 wherein: said second housing mounts said first and second printed circuit boards in parallel and in the same plane with each other.
Claim 11
Dependent Claim
31 words
A high density electrical connector, as claimed in Claim 1, additionally comprising: shaft means passing through said wafers for retaining said wafers and first and second conductive elements in said stack.
Claim 12
Dependent Claim
60 words
A high density electrical connector, as claimed in Claim 1, additionally comprising: first and second printed circuit boards having conductive pads thereon; said first and second conductive elements each having spring means for engaging said conductive pads; mounting bracket means; spacer means; said stack of wafers and first and second conductive elements including said mounting bracket means and spacer means.
Claim 13
Dependent Claim
74 words
A high density electrical connector, as claimed in Claim 11, wherein: said stack includes, in order, a mounting bracket means, a spacer means, a selected number of second conductive elements alternately stacked with a selected number of wafers having said first conductive elements mounted therein, there being one more second conductive element than said wafers in said stack, followed by a mounting bracket means; and shaft means for retaining said stack in said order.
Claim 14
Dependent Claim
40 words
A high density electrical connector, as claimed in Claim 12, wherein: said mounting breacket means mount said first and second printed circuit boards at a desired angle to one another with said spring means in engagement with said conductive pads.
Claim 15
Dependent Claim
63 words
A high density electrical connector, as claimed in Claim 1, additionally comprising: first and second printed circuit boards having conductive pads thereon; said first and second conductive elements each having spring means for engaging said conductive pads; said spring means on said first conductive elements being narrower than said spring means on said second conductive elements to reduce crosstalk between said first elements.
References Cited (Backward Citations)
No citation records indexed.
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