EP0211412A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Planar magnetron sputtering apparatus and its magnetic source
Assignee: Fujitsu Ltd
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Filing: 1986-07-31
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Granted: —
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Expires: 2006-07-31
Abstract
Abstract A planar magnetron sputtering apparatus having a magnetic source (10; 50) which is rotated eccentrically around anaxis (11) of a target (13) and has a particular arrangement (10; 50) or a plurality of permanent magnets (30, 31; 41; 51, 52) to form a magnetic field. Using this particular arrangement of permanent magnets (30, 31; 41; 51, 52), the target surface is exposed to a plasma (33; 55; 67; 71-80, 71'-80') for the same period of time, and this increases the uniformity of the target erosion and deposits the sputtering material uniformly on a substrate (16), as a result, an increase of the lifetime of the target (13) can be expected.
Inventors
- 👤 Masafumi Suzuki
- 👤 Hidenobu Shirai
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 23:15
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/34; H01J37/3411; H01J37/3461; H01J37/345; H01J37/3455; C; C23; C23C; C23C14/00; C23C14/22; C23C14/34; C23C14/3407; C23C14/35; H01J37/3402; H01J37/3405; H01J37/3408
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
216 words
A planar magnetron sputtering apparatus utilizing a plasma formed by electromagnetic field and comprising: an evacuable chamber (12) having means (22) for introducing an inert gas and a means (17) for holding a substrate (16) to be deposited; a planar target (13) within said chamber (12), the front surface of said target (13) faces in parallel with said substrate (16); means (23) for applying an electric field normal to the front surface of said target (13); magnetic source means (10;50) for generating a magnetic field over the surface of said target (13), wherein said magnetic source is eccentrically rotated around the center axis (11) of said target (13) and the plane of rotation is being maintained in parallel with said target (13) and said magnetic source (10, 50) is composed of a plurality of permanent magnets (30, 31; 41; 51, 52) arranged on a basis (56), and is positioned behind said target (13); and said permanent magnets (30, 31; 41; 51, 52) are so arranged that said plasma region (33; 55; 67; 71-80, 71' - 80') formed over the surface of said target (13) forms a closed contour and the length of said plasma region measured along the direction of a rotation of said magnetic source (10; 50) is proportional to the radius of the rotation.
Claim 2
Dependent Claim
216 words
A planar magnetron sputtering apparatus utilizing a plasma formed by electromagnetic field and comprising: an evacuable chamber (12) having means (22) for introducing an inert gas and a means (17) for holding a substrate (16) to be deposited; a planar target (13) within said chamber (12), the front surface of said target (13) faces in parallel with said substrate (16); means (23) for applying an electric field normal to the front surface of said target (13); magnetic source means (10;50) for generating a magnetic field over the surface of said target (13), wherein said magnetic source is eccentrically rotated around the center axis (11) of said target (13) and the plane of rotation is being maintained in parallel with said target (13) and said magnetic source (10, 50) is composed of a plurality of permanent magnets (30, 31; 41; 51, 52) arranged on a basis (56), and is positioned behind said target (13); and said permanent magnets (30, 31; 41; 51, 52) are so arranged that said plasma region (33; 55; 67; 71-80, 71' - 80') formed over the surface of said target (13) forms a closed contour and the length of said plasma region measured along the direction of a rotation of said magnetic source (10; 50) is proportional to the radius of the rotation.
Claim 3
Dependent Claim
24 words
A planar magnetron sputtering apparatus according to claim 1, wherein said permanent magnets (30, 31; 41; 51, 52) are arranged in a symmetrical pattern.
Claim 4
Dependent Claim
55 words
A planar magnetron sputtering apparatus according to claim 2, wherein said arrangement of the permanent magnets (30, 31; 41; 51, 52) is symmetrical with respect to the line (641; X-X) passing through the center of rotation, and the outermost and innermost points (a, i) of said closed contour are positioned on said line (641; X-X).
Claim 5
Dependent Claim
22 words
A planar magnetron sputtering apparatus according to claim 3, wherein said plasma region (67) forms said closed contour having a heart-shaped pattern.
Claim 6
Dependent Claim
65 words
A planar magnetron sputtering apparatus according to claim 1, wherein each said permanent magnet comprises two pieces of rectangular bar magnets (51, 52), each bar magnet (51, 52) is magnetized in the direction of axis, and said bar magnets (51, 52) have the same cross section and are so arranged on a yoke (53) that the direction of each cross section crosses with each other.
Claim 7
Dependent Claim
34 words
A planar magnetron sputtering apparatus according to claim 1, wherein each said permanent magnet consists of a single magnet (41) having axial polarization parallel with the basis (56), and a supporting part (42) thereof.
Claim 8
Dependent Claim
37 words
A planar magnetron sputtering apparatus according to claim 1, wherein said magnetic source is encased in a cooling jacket (26), which is fixed to a backing plate (14) holding said target on anopposite side, and is water-cooled.
References Cited (Backward Citations)
No citation records indexed.
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