EP0211180A2
Expired / Lapsed
EP
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Method for manufacture of multilayer circuit board
Assignee: Shipley Co Inc
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Filing: 1986-06-06
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Granted: —
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Expires: 2006-06-06
Abstract
Abstract The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and photoimaging of permanent dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using photoimaging techniques.
Inventors
- 👤 Charles R. Shipley, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 17:43
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/465; H05K3/10; H05K3/20; H05K3/205; H05K3/4661; H05K3/4682; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0565; H05K2203/14; H05K2203/1407; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/18; H05K3/181; H05K3/182; H05K3/184
Claims Analysis
Total Claims: 68
Claim 1
Independent Claim
110 words
A process for the formation of a circuit board having two or more layers of circuitry, said process comprising the steps of applying a permanent dielectric coating over a first circuit layer, said coating having photoformed recesses defining interconnections between circuit layers, applying a permanent mask layer over said dielectric coating, said mask having recesses defining conductor lines and interconnections, and selectively depositing metal within the recesses defining conductor lines and interconnections to render the same conductive, whereby a second curcuit layer is formed over the photo dielectric coating layer and the conductors of said first and second circuit layers are in electrical communication with each other through conductive interconnections.
Claim 2
Dependent Claim
110 words
A process for the formation of a circuit board having two or more layers of circuitry, said process comprising the steps of applying a permanent dielectric coating over a first circuit layer, said coating having photoformed recesses defining interconnections between circuit layers, applying a permanent mask layer over said dielectric coating, said mask having recesses defining conductor lines and interconnections, and selectively depositing metal within the recesses defining conductor lines and interconnections to render the same conductive, whereby a second curcuit layer is formed over the photo dielectric coating layer and the conductors of said first and second circuit layers are in electrical communication with each other through conductive interconnections.
Claim 3
Dependent Claim
13 words
The process of claim 1 where said process is performed on a carrier.
Claim 4
Dependent Claim
22 words
The process of claim 2 where the carrier is said first circuit layer which becomes a permanent part of the circuit board.
Claim 5
Dependent Claim
15 words
The process of claim 1 where the selective deposition of metal is electrolessly deposited copper.
Claim 6
Dependent Claim
15 words
The process of claim 1 where the selective deposition of metal is electrolytically deposited copper.
Claim 7
Dependent Claim
54 words
The process of claim 1 where at least one of said circuit layers is formed by applying a permanent photo mask layer over a surface, said photo mask having photoformed openings therein defining conductor lines and interconnection openings, and selectively depositing metal within said defined conductor lines and openings to render the same conductive.
Claim 8
Dependent Claim
16 words
The process of claim 6 where the openings in said photo mask contain the deposited metal.
Claim 9
Dependent Claim
30 words
The process of claim 6 where both circuits are formed by applying a permanent photo mask over a surface and selectively depositing metal within openings to render the same conductive.
Claim 10
Dependent Claim
27 words
The process of claim 6 including the steps of sequentially repeating the process of forming interconnection and circuit layers until the desired number of layers are formed.
Claim 11
Dependent Claim
29 words
The process of claim 9 including the step of separating multiple layers of circuits and interconnections with an innerlayer material having a ground and/or power plane on its surfaces.
Claim 12
Dependent Claim
31 words
The process of claim 9 including the step of laminating one or more stacks of multiple layers of circuits and interconnections to additional stacks of multiple layers of circuits and interconnections.
Claim 13
Dependent Claim
15 words
The process of claim 11 where the stacks are laminated using an uncured, liquid resin.
Claim 14
Dependent Claim
36 words
The process of claim 6 where the permanent dielectric layer and the permanent photo mask layer are photoimagable and openings are photoformed by exposure to activating radiation in an image pattern and developing the imaged coating.
Claim 15
Dependent Claim
44 words
The process of claim 6 where selective metalization is accomplished by catalyzing with an electroless plating catalyst, masking catalyzed areas where plating is not desired with a plating mask and plating electroless metal over the electroless plating catalyst not covered with the plating mask.
Claim 16
Dependent Claim
13 words
The process of claim 14 where the plating mask is the photo mask.
Claim 17
Dependent Claim
14 words
The process of claim 14 where the electroless plating catalyst is a palladium catalyst.
Claim 18
Dependent Claim
31 words
The process of claim 15 where the electroless metal is plated to a thickness essentially equivalent to the thickness of the mask whereby the surface of the circuit is essentially planar.
Claim 19
Dependent Claim
62 words
The process of claim 6 where selective metalization is accomplished by applying a sacrificial coating over a layer of photoformed openings, said sacrificial coating having openings corresponding to the openings in said layer, catalyzing the sacrificial coating and the openings with an electroless plating catalyst, removing the sacrificial coating and plating electroless metal over the electroless plating catalyst within the photoformed openings.
Claim 20
Dependent Claim
14 words
The process of claim 18 where the electroless plating catalyst is a palladium catalyst.
Claim 21
Dependent Claim
21 words
The process of claim 17 where the layer is selected from the group of the photo mask and the photo dielectric.
Claim 22
Dependent Claim
15 words
The process of claim 20 where the openings in said layer contain the deposited metal.
Claim 23
Dependent Claim
29 words
The process of claim 20 where the electroless metal is plated to a thickness essentially the same as the thickness of the layer whereby the surface is essentially planar.
Claim 24
Dependent Claim
44 words
The process of claim 6 including the step of admixing a plating catalyst with a layer having photoformed openings, coating said layer with a plating mask where plating is not desired and plating electroless metal over the layer not covered with the plating mask.
Claim 25
Dependent Claim
35 words
The process of claim 6 where selective metalization is accomplished by catalyzing with an electroless plating catalyst, stripping the catalyst where plating is not desired and plating electroless metal over the remaining electroless plating catalyst
Claim 26
Dependent Claim
14 words
25 . The process of claim 2 where the carrier is a conductive platen.
Claim 27
Dependent Claim
25 words
The process of claim 25 where selective metalization is accomplished by electrolytic deposition with the platen serving as a source of current for said deposition.
Claim 28
Dependent Claim
29 words
The process of claim 6 where selective metalization is accomplished by electroless deposition of metal over a copper that has been activated with a solution of dissolved palladium ions.
Claim 29
Dependent Claim
15 words
The process of claim 6 where interconnections have a maximum width not exceeding 10 mils.
Claim 30
Dependent Claim
23 words
The process of claim 6 where conductor lines of a circuit within a photoformed opening have a maximum width not exceeding 5 mils.
Claim 31
Dependent Claim
23 words
The process of claim 6 where conductor lines of a circuit within a photoformed opening have a maximum width not exceeding 2 mils.
Claim 32
Dependent Claim
13 words
The process of claim 6 where the interconnects lie within a conductor line.
Claim 33
Dependent Claim
13 words
The process of claim 6 where the interconnections are pegs of solid copper.
Claim 34
Dependent Claim
11 words
The process of claim 6 where the interconnections have plated walls.
Claim 35
Dependent Claim
16 words
The process of claim 6 where the carrier is a permanent part of the circuit board.
Claim 36
Dependent Claim
13 words
The process of claim 34 where the carrier is a molded circuit board.
Claim 37
Dependent Claim
12 words
The process of claim 34 where the carrier is a hybrid circuit.
Claim 38
Dependent Claim
12 words
The process of claim 34 where the carrier is an innerlayer material.
Claim 39
Dependent Claim
25 words
The process of claim 37 where the carrier is an innerlayer material having a power or ground plane over one or both of its surfaces.
Claim 40
Dependent Claim
16 words
The process of claim 6 where the process is applied to both sides of a carrier.
Claim 41
Dependent Claim
19 words
The process of claim 39 where the circuits on each side of the carrier are connected by conductive holes.
Claim 42
Dependent Claim
35 words
A multilayer circuit board having at least two layers of circuitry where the circuits are separated from each other by a permanent photo dielectric layer having photoformed metalized openings providing electrical communication between said circuits.
Claim 43
Dependent Claim
35 words
A multilayer circuit board having at least two layers of circuitry where the circuits are separated from each other by a permanent photo dielectric layer having photoformed metalized openings providing electrical communication between said circuits.
Claim 44
Dependent Claim
24 words
The board of claim 41 where one of the circuit layers is a carrier that is a permanent part of the multilayer circuit board.
Claim 45
Dependent Claim
16 words
The board of claim 41 where the metal of the metalized openings is electrolessly deposited copper.
Claim 46
Dependent Claim
16 words
The board of claim 43 where the metal of the metalized openings is electrolytically deposited copper.
Claim 47
Dependent Claim
33 words
The board of claim 41 where at least one of said circuits comprises a photo mask having photoformed openings therein defining conductor lines and interconnection openings having metal deposited within said photoformed openings.
Claim 48
Dependent Claim
16 words
The board of claim 45 where the openings in said photo mask contain the deposited metal.
Claim 49
Dependent Claim
40 words
The board of claim 41 comprising multiple layers of circuits separated from each other by multiple layers of a permanent photo dielectric layer having photoformed metalized openings providing electrical communication between circuits on one or both sides of a carrier.
Claim 50
Dependent Claim
20 words
The board of claim 47 including innerlayers having a ground and/or power plane on its surfaces placed between circuit layers.
Claim 51
Dependent Claim
12 words
A multilayer stack comprising boards of claim 48 laminated to each other.
Claim 52
Dependent Claim
45 words
The multilayer stack of claim 49 where each board is a composite of four or more layers comprising a carrier that is a two-sided innerlayer with power and ground planes on its surfaces and having at least two layers of circuitry connected through conductive interconnections.
Claim 53
Dependent Claim
67 words
The multilayer stack of claim 49 where each board is a composite of six or more layers comprising a carrier that is a two sided innerlayer with power and ground planes on its surfaces and having at least two layers of circuitry connected through conductive interconnections on each surface, said circuits on each side of the innerlayer being in electrical communication with each other through plated interconnections.
Claim 54
Dependent Claim
30 words
The board of claim 42 where the deposited metal is of a thickness essentially equivalent to the thickness of the mask whereby the surface of the circuit is essentially planar.
Claim 55
Dependent Claim
15 words
The board of claim 41 where interconnections have a maximum width not exceeding 10 mils.
Claim 56
Dependent Claim
13 words
The board of claim 53 where the width does not exceed 2 mils.
Claim 57
Dependent Claim
30 words
The board of claim 45 where conductor lines of a circuit within a photoformed opening have a maximum width not exceeding the conductor line in which it is in contact.
Claim 58
Dependent Claim
13 words
The board of claim 41 where the interconnections are pegs of solid copper.
Claim 59
Dependent Claim
16 words
The board of claim 41 where the carrier is a permanent part of the circuit board.
Claim 60
Dependent Claim
15 words
The board of claim 41 having circuits and interconnections on both sides of the carrier.
Claim 61
Dependent Claim
19 words
The board of claim 58 where the circuits on each side of the carrier are connected by conductive holes.
Claim 62
Dependent Claim
10 words
The board of claim 41 where the openings are circular.
Claim 63
Dependent Claim
10 words
The board of claim 41 where the openings are non-circular.
Claim 64
Dependent Claim
19 words
The board of claim 41 where there are greater than 100 lines and spaces per linear inch of board.
Claim 65
Dependent Claim
17 words
The board of claim 62 where there are greater than 400 lines and spaces per linear inch.
Claim 66
Dependent Claim
25 words
An electrical assembly comprising at least two conductor lines in electrical communication with each other through a metallic connection contained within a photo dielectric material.
Claim 67
Dependent Claim
25 words
An electrical assembly comprising at least two conductor lines in electrical communication with each other through a metallic connection contained within a photo dielectric material.
Claim 68
Dependent Claim
13 words
The assembly of claim 64 where the metallic connection is a solid peg.
References Cited (Backward Citations)
No citation records indexed.
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