EP0209391A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Resin composition and circuit board moulded from the same
Assignee: Sumitomo Chemical Co Ltd
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Filing: 1986-07-17
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Granted: —
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Expires: 2006-07-17
Abstract
Abstract A resin composition comprising 5-60% by weight of fibre obtained by melt spinning an aromatic polyester which exhibits anisotropy when melted and 40-95% by weight of a thermoplastic resin can provide a circuit board which suffers a lineal dimensional change no more than 1% when immersed in a soldering alloy bath at 260°C for 5 seconds and which is also light in weight, nonhygroscopic and has excellent electrical properties.
Inventors
- 👤 Hiroaki Sugimoto
- 👤 Kazuo Hayatsu
- 👤 Kazuo Hieda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 17:08
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0366; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/0141; H05K2201/0145; H05K2201/02; H05K2201/0275; H05K2201/0278
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
62 words
A resin composition comprising from 5 to 60% by weight of a fibre obtained by melt-spinning an aromatic polyester exhibiting anisotropy when melted and from 40 to 95% by weight of a thermopoastic resin, wherein a product moulded from said composition suffers a lineal dimensional change no greater than 1% when immersed in a soldering alloy bath at 260°C for 5 seconds.
Claim 2
Dependent Claim
62 words
A resin composition comprising from 5 to 60% by weight of a fibre obtained by melt-spinning an aromatic polyester exhibiting anisotropy when melted and from 40 to 95% by weight of a thermopoastic resin, wherein a product moulded from said composition suffers a lineal dimensional change no greater than 1% when immersed in a soldering alloy bath at 260°C for 5 seconds.
Claim 3
Dependent Claim
26 words
A resin composition according to Claim 1, wherein the thermoplastic resin is at least one of polyphenylene sulphide, polyether sulphone, polyether imide and aromatic polyether ketone.
Claim 4
Dependent Claim
16 words
A resin composition according to Claim 1, wherein the thermoplastic resin is an aromatic polyether ketone.
Claim 5
Dependent Claim
19 words
A circuit board produced by moulding a resin composition as claimed in any one of Claims 1 to 3.
References Cited (Backward Citations)
No citation records indexed.
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