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EP0207619B1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Semiconductor memory device

Assignee: Fujitsu Ltd
•
Filing: 1986-05-23
•
Granted: 1991-08-28
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Expires: 2006-05-23
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Abstract

No abstract record available.

Inventors

  • 👤 Yoshihiro Takemae

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 08:35
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/30; H10B12/37

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 206 words
A semiconductor memory device comprising: a peripheral circuit composed of a field effect transistor (34d, 34s, 36) formed in a semiconductor substrate (31) of a first conductivity type and a memory cell composed of a field effect transistor (4s, 4c, 4d) and a capacitor (3b, 4, 32), formed in a well region (32) of second conductivity type, opposite the first conductivity type, in a surface portion of the semiconductor substrate (31); an insulating layer having a thin portion (3b) and a thick portion (41) formed on the well region (32); a semiconductor layer (4) formed on the insulating layer (41, 42); and the memory cell field effect transistor (4s, 4c, 4d) being formed in the semiconductor layer (4); and, the memory cell capacitor having its dielectric formed by the thin portion (3b) of the insulating layer, an upper electrode of the second conductivity type formed by a portion of the semiconductor layer (4), and a lower electrode formed by the well portion (32); the well portion being arranged to be biased with a voltage at an intermediate level between a first storage voltage and a second storage voltage applied to the semiconductor layer, thereby reducing the field strength across the dielectric of the memory cell capacitor.
Claim 2
Dependent Claim 47 words
A semiconductor memory device according to claim 1, wherein the field effect transistor comprises a source region (4s) and a drain region (4d) formed in the semiconductor layer (4) and a gate electrode (6) formed on a gate insulating layer (5) formed on the semiconductor layer (4).
Claim 3
Dependent Claim 18 words
A semiconductor memory device according to claim 1 to 2, wherein the capacitor is a trench type capacitor.
Claim 4
Dependent Claim 44 words
A semiconductor memory device according to claim 3, wherein the semiconductor layer is composed of a polycrystalline silicon portion (21) filling the trench and a single crystalline silicon portion (4) formed on the polycrystalline silicon portion (21) and on the insulating layer (3a)(Figure 2).
Claim 5
Dependent Claim 20 words
A semiconductor memory device according to claim 1 or 2, wherein the semiconductor layer is formed entirely of poly-crystalline silicon.
Claim 6
Dependent Claim 24 words
A semiconductor memory device according to any one of claims 1 or 2, wherein the semiconductor layer is formed entirely of single crystal silicon.
Claim 7
Dependent Claim 29 words
A semiconductor memory device according to any one of the preceding claims, wherein the first storage voltage is a supply voltage and the second storage voltage is ground voltage.
Claim 8
Dependent Claim 18 words
A semiconductor memory device according to claim 7, wherein the intermediate level voltage is half the supply voltage.

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