EP0207188A2
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EP
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Resin composition for solder resist ink
Assignee: Asahi Chemical Research Laboratory Co Ltd
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Filing: 1985-09-06
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Granted: —
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Expires: 2005-09-06
Abstract
Abstract A resin composition for use in a solder resist ink. The composition consists essentially of (A) an epoxy vinyl ester resin solution obtained by dissolving (A-a) an epoxy vinyl ester resin obtained by the reaction of 1.0 chemical equivalent of a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin with 0.4-to 0.85 chemical equivalent of an unsaturated monobasic acid In (A-b) an organic solvent and/or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting of trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds, (B) a photopolymerization initiator, and (C) an amine-type curing agent.
Inventors
- 👤 Sato Yoneji
- 👤 Hoshino Masato
- 👤 Kitazawa Seiichi
- 👤 Yasuda Tadashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-10 02:25
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; B; B23; B23K; B23K35/00; B23K35/22; B23K35/224; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/285; H05K3/287; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
106 words
A resin composition for use in a solder resist ink, said composition comprising as essential ingredients (A) an epoxy vinyl ester resin solution obtained by dissolving (A-a) an epoxy vinyl ester resin obtained by reacting 1.0 chemical equivalent of a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin with 0.40 to 0.85 chemical equivalent of an unsaturated monobasic acid in (A-b) an organic solvent and/or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting of trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds, (B) a photopolymerization initiator, and (C) an amine-type curing agent.
Claim 2
Dependent Claim
106 words
A resin composition for use in a solder resist ink, said composition comprising as essential ingredients (A) an epoxy vinyl ester resin solution obtained by dissolving (A-a) an epoxy vinyl ester resin obtained by reacting 1.0 chemical equivalent of a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin with 0.40 to 0.85 chemical equivalent of an unsaturated monobasic acid in (A-b) an organic solvent and/or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting of trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds, (B) a photopolymerization initiator, and (C) an amine-type curing agent.
Claim 3
Dependent Claim
182 words
A resin composition according to claim 1 comprising as essential'ingredients (A) 100 parts by weight of an epoxy vinyl ester solution obtained by dissolving (A-a) an epoxy vinyl ester resin obtained by reacting 1.0 chemical equivalent of a phenol novolak-type epoxy resin and/or a cresol novolak-type epoxy resin with 0.40 to 0.85 chemical equivalent of an unsaturated monobasic acid in (A-b) an organic solvent and/or (A-c) at least one photopolymerizable polyfunctional vinyl monomer selected from the group consisting of trifunctional or higher polyoxyalkylene glycol poly(meth)acrylates, poly(meth)acrylates of polyoxyalkyl isocyanurates and poly(meth)acrylates of acetal compounds, (B) 0.1 to 20 parts by weight of a photopolymerization initiator, and (C) an amine-type curing agent in such a proportion that 0.4 to 1.5 equivalents of the amine-type curing agent (C) exists per 1.0 equivalent of the residual epoxy groups in the resin solution (A), provided that when the curing agent (C) is a tertiary amine or an imidazole, the proportion of the curing agent (C) is 0.1 to 30 parts by weight per 100 parts by weight of the solids content of the resin solution (A).
Claim 4
Dependent Claim
30 words
The composition of claim 1 or 2 wherein the phenol novolak-type epoxy resin is a resin obtained by reacting a phenol novolak resin obtained from phenol and formaldehyde with epichlorohydrin.
Claim 5
Dependent Claim
30 words
The composition of claim 1 or 2 wherein the cresol novolak-type epoxy resin is a resin obtained by reacting a cresol novolak resin obtained trom resol and formaldehyde with epichlorohydrin.
Claim 6
Dependent Claim
15 words
The composition of claim 1 or 2 wherein the unsaturated monobasic acid is acrylic acid.
Claim 7
Dependent Claim
15 words
The composition of claim 1 or 2 wherein the organic solvent (A-b) is butyl Cellosolve.
Claim 8
Dependent Claim
15 words
The composition of claim 1 or 2 wherein the polyoxyalkylene glycol poly(meth)acrylates are dipentaerythritol hexaacrylate.
Claim 9
Dependent Claim
16 words
The composition of claim 1 or 2 wherein the polymethacrylates of polyoxyalkyl isocyanurates are tris(acryloyloxyethyl) isocyanurate.
Claim 10
Dependent Claim
16 words
The resin of claim 1 or 2 wherein the poly-(meth)acrylates of acetal compounds are 2-(2-hydroxy-1,1-dimethylethyl)-5-hydroxymethyl-5-ethyl-1,3-dioxane diacrylate.
Claim 11
Dependent Claim
14 words
The composition of claim 1 or 2 wherein the photopolymerization initiator (B) is benzophenone.
Claim 12
Dependent Claim
16 words
ll. The composition of claim 1 or 2 wherein the amine-type curing agent (C) is dicyandiamide.
Claim 13
Dependent Claim
15 words
The composition of claim 1 or 2 wherein the amine-type curing agent (C) is 2-ethyl-4-methylimidazole.
References Cited (Backward Citations)
No citation records indexed.
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