Method to ensure the cooling of electronic components fixed on a multilayer for printed circuits and multilayer realized according to said method

Claim 1

1) A method to ensure the cooling of active or passive electronic components fixed on a multilayer for printed circuits, the multilayer including at least one metal layer interposed between insulating layers and, on the outer faces, a copper layer for said circuits, characterized by the steps of: a) - applying, prior to the matching of the layers of the multilayer, on at least one of the faces of the metal layer or of one of the metal layers, a special thin layer or film of insulating or conductive material; b) - creating, through, a mi-iling operation, seats or cavities for the insertion of the prismatic or cylindrical basic part of the electronic component and possible other seats for the insertion of heat-dissipating rods, the bottom of said seats being made up of the surface of said interposed metal layer, because of the removal, by means of the milling cutter, of the thin layer applied upon the step a); c) - forming through holes on the multilayer in the vicinity of said seats for the insertion of the component base and at close distance from the outside walls of the body of the component which is to be fixed in each seat; d) - covering, by means of a metallization layer, all the uncovered surfaces of the multilayer, including those of the said seats and those inside said through holes, such metallization realizing therefore the electrical and the heat transfer connection of all the surfaces covered therewith; e) - realizing -through .a photo-engraving operation, or in other way, on the face (s) of the multilayer, on the side wherein said seats are formed - some areas outlining the same seats for the fixing of the component by welding, as well as other areas for the connection of the component to the printed circuit by weldings, and also metal strips making up the leads of said circuitr; the thin layer or film applied upon the step a) being able to determine an electrical signal which causes the removal of the milling cutter - immediately after the taking away of the same thin layer, but, in practice, without indenting the metal layer of the multilayer - from the seat it has formed; and the component cooling being carried out by heat conduction along said metal layer or by dissipator means located outside the multilayer and in thermal conductivity connection with said metal layer interposed inside the multilayer.