Patent US2100152A successfully refreshed from Google Patents.
EP0206771A2
Expired / Lapsed
EP
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Packaged semiconductor device
Assignee: Toshiba Corp
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Filing: 1986-06-19
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Granted: —
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Expires: 2006-06-19
Abstract
Abstract A packaged semiconductor device, having a bed part (21 semiconductor chip (4) mounted on the bed part (21), leads (2) connected by bonding wires (6) to the internal terminals of the semiconductor chip (4), a heat sink (1) disposed under a back of the bed part (21) and with a gap of a prescribed distance between the heat sink (1) and the back of the bed part (21), and a molded layer which seals the semiconductor chip (4), bed part (21), bonding wires (6), ends of the leads (2), and the heat sink (1), characterized in that the molded layer comprises a first molded layer (3a) which seals to expose the back of the bed part (21), and a second molded layer (3b) formed to cover sides of the heat sink (1) and of the first molded layer (3a), and intermediate parts of the leads (2), and to fill the gap between the back of the bed part (21) and the heat sink (1).
Inventors
- 👤 Toshihiro Patent Division Kato
- 👤 Shijiro Patent Division Kojima
- 👤 Takao Patent Division Emoto
- 👤 Hiroshi Patent Division Matsumoto
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 14:25
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/411; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W90/00; H10W90/811; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
164 words
A packaged semiconductor device, having a bed part (21), semiconductor chip (4) mounted on said bed part (21), leads (2) connected by bonding wires (6) to the internal terminals of said semiconductor chip (4), a heat sink (1) disposed under a back of said bed part (21) and with a gap of a prescribed distance between said heat sink (1) and said back of said bed part (21), and a molded layer which seals said semiconductor chip (4), bed part (21), bonding wires (6), ends of said leads (2), and said heat sink (1), characterized in that said molded layer comprises a first molded layer (3a) which seals to expose said back of said bed part (21), and a second molded layer (3b) formed to cover sides of said heat sink (1) and of said first molded layer (3a), and intermediate parts of said leads (2), and to fill said gap between said back of said bed part (21) and said heat sink (1).
Claim 2
Dependent Claim
164 words
A packaged semiconductor device, having a bed part (21), semiconductor chip (4) mounted on said bed part (21), leads (2) connected by bonding wires (6) to the internal terminals of said semiconductor chip (4), a heat sink (1) disposed under a back of said bed part (21) and with a gap of a prescribed distance between said heat sink (1) and said back of said bed part (21), and a molded layer which seals said semiconductor chip (4), bed part (21), bonding wires (6), ends of said leads (2), and said heat sink (1), characterized in that said molded layer comprises a first molded layer (3a) which seals to expose said back of said bed part (21), and a second molded layer (3b) formed to cover sides of said heat sink (1) and of said first molded layer (3a), and intermediate parts of said leads (2), and to fill said gap between said back of said bed part (21) and said heat sink (1).
Claim 3
Dependent Claim
20 words
A packaged semiconductor device according to claim 1, wherein a part of said first molded layer (3a) is left unfilled.
Claim 4
Dependent Claim
15 words
A packaged semiconductor device according to claim 2, wherein said unfilled part is a notch.
Claim 5
Dependent Claim
15 words
A packaged semiconductor device according to claim 2, wherein said unfilled part is a through-hole.
Claim 6
Dependent Claim
22 words
A packaged semiconductor device according to claim 3, wherein said notch is provided on a periphery of said first molded layer (3a).
Claim 7
Dependent Claim
22 words
A packaged semiconductor device according to claim 1, wherein a recessed part is formed on the back of said bed part (21).
Claim 8
Dependent Claim
19 words
A packaged semiconductor device according to claim 1, wherein a recessed part is formed on said heat sink (1).
Claim 9
Dependent Claim
17 words
A packaged semiconductor device according to claim 6, wherein a plurality of said recessed parts are formed.
Claim 10
Dependent Claim
17 words
A packaged semiconductor device according to claim 7, wherein a plurality of said recessed parts are formed.
References Cited (Backward Citations)
No citation records indexed.
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