EP0197148A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Printed-circuit board for mounting electronic element and method of manufacture thereof
Assignee: Ibiden Co Ltd
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Filing: 1984-11-27
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Granted: —
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Expires: 2004-11-27
Abstract
Abstract A printed-circuit board containing a plastic material is formed with an opening for mounting an electronic element, the opening extending through the board in the vertical direction. The opening thereof on the reverse side of the board is closed by a metal plate whose periphery is bonded to the board surface by a bonding layer. A deposited film is formed integrally over the inner wall and the bottom surface of the opening in the board, and a deposited film is formed integrally over the reverse surface of the board and the reverse surface of the metal plate. It is therefore possible to dissipate through the metal plate the heat generated from the electronic element mounted on the bottom surface in the opening. In addition, it is possible to prevent by the deposited films the intrusion of moisture which conventionally enters the opening in the board through the plastic material and the bonding layer.
Inventors
- 👤 Katsumi Mabuchi
- 👤 Toshimi Komura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 05:24
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/021; H10; H10W; H10W40/00; H10W40/10; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H05K1/18; H05K1/182; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09845; H05K2201/09981; H05K2201/10; H05K2201/10227; H05K2201/10416; H05K2203/00; H05K2203/04; H05K2203/049; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/1064; Y10T428/00; Y10T428/23; Y10T428/239; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24331; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
177 words
In a printed wiring board for mounting electronic parts in which the board comprising a plastic material is formed with a through opening in the region where electronic parts are to be mounted, and a metal sheet is bonded to the rear of the board at least at its area around the end of said opening on the rear of said board, the end of said opening on the rear of said board being closed by said metal sheet, the improvement characterized in that: an integral coating film is formed by plating on the plastic material and an adhesive layer forming the inside wall of said opening and the opening bottom- forming face of the metal sheet closing the end of the opening on the rear side of said board, and an integral coating film is also formed by plating at least the area on the rear side of the board surrounding the area where said metal is bonded, the outer peripheral face of said adhesive layer, and the lateral side and underside surface of metal sheet.
Claim 2
Dependent Claim
177 words
In a printed wiring board for mounting electronic parts in which the board comprising a plastic material is formed with a through opening in the region where electronic parts are to be mounted, and a metal sheet is bonded to the rear of the board at least at its area around the end of said opening on the rear of said board, the end of said opening on the rear of said board being closed by said metal sheet, the improvement characterized in that: an integral coating film is formed by plating on the plastic material and an adhesive layer forming the inside wall of said opening and the opening bottom- forming face of the metal sheet closing the end of the opening on the rear side of said board, and an integral coating film is also formed by plating at least the area on the rear side of the board surrounding the area where said metal is bonded, the outer peripheral face of said adhesive layer, and the lateral side and underside surface of metal sheet.
Claim 3
Dependent Claim
58 words
A board according to Claim 1, wherein the area around the end of said opening on the rear side of the board is recessed so as to form a stepped portion constituting the bottom of the recess in said opening, and a metal sheet is bonded through an adhesive layer to said stepped portion formed by said recess.
Claim 4
Dependent Claim
44 words
3 . A board according to Claim 2, wherein a recessed clearance is formed between the inner peripheral face of said recess and the opposing outer peripheral face of the metal sheet bonded to the stepped portion in said recess through an adhesive layer.
Claim 5
Dependent Claim
53 words
A board according to Claim 3, wherein the metal sheet is positioned on the stepped portion in said recess so that the outer peripheral face of the metal sheet and the inner peripheral face of said recess contact each other at a number of sections and said recessed clearance maintains a predetermined spacing.
Claim 6
Dependent Claim
101 words
A process for producing a printed wiring board for mounting electronic parts comprising a sequence of the following steps (a) to (d): (a) forming a through opening in that region of a printed wiring board containing a plastic material where electronic parts are to be mounted; (b) bonding a metal sheet through an adhesive layer to the area around the end of said opening on the rear side of the board; (c) plating the external surface of the board includ= ' ing the metal sheet; and (d) forming a circuit in the usual way on the board manufactured through said steps.
Claim 7
Dependent Claim
101 words
A process for producing a printed wiring board for mounting electronic parts comprising a sequence of the following steps (a) to (d): (a) forming a through opening in that region of a printed wiring board containing a plastic material where electronic parts are to be mounted; (b) bonding a metal sheet through an adhesive layer to the area around the end of said opening on the rear side of the board; (c) plating the external surface of the board includ= ' ing the metal sheet; and (d) forming a circuit in the usual way on the board manufactured through said steps.
Claim 8
Dependent Claim
115 words
A process for producing a printed wiring board for mounting electronic parts comprising a sequence of the following steps: (a) forming a recession on the rear side of the specific region of a printed wiring board containing a plastic material where electronic parts are to be mounted; (b) bonding a metal sheet to the bottom of said recession through an adhesive layer; (c) forming an opening in said specific region on the front of said board so that said opening will reach at least said metal sheet; (d) plating the external surface of the board including said metal sheet; and (e) forming a circuit in the usual way on the board manufactured through said steps.
Claim 9
Dependent Claim
115 words
A process for producing a printed wiring board for mounting electronic parts comprising a sequence of the following steps: (a) forming a recession on the rear side of the specific region of a printed wiring board containing a plastic material where electronic parts are to be mounted; (b) bonding a metal sheet to the bottom of said recession through an adhesive layer; (c) forming an opening in said specific region on the front of said board so that said opening will reach at least said metal sheet; (d) plating the external surface of the board including said metal sheet; and (e) forming a circuit in the usual way on the board manufactured through said steps.
Claim 10
Dependent Claim
59 words
A process according to Claim 6, including step (b) in which a metal sheet is bonded to the bottom of said recession through an adhesive layer in such a manner that a recessed groove having a predetermined clearance will be formed between the outer peripheral face of said metal sheet and the opposing inner peripheral face of said recession.
Claim 11
Dependent Claim
64 words
A process according to Claim 7, including a step (b) in which a metal sheet is bonded by positioning it on the stepped portion in said recess so that the inner peripheral face of said recess and the opposing outer peripheral face of said metal sheet will contact each other at a number of sections and said recessed groove will maintain a predetermined clearance.
References Cited (Backward Citations)
No citation records indexed.
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