EP0196670A2
Expired / Lapsed
EP
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Ceramic substrates for microelectronic circuits and process for producing same
Assignee: Hitachi Ltd
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Filing: 1986-04-03
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Granted: —
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Expires: 2006-04-03
Abstract
Abstract A ceramic substrate for densely integrated, semiconductor arrays which is superior in a coefficient of thermal expansion, dielectric constant, strength of metallized bond, and mechanical strength, comprising a sintered body composed essentially of mullite crystals and a non-crystalline binder composed of Si0 2 , Al 2 O 3 , and MgO, is provided.
Inventors
- 👤 Gyozo Toda
- 👤 Takashi Kuroki
- 👤 Shousaku Ishihara
- 👤 Naoya Kanda
- 👤 Tsuyoshi Fujita
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 18:40
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/45; C04B41/50; C04B41/51; C04B41/5133; C04B35/00; C04B35/01; C04B35/16; C04B35/18; C04B41/80; C04B41/81; C04B41/85; C04B41/88; H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/692; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/46; H05K3/4644; H05K3/4673; H05K3/4676; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49158; Y10T29/49165; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24331; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31678
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
19 words
1 . A ceramic substrate which comprises a sintered body composed substantially of mullite crystals and a noncrystalline binder.
Claim 2
Dependent Claim
19 words
1 . A ceramic substrate which comprises a sintered body composed substantially of mullite crystals and a noncrystalline binder.
Claim 3
Dependent Claim
17 words
The ceramic substrate according to Claim 1, on which a wiring conductor of high-melting metal is provided.
Claim 4
Dependent Claim
22 words
The ceramic substrate according to Claim 2, through which holes are formed and filled with the same conductor as said wiring conductor.
Claim 5
Dependent Claim
15 words
The ceramic substrate according to Claim 2, wherein said high-melting metal is tungsten or molybdenum.
Claim 6
Dependent Claim
98 words
A process for producing ceramic substrates which comprises the steps of; forming green sheets from a composition consisting of 70 to 85% by weight of a mullite ceramic and 30 to 15% by weight of a binder composed of 60 to 95% by weight of Si0 2 , 4 to 30% by weight of A1 2 0 3 , and 1 to 10% by weight of MgO; printing circuit patterns with a conductor paste comprising a high-melting metal on the green sheets; and sintering the resulting sheets at a temperature of 1550 to 1700°C in a reducing atmosphere.
Claim 7
Dependent Claim
98 words
A process for producing ceramic substrates which comprises the steps of; forming green sheets from a composition consisting of 70 to 85% by weight of a mullite ceramic and 30 to 15% by weight of a binder composed of 60 to 95% by weight of Si0 2 , 4 to 30% by weight of A1 2 0 3 , and 1 to 10% by weight of MgO; printing circuit patterns with a conductor paste comprising a high-melting metal on the green sheets; and sintering the resulting sheets at a temperature of 1550 to 1700°C in a reducing atmosphere.
Claim 8
Dependent Claim
123 words
A process for producing ceramic substrates which comprises the steps of; forming green sheets from a composition consisting of 70 to 80% by weight of a mullite ceramic and 30 to 15% by weight of a binder composed of 60 to 95% by weight of Si0 2 , 4 to 30% by weight of Al 2 O 3 , and 1 to 10% by weight of MgO; forming holes through the green sheets; printing circuit patterns with a conductor paste comprising a high-melting metal on the green sheets; filling the through holes with said conductor paste; laminating a plurality of the resulting green sheets to form a laminate; and sintering the laminate at a temperature of 1550 to 1770°C in a reducing atmosphere.
Claim 9
Dependent Claim
123 words
A process for producing ceramic substrates which comprises the steps of; forming green sheets from a composition consisting of 70 to 80% by weight of a mullite ceramic and 30 to 15% by weight of a binder composed of 60 to 95% by weight of Si0 2 , 4 to 30% by weight of Al 2 O 3 , and 1 to 10% by weight of MgO; forming holes through the green sheets; printing circuit patterns with a conductor paste comprising a high-melting metal on the green sheets; filling the through holes with said conductor paste; laminating a plurality of the resulting green sheets to form a laminate; and sintering the laminate at a temperature of 1550 to 1770°C in a reducing atmosphere.
Claim 10
Dependent Claim
18 words
The process for producing ceramic substrates according to Claim 5, wherein said high-melting metal is tungsten or molybdenum.
Claim 11
Dependent Claim
18 words
The process for producing ceramic substrates according to Claim 6, wherein said high-melting metal is tungsten or molybdenum.
References Cited (Backward Citations)
No citation records indexed.
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