EP0196054A2
Expired / Lapsed
EP
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Semiconductor module cooling structure
Assignee: Hitachi Ltd
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Filing: 1986-03-25
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Granted: —
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Expires: 2006-03-25
Abstract
Abstract A semiconductor module cooling structure comprises a housing (33) having a passage (45, 46) through which a cooling fluid flows; a cooling block (72,75) to which the cooling fluid is supplied from the housing and which has an electrical insulating layer (36, 59) at the bottom portion and is combined with a semiconductor chip (40) through the electrical insulating layer; and a bellows (34) which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates (4) are laminated, pressed, diffused, joined, and thereafter stretched and molded.
Inventors
- 👤 Ryoichi Kajiwara
- 👤 Takao Funamoto
- 👤 Mitsuo Katoo
- 👤 Tomohiko Shida
- 👤 Takeshi Matsuzaka
- 👤 Hiroshi Wachi
- 👤 Kazuya Takahashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 03:36
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/776; H10W40/772; H10W72/00; H10W72/30; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
116 words
A semiconductor module cooling structure comprising: a housing (33) having a passage (45, 46) through which a cooling fluid flows; a cooling block (72, 75) to which said cooling fluid is supplied from said housing and which has an electrical insulating layer (36, 59) at the bottom portion and is combined with a semiconductor chip (40) through said electrical insulating layer; and a bellows (34) which is connected between said housing and said cooling block, said cooling fluid being supplied to said cooling block through said bellows, and said bellows being formed in a manner such that a plurality of substantially plane ring-like metal plates (4) are laminated, pressed, diffused, joined, and thereafter stretched and molded.
Claim 2
Dependent Claim
116 words
A semiconductor module cooling structure comprising: a housing (33) having a passage (45, 46) through which a cooling fluid flows; a cooling block (72, 75) to which said cooling fluid is supplied from said housing and which has an electrical insulating layer (36, 59) at the bottom portion and is combined with a semiconductor chip (40) through said electrical insulating layer; and a bellows (34) which is connected between said housing and said cooling block, said cooling fluid being supplied to said cooling block through said bellows, and said bellows being formed in a manner such that a plurality of substantially plane ring-like metal plates (4) are laminated, pressed, diffused, joined, and thereafter stretched and molded.
Claim 3
Dependent Claim
44 words
A cooling structure according to claim 1, wherein said ring-like metal plates (4) are formed in a manner such that a thin plate (1) is etched in accordance with a desired pattern and thereby forming said plurality of metal plates on said thin plate.
Claim 4
Dependent Claim
26 words
A cooling structure according to claim 2, wherein said desired pattern is based on an arrangement of LSI chips of the semiconductor module to the cooled.
Claim 5
Dependent Claim
78 words
A cooling structure according to claim 1, wherein alloy having a melting point lower than that of a material of said ring-like metal plates (4) is coated as joining alloy in the areas (5, 6) of said metal plates to be joined, and an inorganic material which is chemically and physically stable is coated in the areas of said ring-like metal plates which are not joined, and said plurality of ring-like metal plates are mutulally pressed and joined.
Claim 6
Dependent Claim
27 words
A cooling structure according to claim 4, wherein said ring-like metal plates (4) are constituted by either one of nickel, stainless steel, Fe-Ni-Co alloy, and titanium alloy.
Claim 7
Dependent Claim
33 words
A cooling structure according to claim 5, wherein in the case where said ring-like metal plates (4) are made of Fe-Ni-Co alloy, said joining alloy is either Fe-Ni-Co- boron alloy or Fe-Ni-Co-silicon alloy.
Claim 8
Dependent Claim
29 words
A cooling structure according to claim 5, wherein in the case where said ring-like metal plates (4) are made of stainless steel, said joining alloy is stainless steel-silicon alloy.
Claim 9
Dependent Claim
32 words
A cooling structure according to claim 5, wherein in the case where said ring-like metal plates (4) are made of titanium alloy, said joining alloy is either titanium-nickel alloy or titanium-copper alloy.
Claim 10
Dependent Claim
130 words
A semiconductor module cooling structure comprising: a housing (33) having a passage (45, 46) through which a cooling fluid flows; a cooling block (72, 75) to which said cooling fluid is supplied from said housing and which has an electrical insulating layer (36, 59) at the bottom portion and is combined with a semiconductor chip (40) through said electrical insulating layer; and a bellows (34) which is connected between said housing and said cooling block, said cooling fluid being supplied to said cooling block through said bellows, and said bellows being formed in a manner such that a plurality of substantially plane ring-like bellows rings (4) and a plurality of substantially plane ring-like junction rings (2, 3) are used and alternately laminated, pressed, diffused, joined, and thereafter stretched and molded.
Claim 11
Dependent Claim
130 words
A semiconductor module cooling structure comprising: a housing (33) having a passage (45, 46) through which a cooling fluid flows; a cooling block (72, 75) to which said cooling fluid is supplied from said housing and which has an electrical insulating layer (36, 59) at the bottom portion and is combined with a semiconductor chip (40) through said electrical insulating layer; and a bellows (34) which is connected between said housing and said cooling block, said cooling fluid being supplied to said cooling block through said bellows, and said bellows being formed in a manner such that a plurality of substantially plane ring-like bellows rings (4) and a plurality of substantially plane ring-like junction rings (2, 3) are used and alternately laminated, pressed, diffused, joined, and thereafter stretched and molded.
Claim 12
Dependent Claim
142 words
A semiconductor module cooling structure comprising: a housing (33) having a passage (45, 46) through which a cooling fluid flows; a cooling block (72, 75) to which said cooling fluid is supplied from said housing and which has an electrical insulating layer (36, 59) at the bottom portion and is combined with a semiconductor chip (40) through said electrical insulating layer; and a bellows (34) which is connected between said housing and said cooling block, said cooling fluid being supplied to said cooling block through said bellows, and said bellows being formed in a manner such that a plurality of substantially plane ring-like metal plates (4) are used, thin films constituting of ceramics are coated in the areas of said metal plates which are not joined, and said plurality of metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.
Claim 13
Dependent Claim
142 words
A semiconductor module cooling structure comprising: a housing (33) having a passage (45, 46) through which a cooling fluid flows; a cooling block (72, 75) to which said cooling fluid is supplied from said housing and which has an electrical insulating layer (36, 59) at the bottom portion and is combined with a semiconductor chip (40) through said electrical insulating layer; and a bellows (34) which is connected between said housing and said cooling block, said cooling fluid being supplied to said cooling block through said bellows, and said bellows being formed in a manner such that a plurality of substantially plane ring-like metal plates (4) are used, thin films constituting of ceramics are coated in the areas of said metal plates which are not joined, and said plurality of metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.
References Cited (Backward Citations)
No citation records indexed.
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