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EP0195846A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Photo-curable epoxy resin type composition and curing process

Assignee: Toshiba Corp
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Filing: 1985-10-25
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Granted: —
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Expires: 2005-10-25
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Abstract

Abstract A photo-curable epoxy resin type composition which comprises (a) an epoxy resin, (b) a compound having at least one group represented by the formula: -NH-, (c) an organic metal compound, and (d) an organic silicon compound capable of forming a silanol group by irradiation with light. The photo-curable epoxy resin type composition according to this invention is capable of readily curing by light (ultraviolet ray in particular) and also capable of heat-curing at a temperature of 150 °C or more, and yet free from inclusion of ionic impurities from the cured product, free from corrosion of metallic materials which may be in contact with the composition, and having excellent electrical properties.

Inventors

  • 👤 Shuzi Hayase
  • 👤 Shuichi Suzuki
  • 👤 Moriyasu Wada

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-29 21:52
CPC Classifications
C; C08; C08G; C08G65/00; C08G65/02; C08G65/26; C08G65/2642; C08G65/269; C08G59/00; C08G59/18; C08G59/40; C08G59/50; C08G59/56; C08G59/68; C08G65/04; C08G65/06; C08G65/08; C08G65/10; C08G65/12; C08G65/2669; C08G65/2681; G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; G03F7/0385

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 46 words
A photo-curable epoxy resin type compositon which comprises; (a) an epoxy resin; (b) a compound having at least one group represented by the formula: -NH-; (c) an organic metal compound; and (d) an organic silicon compound capable of forming a silanol group by irradiation with light.
Claim 2
Dependent Claim 46 words
A photo-curable epoxy resin type compositon which comprises; (a) an epoxy resin; (b) a compound having at least one group represented by the formula: -NH-; (c) an organic metal compound; and (d) an organic silicon compound capable of forming a silanol group by irradiation with light.
Claim 3
Dependent Claim 18 words
The photo-curable epoxy resin type composition according to Claim 1, wherein the composition further comprises a photo sensitizer.
Claim 4
Dependent Claim 17 words
The photo-curable epoxy resin type composition according to Claim 1, wherein the composition further comprises a filler.
Claim 5
Dependent Claim 35 words
The photo-curable epoxy resin type composition according to Claim 1, wherein the component (b) is at least one selected from the group consisting of a compound represented by the formula: -CONH- and an aromatic amine.
Claim 6
Dependent Claim 28 words
The photo-curable epoxy resin type composition according to Claim 4, wherein the mixing proportion of the component (b) is 0.5 to 1.5 equivalent based on the component (a).
Claim 7
Dependent Claim 19 words
The photo-curable epoxy resin type composition according to Claim 1, wherein the component (c) is an organic aluminum compound.
Claim 8
Dependent Claim 30 words
The photo-curable epoxy resin type composition according to Claim 6, wherein the mixing proportion of the component (c) is 0.001 to 10 % by weight based on the component (a).
Claim 9
Dependent Claim 30 words
The photo-curable epoxy resin type composition according to Claim 1, wherein the mixing proportion of the component (d) is 0.01 to 20 % by weight based on the component (a).
Claim 10
Dependent Claim 30 words
The photo-curable epoxy resin type composition according to Claim 2, wherein the mixing proportion of the photo sensitizer is 0.001 to 10 % by weight based on the component (a).
Claim 11
Dependent Claim 28 words
The photo-curable epoxy resin type composition according to Claim 3, wherein the mixing proportion of the filler is 1 to 200 % by weight of the component (a).
Claim 12
Dependent Claim 26 words
A process for carring out a curing by irradiation of UV ray of 180 to 700 nm and at a temperature of 150 to 200 °C.
Claim 13
Dependent Claim 26 words
A process for carring out a curing by irradiation of UV ray of 180 to 700 nm and at a temperature of 150 to 200 °C.

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