Pressurized contact type double gate static induction thyristor

Claim 2

A pressurized contact type double gate static induction thyristor comprising: a casing; a semiconductor body located in the casing and having cathode efectrodes and a first gate electrode at one principal surface side thereof and anode electrodes and a second gate electrode at the other principal surface side thereof; a first thermal expansion stress buffer plate located in the casing to be in contact with the cathode electrodes; and a second thermal expansion stress buffer plate located in the casing and composed of at least two metal members electrically insulated from each other and integrally bonded by an insulating material, one of the two metal members being in contact with the anode electrodes and the other metal member being in contact with the second gate electrode.

Claim 3

A thyristor as claimed in Claim 1 wherein the anode electrodes project at a level higher than the level on which the second gate electrode is laid, and wherein the second metal member of the second thermal expansion stress buffer plate projects from the level of the first metal member so as to directly contact the second gate electrode.

Claim 4

A thyristor as claimed in Claim 1 or 2 wherein the second gate electrode is formed in the form of a circle on the other principal surface of the semiconductor body and the anode electrodes are formed in the area of the circular second gate electrode to project from the second gate electrode, and wherein the second thermal expansion stress buffer plate comprises a circular metal plate brought into contact with all the anode electrodes and a first annular metal plate surrounding the circular metal plate through the intermediary of an annular insulating member, the annular metal plate being contacted with a peripheral portion of the circular second gate electrode.

Claim 5

A thyristor asclaimed in Claim 3 wherein the semiconductor body has an annular peripheral semiconductor region formed on the other principal surface thereof to surround the anode electrodes and to project at substantially the same level as that of the anode electrodes, and wherein the second thermal expansion stress buffer plate further includes a second annular metal member surrounding the first annular metal plate through another insulating member and being contacted to the peripheral semiconductor region of the other principal surface.

Claim 6

A thyristor as claimed in any of Claims 1 to 4 wherein the casing comprises a ceramic cylinder accommodating the semiconductor body and having two opposite openings, a first cover fixed to close one of the two openings of the cylinder, a cooled cathode electrode supported at a center of the first cover and contacted to the cathode eletrodes of the semiconductor body through the first thermal expansion stress buffer plate, a second cover fixed to close the other opening of the cylinder, and a cooled anode electrode flexibly supported at a center of the second cover and contacted to the circular metal plate of the second thermal expansion stress buffer plate.

Claim 7

A thyristor as claimed in Claim 5 wherein lead wires are bonded to the first gate electrode and the first annular metal member of the second thermal expansion stress buffer plate, respectively, and are extended to taking-out sleeves formed in the ceramic cylinder.

Claim 8

A thyristor as claimed in Claim 5 wherein lead wires are forcedly contacted to the first gate electrode and the first annular metal member of the second thermal expansion stress buffer plate, respectively through an insulating support by spring means based on the respective cooled electrodes.

Claim 9

A thyristor as claimed in Claim 5 wherein the casing is composed of two separate halves with their flanges welded together, and lead wires are pushed at their one end against the first gate electrode and the first annular metal number by associated spring means through the agency of an intervenient insulator.

Claim 10

A thyristor as claimed in Claim- 3 wherein the metal member of the second thermal expansion stress buffer plate is made of a metal whose thermal expansion coefficient is matched to be substantially equal to that of the semiconductor material, and the insulating member is made of a material which has a resistance both to heat and chemicals.

Claim 11

A pressurized contact type double gate static induction thyristor comprising: a hermetical casing; a semiconductor lamination body composed of layers of different conductivity types contained in the casing; a first gate region formed on one principal surface of the lamination body; discrete cathode regions rising from the level at which the first gate region is laid; a second gate region formed on the other principal surface of the lamination body; discrete anode regions rising from the level at which the second gate region is laid; a first thermal expansion stress buffer plate laid on the discrete cathode regions; a second thermal expansion stress buffer plate laid on and fixed to the second gate and discrete anode regions; a cooled cathode electrode laid on the first thermal expansion stress buffer plate; and a cooled anode electrode laid on the second thermal expansion stress buffer plate, the second thermal expansion stress buffer plate being composed of a metal-and-insulation composite plate comprising a circular metal member, an annular metal projection and a surrounding metal plate electrically insulated from each other and integrally bonded by insulating material, the annular metal projections and said circular metal member being in contact with the second gate regions and the discrete anode regions, respectively.

Claim 12

A pressurized contact type double gate static induction thyristor comprising: a hermetical casing; a semiconductor lamination body composed of layers of different conductivity types contained in the casing; a first gate region formed on one principal surface of the lamination body; discrete cathode regions rising from the level at which the first gate region is laid; a second gate region formed on the other principal surface of the lamination body; discrete anode regions rising from the level at which the second gate region is laid; a first thermal expansion stress buffer plate laid on the discrete cathode regions; a second thermal expansion stress buffer plate laid on and fixed to the second gate and discrete anode regions; a cooled cathode electrode laid on the first thermal expansion stress buffer plate; and a cooled anode electrode laid on the second thermal expansion stress buffer plate, the second thermal expansion stress buffer plate being composed of a metal-and-insulation composite plate comprising a circular metal member, an annular metal projection and a surrounding metal plate electrically insulated from each other and integrally bonded by insulating material, the annular metal projections and said circular metal member being in contact with the second gate regions and the discrete anode regions, respectively.

Claim 13

1 1. A thyristor as claimed in Claim 10 wherein the metal projections and said circular metal member are made of a metal whose thermal expansion coefficient is matched to be substantially equal to that of the semiconductor material, and the insulating material is made of a material which has a resistance both to heat and chemicals.

Claim 14

A thyristor as claimed in Claim 10 or 11 wherein the hermetical casing is composed of two separate halves with their franges welded together, and lead wires are pushed at their one end against a selected region by an associated spring means through the agency of an intervenient insulator.