IC card

Claim 2

An IC card comprising: at least one IC chip (5, 6) having electrical terminals (5C, 6C); a sheet-like structure (4, 12, 13) having one surface and supporting said IC chip (5, 6); internal connecting members (7A, 7B) formed on said one surface of said sheet-like structure (4, 12, 13) and including a plurality of connection pads (7A) to be connected to the external device and wiring patterns (7B) connecting said connection pads (7A) and said terminals (5C, 6C) of said IC chip (5, 6); and a sheet film (3) covering said one surface of said sheet-like structure (4, 12, 13); characterized in that said sheet film (3) has openings (11A) facing said connection pads (7A) and contact segments (7-1 to 7-8) formed on said connection pads (7A) and having a thickness substantially equal to the thickness of said sheet film (3) are -fitted in said first openings (11A).

Claim 3

The IC card according to claim 1, characterized in that each of said connection pads (7A) has a size larger than the corresponding opening (11A) of said sheet film (3) and said contact segment (7-1 to 7-8) is formed inwardly of said corresponding contact pad (7A).

Claim 4

The IC card according to claim 1, characterized in that said IC chip (5, 6) includes a collation circuit (53, 54) for collating identification data of the owner of the card.

Claim 5

The IC card comprising: at least two IC chips (5, 6) having electrical terminals (5C, 6C); a sheet-like structure (4, 12, 13) having one surface and an opposite surface and supporting said IC chips (5, 6), said IC chips (5, 6) being disposed in areas of said one surface separated in the longitudinal direction on opposite sides of a central area; internal connecting members (7A, 7B) formed on said one surface of said sheet-like structure (4, 12, 13) and including a plurality of connection pads (7A) connected to the external device and wiring patterns (7 B ) connecting said connection pads (7A) to said electrical terminals (5C, 6C) of said IC chip (5, 6); a first sheet film (3) covering said one surface of said sheet-like structure (4, 12, 13); a second sheet (14) covering said opposite surface of said sheet-like structure (4, 12, 13); characterized in that said sheet film (3) has penings (11A) facing said connection pads (7A) and contact segments (7-1 to 7-8) formed on said connection pads (7A) and having a thickness substantially equal to the thickness of said first sheet film (3) are fitted in said first openings (11A) and exposed from the first openings (llA).

Claim 6

The IC card comprising: at least two IC chips (5, 6) having electrical terminals (5C, 6C); a sheet-like structure (4, 12, 13) having one surface and an opposite surface and supporting said IC chips (5, 6), said IC chips (5, 6) being disposed in areas of said one surface separated in the longitudinal direction on opposite sides of a central area; internal connecting members (7A, 7B) formed on said one surface of said sheet-like structure (4, 12, 13) and including a plurality of connection pads (7A) connected to the external device and wiring patterns (7 B ) connecting said connection pads (7A) to said electrical terminals (5C, 6C) of said IC chip (5, 6); a first sheet film (3) covering said one surface of said sheet-like structure (4, 12, 13); a second sheet (14) covering said opposite surface of said sheet-like structure (4, 12, 13); characterized in that said sheet film (3) has penings (11A) facing said connection pads (7A) and contact segments (7-1 to 7-8) formed on said connection pads (7A) and having a thickness substantially equal to the thickness of said first sheet film (3) are fitted in said first openings (11A) and exposed from the first openings (llA).

Claim 7

The IC card according to claim 4, characterized in that said sheet-like structure (4, 12, 13) includes a substrate (4) said internal connecting members (7A, 7B) being formed thereon.

Claim 8

The IC card according to claim 5, characterized in that said sheet-like structure (4, 12, 13) includes a third sheet (12) supporting said substrate (4).

Claim 9

The IC card according to claim 5, characterized in that one of said IC chips (5, 6) includes a central processing circuit (51) for processing a signal and a collation circuit (53, 54), and the other IC chip (6) includes a non-volatile memory (52) having a memory area (71, 72, 73, 80) for storing a code number, capable of storing data such that the stored data can not be erased.

Claim 10

The IC card according to claim 6, characterized in that said memory (52) further has three memory areas (71, 72, 73) to which user's, manufacturer's and issuer's data are stored, respectively.

Claim 11

The IC card according to claim 6, characterized in that the other IC chip includes a memory (6) capable of storing rewritable application data.

Claim 12

An IC module of an IC card, which includes contact segments (7-1 to 7-8) capable of being connected to an external device, characterized by comprising: external connection pads (7A) arranged in rows, on which said contact segments (7-1 to 7-8) are formed, respectively; wiring patterns (7B) connected to said contact segments (7-1 to 7-8), respectively; an insulative substrate (12) having a surface and an opening (11A) formed thereon, said substrate surface having a first surface area for carrying said contact segments (7-1 7-8) and a second surface area continued from the first surface area, on which said openings (11A) are arranged; and at least one IC chip (5, 6) received in the opening (12C) of said substrate (12) and having electric terminals (5C, 6C) connected to said wiring patterns (7B), respectively.

Claim 13

An IC module of an IC card, which includes contact segments (7-1 to 7-8) capable of being connected to an external device, characterized by comprising: external connection pads (7A) arranged in rows, on which said contact segments (7-1 to 7-8) are formed, respectively; wiring patterns (7B) connected to said contact segments (7-1 to 7-8), respectively; an insulative substrate (12) having a surface and an opening (11A) formed thereon, said substrate surface having a first surface area for carrying said contact segments (7-1 7-8) and a second surface area continued from the first surface area, on which said openings (11A) are arranged; and at least one IC chip (5, 6) received in the opening (12C) of said substrate (12) and having electric terminals (5C, 6C) connected to said wiring patterns (7B), respectively.

Claim 14

The IC card according to claim 10, characterized in that said wiring patterns (7B) are made of a metal foil.

Claim 15

The IC card according to claim 10, characterized in that said contact segments (7-1 to 7-8) are formed on and projected from said wiring patterns (7B).

Claim 16

The IC card according to claim 11, characterized in that said wiring patterns (7B) are made of a metal foil, and said contact segments (7-1 to 7-8) are formed on and projected from said metal foils.