EP0187706B1
Expired / Lapsed
EP
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A method of coating an organic substrate with a metal
Assignee: International Business Machines Corp
•
Filing: 1986-01-07
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Granted: 1989-12-13
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Expires: 2006-01-07
Abstract
No abstract record available.
Inventors
- 👤 Paul Siu-Chung Ho
- 👤 Peter Otto Hahn
- 👤 Harry Lefakis
- 👤 Gary Wayne Rubloff
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 00:57
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H10W70/695; C; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/20; H05; H05K; H05K3/00; H05K3/38; H05K3/388; H10W70/01; H10W70/05; H05K2201/00; H05K2201/20; H05K2201/2063; H05K2203/00; H05K2203/11; H05K2203/1105
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
117 words
A method of coating an organic substrate with a metal which has a relatively weak intrinsic bonding to the substrate, including the steps of heating the substrate to a temperature approximately 0.6-0.8 of its curing temperature T., and then depositing metal atoms onto the substrate while it is held at a temperature within the range of about (0.6-0.8) T c until at least a few atomic layers of continuous metal are formed on the substrate, the deposition being arranged to occur at a rate such that the rate of diffusion of deposited metal atoms into the substrate is equal to or greater than the rate of arrival of the metal atoms at the surface of the substrate.
Claim 2
Independent Claim
117 words
A method of coating an organic substrate with a metal which has a relatively weak intrinsic bonding to the substrate, including the steps of heating the substrate to a temperature approximately 0.6-0.8 of its curing temperature T., and then depositing metal atoms onto the substrate while it is held at a temperature within the range of about (0.6-0.8) T c until at least a few atomic layers of continuous metal are formed on the substrate, the deposition being arranged to occur at a rate such that the rate of diffusion of deposited metal atoms into the substrate is equal to or greater than the rate of arrival of the metal atoms at the surface of the substrate.
Claim 3
Dependent Claim
45 words
A method as claimed in claim 1, in which the rate of deposition of the metal atoms onto the substrate is chosen such that intermixing of metal atoms and the substrate occurs to a depth less than about 1000 angstroms (100 nm) into the substrate.
Claim 4
Dependent Claim
37 words
A method as claimed in claim 1 or claim 2, in which the rate of deposition of the metal atoms does not exceed about 1/10 of the rate of diffusion of the metal atoms into the substrate.
Claim 5
Independent Claim
27 words
A method as claimed in any preceding claim, in which the deposited metal is Ni, Cu, Al, Ag, Au, Ta, Pt, lr, Rh, Pd, Zn, or Cd.
Claim 6
Independent Claim
16 words
A method as claimed in any preceding claim, in which the substrate consists of a polymer.
Claim 7
Dependent Claim
20 words
A method as claimed in claim 5, in which the substrate consists of mylar, polyimide, polyester, polyethylene, epoxy or polystyrene.
Claim 8
Independent Claim
19 words
A method as claimed in any preceding claim, in which the metal atoms are deposited by evaporation or sputtering.
References Cited (Backward Citations)
No citation records indexed.
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