EP0182371A2
Expired / Lapsed
EP
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Protection film structure for functional devices
Assignee: Panasonic Holdings Corp
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Filing: 1985-11-19
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Granted: —
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Expires: 2005-11-19
Abstract
Abstract An inorganic protection film (12) such as of silicon nitride for protecting function devices (16) on the substrate from water molecules (15) is formed on an organic substrate (11) such as of polycarbonate with a soft buffer interface film (13) inbetween, and the buffer film releases stress due to difference of thermal expansion coefficients of the organic substrate and the protection film.
Inventors
- 👤 Kiyotaka Wasa
- 👤 Takashi Hirao
- 👤 Atsuo Nishikawa
- 👤 Seiji Nishino
- 👤 Takeo Ohta
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 21:36
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/131; G; G11; G11B; G11B5/00; G11B5/62; G11B5/72; G11B7/00; G11B7/24; G11B7/2403; H10W74/40; H10W74/43; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24942; Y10T428/31504; Y10T428/31551; Y10T428/31573; Y10T428/31576; Y10T428/31598; Y10T428/31601; Y10T428/31605
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
59 words
A protection film structure for functional devices comprising an inorganic humidity protection film (12) formed on a substrate (11) and a buffer film (13) formed between said substrate (11) and said inorganic humidity protection film (12), said buffer film (13) being for releasing stress due to difference of thermal expansion coefficients of said substrate and said inorganic protection film.
Claim 2
Dependent Claim
59 words
A protection film structure for functional devices comprising an inorganic humidity protection film (12) formed on a substrate (11) and a buffer film (13) formed between said substrate (11) and said inorganic humidity protection film (12), said buffer film (13) being for releasing stress due to difference of thermal expansion coefficients of said substrate and said inorganic protection film.
Claim 3
Dependent Claim
26 words
A protection film structure for functional devices in accordance with claim 1, wherein said buffer (13) film has a larger flexibility than that of said substrate.
Claim 4
Dependent Claim
20 words
A protection film structure for functional devices in accordance with claim 1, wherein said buffer film (13) is silicon oxide.
Claim 5
Dependent Claim
34 words
A protection film structure for functional devices in accordance with claim 1, wherein said protection film (12) is of one substance selected from a group consisting of silicon nitride, silicon oxinitride and silicon carbide.
Claim 6
Dependent Claim
30 words
A protection film structure for functional devices in accordance with claim 1, wherein hardness of said buffer film (13) is smaller at least than that of said protection film (12).
Claim 7
Dependent Claim
33 words
A protection film structure for functional devices in accordance with claim 1, wherein said substrate (11) is of a substance selected from a group consisting of acrylatepolystyrene, polycarbonate, polyester, polyethilene and vinyl chloride.
Claim 8
Dependent Claim
24 words
A protection film structure for functional devices in accordance with claim 1, which further comprises a water-repulsive film (20) on said protection film (12).
Claim 9
Dependent Claim
29 words
A protection film structure for functional devices in accordance with claim 1, wherein said buffer film (13) is of transparent inorganic film such as indium oxide or tin oxide.
Claim 10
Dependent Claim
25 words
A protection film structure for functional devices in accordance with claim 1, wherein said protection film (12) is further coated with an overriding organic film.
Claim 11
Dependent Claim
35 words
A protection film structure for functional devices in accordance with claim 1, wherein said organic substrate is of polycarbonate and said protection film is of low-temperature- plasma-CVD silicon nitride or of low-temperature- plasma-CVD silicon oxinitride.
Claim 12
Dependent Claim
54 words
Method for forming protection film structure comprising the steps of forming a buffer film (13) on a substrate (11) and forming an inorganic protection film (12) on said buffer film (13), said buffer film having such hardness to release stress due to difference of thermal expansion coefficients of said substrate and said protection film.
Claim 13
Dependent Claim
54 words
Method for forming protection film structure comprising the steps of forming a buffer film (13) on a substrate (11) and forming an inorganic protection film (12) on said buffer film (13), said buffer film having such hardness to release stress due to difference of thermal expansion coefficients of said substrate and said protection film.
Claim 14
Dependent Claim
32 words
Method in accordance with claim 1, wherein said substrate (11) is an organic substrate and said substrate (11) has been heat-treated for dehydration prior to said forming of said buffer film (13).
References Cited (Backward Citations)
No citation records indexed.
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