Semiconductor device package for high frequencies

Claim 2

A package for a semiconductor device, comprising: a metallic container for containing a semiconductor circuit, having a side wall with a through-hole extending between the inside and the outside of the container; electrical terminal means engaged in said through-hole so as to be secured to said container, said electrical terminal means comprising: an insulating material base having a plurality of strip lines formed thereon in parallel relationship; and a plurality of insulating material block members, each of said insulating material block members being disposed on said insulating material base so as to selectively cover a corresponding one of said strip lines at a middle portion of the line.

Claim 3

A package for a semiconductor device, comprising: a metallic container for containing a semiconductor circuit, including a metallic base portion and a metallic side wall portion, said side wall portion having a through-hole provided with cutout portions successively formed on an edge thereof to leave corresponding tooth portions of said side wall portion therebetween; and a unitary (single) electrical terminal means engaged in said through-hole and secured to said container, said electrical terminal means including; an insulating material base portion having a plurality of strip lines formed thereon in parallel relationship penetrating said side wall portion perpendicularly, each of said strip lines having a width in a direction perpendicularly transverse to said strip lines, said insulating material base having a surface bonded to said metallic base portion; and a plurality of insulating material block members having a width larger than the width of said strip lines and a depth substantially equal to the thickness of said side wall, each of said insulating material block members being secured to said insulating material base so as to selectively cover a corresponding one of said strip lines with a surface thereof defined by the width and depth, each of said insulating material block means having a surface bonded to corresponding one of said cutout portions.

Claim 4

A package for a semiconductor device, comprising: a metallic container for containing a semiconductor circuit, including a metallic base portion and a metallic side wall portion, said side wall portion having a through-hole provided with cutout portions successively formed on an edge thereof to leave corresponding tooth portions of said side wall portion therebetween; and a unitary (single) electrical terminal means engaged in said through-hole and secured to said container, said electrical terminal means including; an insulating material base portion having a plurality of strip lines formed thereon in parallel relationship penetrating said side wall portion perpendicularly, each of said strip lines having a width in a direction perpendicularly transverse to said strip lines, said insulating material base having a surface bonded to said metallic base portion; and a plurality of insulating material block members having a width larger than the width of said strip lines and a depth substantially equal to the thickness of said side wall, each of said insulating material block members being secured to said insulating material base so as to selectively cover a corresponding one of said strip lines with a surface thereof defined by the width and depth, each of said insulating material block means having a surface bonded to corresponding one of said cutout portions.

Claim 5

A package as claimed in claim 2, wherein said insulating material base has a substantially rectangular cross-section in a plane perpendicular to the direction in which said strip lines extend.

Claim 6

A package as claimed in claim 2 or 3, wherein each of said insulating material block members has a substantially rectangular cross-section in a plane perpendicular to the direction in which said strip lines extend.

Claim 7

A package as claimed in claim 2, 3 or 4, wherein said tooth portions are formed to extend to said insulating material base.

Claim 8

A package as claimed in claim 2, 3, 4 or 5, wherein each of said tooth portions is bonded to said insulating material base at a tip thereof, along a length of the tip.

Claim 9

A package as claimed in claim 2, 3, 4, 5 or 6, further comprising metallized layers formed on said insulating material base so as to connect said tips of said tooth portions to said base plate portion of said container.

Claim 10

A package as claimed in claim 2, 3, 4, 5, 6 or 7, further comprising a lid secured to said container.

Claim 11

A package as claimed in claim 2, 3, 4, 5, 6, 7 or 8, wherein said container is formed of copper.

Claim 12

A package as claimed in claim 2, 3, 4, 5, 6, 7, 8 or 9, wherein said insulating material base and said insulating material block members are composed of alumina.

Claim 13

A package as claimed in claim 2, said electrical terminal means being hermetically sealed to said container.

Claim 14

A package as claimed in claim 11, said electrical terminal means being brazed to said container.

Claim 15

A package as claimed in any previous claim, wherein said insulating material base comprises a common insulating material base portion on which respective separate insulating material blocks are disposed, on which blocks respective strip lines are formed.