EP0177193A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Thermal print head
Assignee: Toshiba Corp
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Filing: 1985-09-05
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Granted: —
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Expires: 2005-09-05
Abstract
Abstract A thermal print head comprises a heat resisting resin film (23) on which are deposited resistive heating layers (27) and metal circuit layers (31), the metal circuit layers (31) being connected to respective resistive heating layers (27). The film (23) is supported on a heat sink substrate (11) provided with a flat surface and corners (15, 17) formed at the side edges of the flat surface. The resistive heating layers (27) are positioned over the flat surface; the film (23) extends over the corners (15. 17). The flat surface of the heat sink substrate (11) supports the film (23) so that the part of the film (23) on which the heating layers (27) are formed is flat thereby preventing fluctuations of the electrical resistance values of the resistive heating layers (27) due to bending.
Inventors
- 👤 Shozo C/O Patent Division Takeno
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 13:50
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/315; B41J2/32; B41J2/335; B41J2/33505; B41J2/33515; B41J2/33535; B41J2/3355; B41J2/33555; B41J2/33565; B41J2/3358; B41J2/345
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
138 words
A thermal print head comprising: a heat sink substrate (11): resistive heating layers (27) comprising a plurality of resistive heating elements mounted on the substrate (11); metal circuit layers (13) mounted on the substrate (11) and connected to respective resistive heating layers (27); and an integrated circuit (33) mounted on the substrate (11) and electrically connected to the metal circuit layers (31), characterised in that the substrate (11) has a flat surface (13) with corners (15, 17) extending along both sides thereof, by a heat resisting organic resin film (23) supported on the flat surface (13) and folded at the corners (15, 17). and in that the resistive heating layers (27) are deposited on an area of the film (23) on the flat surface (13) so that the resistive heating layers (27) are kept supported flat without bending.
Claim 2
Dependent Claim
138 words
A thermal print head comprising: a heat sink substrate (11): resistive heating layers (27) comprising a plurality of resistive heating elements mounted on the substrate (11); metal circuit layers (13) mounted on the substrate (11) and connected to respective resistive heating layers (27); and an integrated circuit (33) mounted on the substrate (11) and electrically connected to the metal circuit layers (31), characterised in that the substrate (11) has a flat surface (13) with corners (15, 17) extending along both sides thereof, by a heat resisting organic resin film (23) supported on the flat surface (13) and folded at the corners (15, 17). and in that the resistive heating layers (27) are deposited on an area of the film (23) on the flat surface (13) so that the resistive heating layers (27) are kept supported flat without bending.
Claim 3
Dependent Claim
43 words
A thermal print head according to claim 1 characterised in that the heat sink substrate comprising a flat metal plate (53) and a metal block (55). the flat metal plate (53) having a flat surface (57) to support the film (23) while flat.
Claim 4
Dependent Claim
21 words
A thermal print head according to claim 1 or 2 characterised in that the film (23) is made of polyimide resin.
Claim 5
Dependent Claim
40 words
A thermal print head according to claim 1 characterised in that at least the film (23), the resistive heating layers (27) and the metal circuit layers (31) on the flat surface (13) are covered with a wear resisting layer (41).
Claim 6
Dependent Claim
33 words
A thermal print head according to claim 4 characterised in that the resistive heating layers (27) are made of Ta-Si-0 and the wear resisting layer (41) is made of Ta 2 0 5'
Claim 7
Dependent Claim
38 words
A thermal print head according to claim 1 characterised in that both folded sections (29) of the film (33) at the corners (15. 17) of the heat sink substrate (11) do not support the resistive heating layers (27).
Claim 8
Dependent Claim
26 words
A thermal print head according to claim 6 characterised in that the metal circuit layers (31) extend over the folded sections (29) of the film (23).
Claim 9
Dependent Claim
23 words
A thermal print head according to claim 1 or 2 characterised in that the film (23) intimately contacts on the flat metal plate.
Claim 10
Dependent Claim
20 words
A thermal print head according to claim 1 characterised in that the integrated circuit (33) is mounted on the film.
Claim 11
Dependent Claim
21 words
A thermal print head according to claim 1 characterised in that the heat sink substrate (11) is of the rod type.
References Cited (Backward Citations)
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