EP0157563A2 — Thermal recording head and process for manufactur…

Claim 1

Independent Claim 89 words

A thermal recording head comprising an insulation substrate having thereon a heat generating resistor pattern made of a thin-film resistor, a predetermined electrode pattern having a common power supply electrode pattern portion and a common ground electrode pattern portion, for supplying power to the resistor pattern, and a controlling electrode pattern portion, said electrode pattern being made of a thick-film copper paste by printing, and switching means for controlling the supply of the power to the resistor pattern, said switching means7to be controlled by said controlling electrode pattern portion.

Claim 2

Dependent Claim 89 words

A thermal recording head comprising an insulation substrate having thereon a heat generating resistor pattern made of a thin-film resistor, a predetermined electrode pattern having a common power supply electrode pattern portion and a common ground electrode pattern portion, for supplying power to the resistor pattern, and a controlling electrode pattern portion, said electrode pattern being made of a thick-film copper paste by printing, and switching means for controlling the supply of the power to the resistor pattern, said switching means7to be controlled by said controlling electrode pattern portion.

Claim 3

Dependent Claim 19 words

A thermal recording head according to claim 1, wherein said switching means comprises switching elements composed of integrated circuits.

Claim 4

Dependent Claim 98 words

A thermal recording head having a multi-layer wiring structure provided with active elements at a high density, which comprises a substrate, a first conductor layer formed of a thick film and arranged on the substrate, a first insulator layer formed of a glass thick film and arranged on the first conductor layer, a heat-generating resistor layer formed of a thin film and arranged on the first insulator layer, a second conductor layer formed of a thin film and arranged on the resistor layer, and active elements arranged on the second conductor layer or on the first insulator layer.

Claim 5

Dependent Claim 98 words

A thermal recording head having a multi-layer wiring structure provided with active elements at a high density, which comprises a substrate, a first conductor layer formed of a thick film and arranged on the substrate, a first insulator layer formed of a glass thick film and arranged on the first conductor layer, a heat-generating resistor layer formed of a thin film and arranged on the first insulator layer, a second conductor layer formed of a thin film and arranged on the resistor layer, and active elements arranged on the second conductor layer or on the first insulator layer.

Claim 6

Dependent Claim 68 words

A thermal recording head as set forth in claim 3, wherein the first conductor layer is formed of a Cu thick film, the first insulator layer is formed of a glass capable of being sintered in an N 2 atmosphere, and the second conductor layer is formed by using a single layer or multi-layer of Cr, NiCr, W, Ta, Ti, Ni, Cu, Au, Pd or Al thin film.

Claim 7

Dependent Claim 55 words

A thermal recording head as set forth in 4 claim 3 or, wherein the first insulator layer is a glass thick film having an integrally formed laminated structure comprising a first glass layer formed of a crystalline glass and a second glass layer formed of an amorphous glass and arranged on the first glass layer.

Claim 8

Dependent Claim 77 words

A thermal recording head as set forth in claim 3/, wherein the first insulator layer is a glass thick film having an integrally formed laminated structure comprising a first glass layer formed of an amorphous glass having a high softening point and a second glass layer formed of an amorphous glass having a softening point lower than that of the amorphous glass of the first glass layer and arranged on the first glass layer. 4,5, Or 6

Claim 9

Dependent Claim 28 words

A thermal recording head according to claim 3/ further comprising a nickel plating layer between the first conductor layer and the second conductor layer at the connection therebetween.

Claim 10

Dependent Claim 131 words

A thermal recording ' head having a multi-layer wiring structure provided with active elements at a high density, which comprises a substrate, a first conductor layer formed of a thick film and arranged on the substrate, a first insulator layer formed of a glass thick film and arranged on the first conductor layer, a heat-generating resistor layer formed of a thin film and arranged on the first insulator layer, a second conductor layer formed of a thin film and arranged on the resistor layer, a second insulator layer formed of a thick film and arranged on the second conductor layer, a third conductor layer formed of a thin film and arranged on the second insulator layer and active elements arranged on the third conductor layer or on the second insulator layer.

Claim 11

Dependent Claim 131 words

A thermal recording ' head having a multi-layer wiring structure provided with active elements at a high density, which comprises a substrate, a first conductor layer formed of a thick film and arranged on the substrate, a first insulator layer formed of a glass thick film and arranged on the first conductor layer, a heat-generating resistor layer formed of a thin film and arranged on the first insulator layer, a second conductor layer formed of a thin film and arranged on the resistor layer, a second insulator layer formed of a thick film and arranged on the second conductor layer, a third conductor layer formed of a thin film and arranged on the second insulator layer and active elements arranged on the third conductor layer or on the second insulator layer.

Claim 12

Dependent Claim 69 words

A thermal recording head as set forth in claim 8, wherein the first conductor layer is formed of a thick film of Cu, the first insulator layer is formed of a glass capable of being sintered in an N 2 atmosphere, and the second conductor layer is formed by using a single layer or multi-layer of Cr, NiCr, W, Ta, Ti, Ni, Cu, Au, Pd or Al thin film.

Claim 13

Dependent Claim 54 words

A thermal recording head as set forth in claim 8/ wherein the first insulator layer is a glass thick film having an integrally formed laminated structure comprising a first glass layer formed by printing a crystalline glass and a second glass layer formed of an amorphous glass and arranged on the first glass layer.

Claim 14

Dependent Claim 77 words

or 9 , A thermal recording head as set forth in claim 8/ wherein the first insulator layer is a glass thick film having an integrally formed laminated structure comprising a first glass layer formed of an amorphous glass having a high softening point and a second glass layer formed of an amorphous glass having a softening point lower than that of the amorphous glass of the first glass layer and arranged on the first glass layer.

Claim 15

Dependent Claim 140 words

A process for manufacturing a wiring substrate for a thermal recording head, comprising; a first step of forming a lower layer of a first conductor pattern of a copper thick-film by applying and firing a copper paste on an insulation substrate; a second step of forming a glass insulator on the lower layer by applying a glass paste onto the first conductor pattern so that at least a part of the conductor pattern is exposed, and then firing the glass paste in an inert gas atmosphere containing a high density of oxygen content; a third step of removing oxide formed on the exposed surface of the first conductor pattern; and, a fourth step of forming an upper layer of a second conductor pattern, which is electrically connected to the exposed surface of the first conductor pattern, on the glass insulator.

Claim 16

Dependent Claim 140 words

A process for manufacturing a wiring substrate for a thermal recording head, comprising; a first step of forming a lower layer of a first conductor pattern of a copper thick-film by applying and firing a copper paste on an insulation substrate; a second step of forming a glass insulator on the lower layer by applying a glass paste onto the first conductor pattern so that at least a part of the conductor pattern is exposed, and then firing the glass paste in an inert gas atmosphere containing a high density of oxygen content; a third step of removing oxide formed on the exposed surface of the first conductor pattern; and, a fourth step of forming an upper layer of a second conductor pattern, which is electrically connected to the exposed surface of the first conductor pattern, on the glass insulator.

Claim 17

Dependent Claim 22 words

A process according to claim 12, wherein the density of oxygen contained in the inert gas atmosphere is 200 to 5000 ppm.

Claim 18

Dependent Claim 48 words

A process according to claim 12 or 13, wherein said third step comprises immersing the substrate having thereon the first conductor pattern and the glass insulator in an organic acid-containing organic solvent to activate the exposed first conductor surface in order to remove the oxide. ,13, or 14

Claim 19

Dependent Claim 25 words

A process according to claim 12/, wherein said upper layer of the second conductor pattern is formed by a thin-film process. , 13 ,14,or 15

Claim 20

Dependent Claim 17 words

A process according to claim 12/, wherein said inert gas atmosphere contains nitrogen as an inert gas.

Claim 21

Dependent Claim 71 words

A process according to any 12 to 16, wherein said organic acid used is at least one selected from the group of carbolic acid, hydroxy acids, and carboxylic acids, said organic solvent used is selected from the group of halogenated hydrocarbons, and aromatic hydrocarbons, and the organic acid is used in the organic solvent in an amount of 3 to 50% by weight of the total weight. any of claims ,

Claim 22

Dependent Claim 16 words

A process according to, 12 to 17, wherein said second conductor pattern is formed by etching.

Claim 23

Dependent Claim 16 words

A process according to, 12 to 17, wherein said second conductor pattern is formed by etching.

Claim 24

Dependent Claim 40 words

A process according to claim 18, further comprising an additional step of forming a protective layer on the exposed surface of the first conductor pattern for protecting the exposed surface from the etching medium used, prior to the fourth step.

Claim 25

Dependent Claim 24 words

A process according to claim 19, wherein said protective layer is a nickel plating coated on the exposed surface of the first conductor pattern.

Thermal recording head and process for manufacturing wiring substrate therefor

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