High-frequency semiconductor device

Claim 2

A semiconductor device including: a metallic container for containing a radio frequency semiconductor circuit on a bottom surface thereof; a cap for covering said container; and input and output terminals connected to said circuit and penetrating through a side wall of said container at locations opposite to each other; wherein said bottom surface includes space for mounting said radio frequency semiconductor circuit and supplementary space for mounting elements of a supplementary circuit; characterized in that means for increasing the cutoff frequency of the waveguide mode wave propagation between said input and output terminals within said container is provided on a part of said supplementary space, so that said cutoff frequency is higher than the wave frequency used in said radio frequency semiconductor circuit.

Claim 3

A semiconductor device according to claim 1, characterized in that said means comprises a metallic projection member disposed within said container for narrowing the long side of the cross-section of the container in parallel with said side wall at the portion having said input and output terminals, wherein said supplementary space is left at least on one side of said projection member in parallel with said cross-section.

Claim 4

A semiconductor device according to claim 2, characterized in that said side wall is of substantially a rectangular frame shape and said projection member is formed inwardly integral with said side wall at a portion perpendicular to the portion having said input and output terminals.

Claim 5

A semiconductor device according to claim 2, characterized in that said projection member is separate from said side wall.

Claim 6

A semiconductor device according to claim 2, 3, or 4, characterized in that a metallic film for an electric terminal surrounded by an insulating member penetrates through said projection member.

Claim 7

A semiconductor device according to claim 2, 3, or 4, characterized in that a plurality of said containers are disposed side by side, side walls thereof being in contact with each other.

Claim 8

A semiconductor device including: a metallic container for containing a radio frequency semiconductor circuit on a bottom surface thereof; a cap for covering said container; and input and output terminals connected to said circuit and penetrating through a side wall of said container at locations opposite to each other; characterized in that said container includes within a part thereof a metallic projection member which extends between said cap and said bottom surface.

Claim 9

A semiconductor device including: a metallic container for containing a radio frequency semiconductor circuit on a bottom surface thereof; a cap for covering said container; and input and output terminals connected to said circuit and penetrating through a side wall of said container at locations opposite to each other; characterized in that said container includes within a part thereof a metallic projection member which extends between said cap and said bottom surface.

Claim 10

A semiconductor device comprising a metallic container (30) having an interior surface (1) extending between opposite end wall portions (26) of the container and having mounted thereon a semiconductor chip (3) including oscillatory circuitry having a predetermined operating frequency; supplementary circuitry (17) mounted in the container at a first location between the chip and one of the said end wall portions; cover means (19) for completing the enclosure of the chip and supplementary circuitry in the container; input and output terminals (13a, 13b) connected to said chip and accessible from outside the container; and an electrically conductive portion (15,20,21,22) extending between the cover means and the interior surface (1) and projecting into the interior of the container at a second location between the chip and the said one of the end wall portions thereby to reduce the effective waveguide mode propagation length of the container so that the cut-off frequency for a wave propagating through the container is higher than the said predetermined operating frequency.

Claim 11

A semiconductor device comprising a metallic container (30) having an interior surface (1) extending between opposite end wall portions (26) of the container and having mounted thereon a semiconductor chip (3) including oscillatory circuitry having a predetermined operating frequency; supplementary circuitry (17) mounted in the container at a first location between the chip and one of the said end wall portions; cover means (19) for completing the enclosure of the chip and supplementary circuitry in the container; input and output terminals (13a, 13b) connected to said chip and accessible from outside the container; and an electrically conductive portion (15,20,21,22) extending between the cover means and the interior surface (1) and projecting into the interior of the container at a second location between the chip and the said one of the end wall portions thereby to reduce the effective waveguide mode propagation length of the container so that the cut-off frequency for a wave propagating through the container is higher than the said predetermined operating frequency.