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EP0154765A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Apparatus for directly powering a multi-chip module from a power distribution bus

Assignee: International Business Machines Corp
•
Filing: 1985-01-02
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Granted: —
•
Expires: 2005-01-02
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Abstract

Abstract A direct module powering scheme is disclosed. A plurality of integrated circuit chips (10a) are mounted on a module (10). The module is mounted on a printed circuit board (12). A plurality of metallization layers (10c, d) are distributed in parallel fashion within the module. A voltage tab (16) is mounted on the edge of the module substrate and in contact with the edge of the metallization layers. The voltage tab may be attached to a source of power (14, 22) for providing the necessary voltage and current to the module needed to power the chips mounted on the module. The metallization layers comprise voltage distribution layers and voltage reference (ground) layers. The voltage tab (16) is connected to the edge of the voltage distribution layer (10c). A plurality of plated vias (10e) are disposed through the module in contact with one or more of the metallization layers. A plurality of voltage distribution stripes (10g) can be disposed on the bottom of the module substrate and in contact with the plated vias for providing the necessary voltage and current to remotely-located chips, relative to the voltage tab (16), needed to power the chips. The energizing current from the power source energizes the chips mounted on the module by way of the voltage tab, the voltage distribution layer, and a plated via. Alternatively, the energizing current from the power source energizes a remotely-located chip mounted on the module by way of the voltage tab, the voltage distribution layer, a plated via, a voltage distribution stripe, and another plated via connected to the remotely-located chip. As a result, the module is connected directly to the power source, rather than being connected to the power source by way of a plurality of power distribution planes disposed within the printed circuit board.

Inventors

  • 👤 Demetrios Balderes
  • 👤 Andrew J. Frankovsky
  • 👤 Robert A. Jarvela

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-29 01:43
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0263; G; G06; G06F; G06F1/00; G06F1/16; G06F1/18; G06F1/189; H05K2201/00; H05K2201/09; H05K2201/09145; H05K2201/0919; H05K2201/10; H05K2201/10227; H05K2201/10272; H05K3/00; H05K3/46; H05K3/4611; H05K3/4641

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 96 words
A system for powering an integrated circuit chip (lOa) disposed on a module (10), including a power bus means (14) for providing a supply of power, a printed circuit board (12), and said module mounted on said printed circuit board, characterized by: voltage tab means (16) connected to said module (10) for supplying power directly to said module when power is supplied to said tab means; and connection means (22) interconnected between said tab means and said power bus means for supplying power from the power bus means directly to said module via said tab means.
Claim 2
Independent Claim 96 words
A system for powering an integrated circuit chip (lOa) disposed on a module (10), including a power bus means (14) for providing a supply of power, a printed circuit board (12), and said module mounted on said printed circuit board, characterized by: voltage tab means (16) connected to said module (10) for supplying power directly to said module when power is supplied to said tab means; and connection means (22) interconnected between said tab means and said power bus means for supplying power from the power bus means directly to said module via said tab means.
Claim 3
Dependent Claim 134 words
An electronic module, comprising: a substrate (10); at least one integrated circuit chip (lOa) mounted on said substrate; a plurality of metallization layers (10c, d) disposed longitudinally and transversely within said substrate, each of the layers being approximately parallel to one another; a plurality of plated vias (10e) disposed orthogonally with respect to said metallization layers, at least two plated vias electrically connecting said integrated circuit chip to two corresponding metallization layers; and characterized by: plural tab means (16) mounted on the edge of said substrate (10) and electrically connected (26, 24) to the edge (10cl) of said two corresponding metallization layers for conducting a current and a voltage directly from a power source to said integrated circuit chip and for conducting a return current from the integrated circuit chip to a ground potential.
Claim 4
Dependent Claim 134 words
An electronic module, comprising: a substrate (10); at least one integrated circuit chip (lOa) mounted on said substrate; a plurality of metallization layers (10c, d) disposed longitudinally and transversely within said substrate, each of the layers being approximately parallel to one another; a plurality of plated vias (10e) disposed orthogonally with respect to said metallization layers, at least two plated vias electrically connecting said integrated circuit chip to two corresponding metallization layers; and characterized by: plural tab means (16) mounted on the edge of said substrate (10) and electrically connected (26, 24) to the edge (10cl) of said two corresponding metallization layers for conducting a current and a voltage directly from a power source to said integrated circuit chip and for conducting a return current from the integrated circuit chip to a ground potential.
Claim 5
Dependent Claim 106 words
An electronic module in accordance with claim 2 further comprising: at least two additional plated vias (lOe) electrically connected on one end to said integrated circuit chip; and power distribution stripe means (10g) disposed on the bottom surface of said substrate (10), connected to the other end of said two additional plated vias, and connected to said tab means (16) for conducting a current from said tab means to said integrated circuit chip by way of one of said additional plated vias and for conducting a return current from said integrated circuit chip to said ground potential by way of another of said additional plated vias.
Claim 6
Independent Claim 62 words
A method of powering an electronic module (10) mounted on a printed circuit board (12), said module being supplied with power from a power distribution bus (14), characterized by the step of: connecting (22, 16, 26, 24) said module directly to said power distribution bus, said module being devoid of any connection to said bus by way of said printed circuit board.
Claim 7
Independent Claim 62 words
A method of powering an electronic module (10) mounted on a printed circuit board (12), said module being supplied with power from a power distribution bus (14), characterized by the step of: connecting (22, 16, 26, 24) said module directly to said power distribution bus, said module being devoid of any connection to said bus by way of said printed circuit board.

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