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EP0154720A1
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EP
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Polyamic acid copolymer solutions for improved semiconductor manufacturing
Assignee: International Business Machines Corp
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Filing: 1984-12-27
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Granted: —
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Expires: 2004-12-27
Abstract
Abstract A polyamic acid copolymer forming a polyimide comprising, in mole percent, from 5 to 45 percent pyromellitic dianhydride, from 5 to 45 percent oxydiphthalic dianhydride, and about 50 percent of oxydianiline is disclosed. Polyimides formed by curing the copolymer are also disclosed as is a process for forming a heat sealable coating on or dielectric isolation layer within electronic circuitry using the copolymer.
Inventors
- 👤 Harold George Linde
- 👤 Michael Wilford Macintyre
- 👤 William Thomas Motsiff
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 21:08
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; C; C08; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1067; C08G73/1071; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/303; H01B3/306; H10P14/63; H10P14/6326; H10P14/6342; H10W; H10W74/00; H10W74/40; H10W74/47
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
31 words
Polyamic acid copolymer system forming a polyimide comprising, in mole percent, from 5 to 45 percent pyromellitic dianhydride, from 5 to 45 percent oxydiphthalic dianhydride, and about 50 percent of oxydianiline.
Claim 2
Dependent Claim
31 words
Polyamic acid copolymer system forming a polyimide comprising, in mole percent, from 5 to 45 percent pyromellitic dianhydride, from 5 to 45 percent oxydiphthalic dianhydride, and about 50 percent of oxydianiline.
Claim 3
Dependent Claim
9 words
Polyimide formed by curing the copolymer of claim 1.
Claim 4
Dependent Claim
39 words
Process for forming a heat sealable coating on or dielectric isolation layer within electronic circuitry: by applying to said circuitry a filler-free coating material which consists essentially of the polyamic acid copolymer of claim 1 and curing the same.
References Cited (Backward Citations)
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