EP0152189A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Bonding electrical conductors and bonded products
Assignee: Luc Technologies Ltd
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Filing: 1985-01-21
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Granted: —
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Expires: 2005-01-21
Abstract
Abstract Bonds between a contact area of a circuit of a semiconductor and a conductor are formed by applying a rotating tool to an opposed surface of the conductor or to an intervening material superposed on it. The conductor may be laminated to one or more layers of insulant material and when that material is for example polyester, the bond may be formed without prior removal of the insulant from between the contact area and the conductor; it is displaced by the effect of the tool. The areas and conductors may be in an array and the tool be brought across the members of the array in succession.
Inventors
- 👤 Patrick Benjamin Ryan
- 👤 Penelope Jane Vesey Luc
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 20:14
CPC Classifications
H; H10; H10W; H10W72/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149; Y10T29/49204; Y10T29/49208; Y10T29/4921; Y10T29/49218; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
107 words
A method of bonding a conductor to a contact area of a circuit of a semi-conductor characterized in that a first surface of the conductor is placed on a first surface of the contact area either directly or with the interposition of a layer of another material and the first surfaces are bonded together to form a permanent, electrically-conductive bond by contacting a rotating tool onto a working surface to generate a frictional action between them, the working surface either being a second surface of the conductor opposed to the first surface or a surface of another material superposed over the said second surface of the conductor.
Claim 2
Independent Claim
107 words
A method of bonding a conductor to a contact area of a circuit of a semi-conductor characterized in that a first surface of the conductor is placed on a first surface of the contact area either directly or with the interposition of a layer of another material and the first surfaces are bonded together to form a permanent, electrically-conductive bond by contacting a rotating tool onto a working surface to generate a frictional action between them, the working surface either being a second surface of the conductor opposed to the first surface or a surface of another material superposed over the said second surface of the conductor.
Claim 3
Dependent Claim
17 words
A method according to claim 1 wherein the first surfaces of the conductors are in direct contact.
Claim 4
Dependent Claim
44 words
A method according to claim 1 wherein there is a said layer between the first surfaces, this layer being of an insulant material on the first surface of the conductor, and the bonding process displacing the insulant from between the conductor and contact area.
Claim 5
Dependent Claim
12 words
A method according to claim 3 wherein the insulant material is polyester.
Claim 6
Independent Claim
19 words
A method according to any one of the preceding claims wherein the contact area is of a semi-conductor material.
Claim 7
Independent Claim
22 words
A method according to any one of claims 1 to 4 wherein the contact area is a metallic pad on the semi-conductor.
Claim 8
Independent Claim
19 words
A method according to any one of the preceding claims wherein the conductor is a conductor of a lead-frame.
Claim 9
Independent Claim
32 words
A method according to any one of the preceding claims wherein the conductor and contact area are members of respective arrays and the rotating tool is brought in succession along the arrays.
Claim 10
Dependent Claim
38 words
An assembly of a circuit of a semi-conductor and a conductor external of the circuit wherein a contact area of the circuit is bonded to the conductor by a method according to any one of the preceding claims.
Claim 11
Dependent Claim
58 words
An assembly of a circuit of a semi-conductor and a conductor external of the circuit wherein a contact area of the circuit is bonded to the conductor, the conductor being in a laminate of conductor and insulant, the bond between conductor and contact area being free of insulant but having beyond its boundary insulant displaced from between them.
Claim 12
Dependent Claim
58 words
An assembly of a circuit of a semi-conductor and a conductor external of the circuit wherein a contact area of the circuit is bonded to the conductor, the conductor being in a laminate of conductor and insulant, the bond between conductor and contact area being free of insulant but having beyond its boundary insulant displaced from between them.
Claim 13
Dependent Claim
11 words
An assembly according to claim 10 wherein the insulant is polyester.
Claim 14
Dependent Claim
27 words
An assembly according to claim 9 or claim 10 wherein at least one of the external conductors connects together different elements of the circuit of the semi-conductor.
References Cited (Backward Citations)
No citation records indexed.
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