EP0151546A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Printed circuit board assembly having a liquid-cooling module system
Assignee: Fujitsu Ltd
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Filing: 1985-01-22
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Granted: —
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Expires: 2005-01-22
Abstract
Abstract A printed circuit board assembly having a printed circuit board (22) mounting, on both faces, heat generative electronic circuit components (26), such as integrated circuit chips, and a pair of liquid-cooling modules (30 a, b) arranged both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid-cooling plate (32) having liquid coolant supply heads (36) and a plurality of resilient heat transfer units (40) held by the liquid-cooling plate and arranged in compression contact with the electronic circuit components (26) on both faces (24a, b) of the printed circuit board (22).
Inventors
- 👤 Haruhiko Yamamoto
- 👤 Kouji Katsuyama
- 👤 Mitsuhiko Nakata
- 👤 Shinichi Kikuchi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 02:34
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20218; H05K7/20254; H10; H10W; H10W40/00; H10W40/40; H10W40/47; H10W40/475; H05K7/20272; H10W40/70; H10W40/77; H10W40/772
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
181 words
A printed circuit board assembly comprising: a printed circuit board having first and second faces for mounting thereon at least one electronic circuit component, respectively, and; a pair of first and second liquid-cooling modules arranged on both sides of said printed circuit board for removing heat generated by said electronic circuit component mounted on respective said first and second faces of said printed circuit board, each of said first and second liquid-cooling modules comprising a cooling plate arranged in such a manner that it is spaced apart from the associated one of said first and second faces of said printed circuit board and having therein passage means for flowing a liquid coolant under pressure, and resilient heat transfer means intervened between said cooling plate and said associated one of said first and second faces of said printed circuit board in substantial alignment with said electronic circuit component, said resilient heat transfer means having, at one end thereof, a heat transfer plate cooled by said liquid coolant fed from said cooling plate, and arranged in compression contact with said electronic circuit component.
Claim 2
Dependent Claim
181 words
A printed circuit board assembly comprising: a printed circuit board having first and second faces for mounting thereon at least one electronic circuit component, respectively, and; a pair of first and second liquid-cooling modules arranged on both sides of said printed circuit board for removing heat generated by said electronic circuit component mounted on respective said first and second faces of said printed circuit board, each of said first and second liquid-cooling modules comprising a cooling plate arranged in such a manner that it is spaced apart from the associated one of said first and second faces of said printed circuit board and having therein passage means for flowing a liquid coolant under pressure, and resilient heat transfer means intervened between said cooling plate and said associated one of said first and second faces of said printed circuit board in substantial alignment with said electronic circuit component, said resilient heat transfer means having, at one end thereof, a heat transfer plate cooled by said liquid coolant fed from said cooling plate, and arranged in compression contact with said electronic circuit component.
Claim 3
Dependent Claim
77 words
A printed circuit board assembly according to claim 1, wherein said electronic circuit component on said respective first and second faces of said printed board comprises a semiconductor chip having a top face thereof to which a heat dissipation plate having a surface area larger than that of said top face of said semiconductor chip is attached, said heat dissipation plate being in compression contact with said heat transfer plate of associated said resilient heat transfer means.
Claim 4
Dependent Claim
47 words
A printed circuit board assembly according to claim 2, further comprising a heat transfer sheet intervened between said heat transfer plate of associated said resilient heat transfer means and said heat dissipation plate of said semiconductor chip, said heat transfer sheet being compliant to compression acting thereon.
Claim 5
Dependent Claim
34 words
A printed circuit board assembly according to claim 3, wherein said heat transfer and dissipation plates are made of metal, respectively, and wherein said intervened heat transfer sheet is made of electrically insulating material.
Claim 6
Dependent Claim
51 words
A printed circuit board assembly according to claim 1, wherein said electronic circuit component mounted on said respective first and second faces of said printed circuit board comprises a bare chip having a top face thereof in compression contact with said heat transfer plate of associated said resilient heat transfer means.
Claim 7
Dependent Claim
46 words
A printed circuit board assembly according to claim 5, further comprising a heat transfer sheet intervened between said top face of said bare chip and said heat transfer plate of associated said resilient heat transfer means, said heat transfer sheet being compliant to compression acting thereon.
Claim 8
Dependent Claim
64 words
A printed circuit board assembly according to claim 6, wherein said bare chip is mounted on respective said first and second faces of said printed circuit board so as to have a predetermined electric voltage, wherein said heat transfer plate of associated said resilient heat transfer means is made of metal, and wherein said intervened heat transfer sheet is made of electrically insulating material.
Claim 9
Dependent Claim
52 words
A printed circuit board assembly according to claim 1, wherein said cooling plate is provided with at least one liquid coolant supply heat means for supplying a flow of said liquid coolant under pressure to said resilient heat transfer means thereby cooling said heat transfer plate of said resilient heat transfer means.
Claim 10
Dependent Claim
79 words
A printed circuit board assembly according to claim 8, wherein said resilient heat transfer means comprises a flexible and resilient hollow member having two spaced open ends defining therebetween a hollow chamber for receiving therein said flow of said liquid coolant under pressure, one of said two spaced open ends being connected to said cooling plate around said liquid coolant supply head means and the other of said two spaced open ends being closed by said heat transfer plate.
Claim 11
Dependent Claim
140 words
A printed circuit board assembly according to claim 1, wherein a plurality of said electronic circuit components are mounted on respective said first and second faces of said printed circuit board, wherein each of said first and second liquid-cooling modules comprises a plurality of resilient heat transfer.means arranged in substantial alignment with said plurality of said electronic circuit components of associated one of said first and second faces of said printed circuit board, and wherein said cooling plate of each of said first and second liquid-cooling modules comprises a plurality of liquid coolant supply head means arranged in alignment with associated said plurality of resilient heat transfer means of each of said first and second liquid-cooling modules for supplying a flow of said liquid coolant under pressure from said passage means to associated said plurality of resilient heat transfer means.
Claim 12
Dependent Claim
86 words
ll. A printed circuit board assembly according to claim 10, wherein each of said liquid coolant supply heat means of said each cooling plate comprises a coolant chamber fluidly connected to associated said each resilient heat transfer means and closed by said heat transfer plate of associated said each resilient heat transfer means, said coolant chamber being provided with a liquid coolant inlet means for introducing therein said liquid coolant under pressure and a liquid coolant outlet means for discharging therefrom said liquid coolant under pressure.
Claim 13
Dependent Claim
71 words
A printed circuit board assembly according to claim 11, wherein said liquid coolant inlet means of said plurality of liquid coolant supply head means comprise a liquid coolant inlet nozzle, respectively, for supplying said liquid coolant toward said heat transfer plates of associated said resilient heat transfer means, said liquid coolant inlet nozzles being tightly fitted in bores formed in respective said cooling plates of said first and second liquid-cooling modules.
Claim 14
Dependent Claim
51 words
A printed circuit board assembly according to claim 12, wherein said bores formed in said cooling plates of said first and second liquid-cooling modules are all inclined with respect to line vertical to said heat transfer plates of associated said resilient heat transfer means and arranged in parallel with one enother.
Claim 15
Dependent Claim
103 words
A printed circuit board assembly according to claim 11, wherein each of said liquid coolant chambers of respective cooling plates of said first and second liquid-cooling modules is a cylindrical chamber having a central axis thereof vertical to said heat transfer plate of associated said resilient heat transfer means and wherein said liquid coolant inlet means of said cylindrical liquid coolant chamber is disposed in a plane separate from a plane containing therein said central axis so that said liquid coolant inlet means may introduce said liquid coolant under'pressure into said cylindrical liquid coolant chamber as a spiral flow of said liquid coolant.
Claim 16
Dependent Claim
94 words
A printed circuit board assembly according to claim 11, wherein said liquid coolant chambers of said liquid coolant supply head means are arranged in alignment with one another along a straight line parallel with associated one of said first and second faces of said printed circuit board so as to form a set of liquid coolant chambers fluidly intercommunicating with one another in series through liquid communication of said liquid coolant outlet means and said liquid coolant inlet means of adjacent two said liquid coolant chambers via said passage means of said cooling plate.
Claim 17
Dependent Claim
38 words
A printed circuit board assembly according to claim 15, wherein a plurality of sets of said liquid coolant chambers are arranged in parallel with one another in respective said cooling plates of said first and second liquid-cooling modules.
Claim 18
Dependent Claim
52 words
A printed circuit board assembly according to claim 16, wherein said plurality of sets of liquid coolant chambers are fluidly connected to one another by means of additional passage means so that an equal amount of said liquid coolant under pressure flows through said plurality of sets of liquid coolant chambers, respectively.
Claim 19
Dependent Claim
127 words
A printed circuit board assembly according to claim 17, wherein respective said sets of liquid coolant chambers of each said cooling plate of each of said first and second liquid-cooling modules are. connected to a common liquid inlet passage via respective first connecting corners having different curvatures and to a common liquid outlet passage via respective second connecting corners having different curvatures, said common liquid inlet passage being fluidly connected to a liquid coolant supply source and said common liquid outlet passage being fluidly connected to a heat exchange means, and wherein said curvatures of at least one of said first and second connecting corners are determined so that an equal amount of said liquid coolant under pressure flows through said sets of liquid coolant chambers, respectively.
References Cited (Backward Citations)
No citation records indexed.
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