Thermoplastic modified epoxy compositions

Claim 2

1 . A thermoplastic modified epoxy composition comprising: (a) a bis(2.3-epoxycyclopentyl) ether, (b) a diamine hardener selected from one or more of 4.4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane, 4,4'-diaminodiphenyl sulfone. 3,3'-diaminodiphenyl sulfone. 3,3'-diaminobenzophenone, m-phenylenediamine. p-phenylenediamine. 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide. 1,4-bis(p-aminophenoxy)benzene, 1.4-bis(m-aminophenoxy)benzene, 1,3-bis-(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy) benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4,4-diaminodiphenyl sulfone, and (c) a thermoplastic selected from one or more of the following: polycaprolactone. polyetherimide. phenoxy, polyarylether of the formula: wherein R is selected from the residuum of hydroquinone. dihydroxydiphenyl sulfone or 4,4'-biphenol, a is 0 or 1, b is 1 or greater, and c is 5 to 100.

Claim 3

A composition as defined in claim 1 which contains an epoxy resin containing two or more epoxy groups and which is different from (a).

Claim 4

A composition as defined in claims 1 or 2 wherein the epoxy resin is of the following structure: where n has a value from about 0 to about 15, a phenol-formaldehyde novolak of the following formula: wherein n = 0.1 to 8 and R = hydrogen or a cresol-formaldehyde novolak of the following formula: wherein n = 0.1 to 8 and R is CH 3 .

Claim 5

A composition as defined in claim 1 or 2 wherein the epoxy resin is N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenyl methane, N,N,N',N'-tetraglycidylxylylene- diamine, N,N-diglycidyl toluidene, N,N-diglycidyl aniline, N,N,N',N'-tetraglycidylbis(methylamino)cyclohexane, diglycidyl isophthalate or diglycidyl terephthalate.

Claim 6

A composition as defined in claims 1 or 2 wherein the epoxy resin is 0,N,N-triglycidyl-4-amino phenol, O,N,N-triglycidyl-3-aminophenol, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexane carboxylate or a N,N'-diglycidyl derivative of dimethylhydantoin.

Claim 7

A composition as defined in any of the claims 1 to 5 which contains a structural fiber selected from carbon, graphite, glass, silicon carbide, poly(benzothiazole), poly(benzimidazole), poly(benzoxazole), alumina, titania, boron, and aromatic polyamides.

Claim 8

A composition as defined in any of the claims 1 to 6 which contains an accelerator which initiates the rate of cure.

Claim 9

A prepreg comprising (a) a bis(2,3-epoxycyclopentyl)ether, (b) a diamine hardener selected from one or more of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane. 4,4'-diaminodiphenyl sulfone. 3,3'-diaminodiphenyl sulfone. 3,3'-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 1.4-bis(p-aminophenoxy)benzene. 1.4-bis(m-aminophenoxy)benzene. 1.3-bis-(m-aminophenoxy)benzene, 1.3-bis(p-aminophenoxy) benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4.4-diaminodiphenyl sulfone, (c) a thermoplastic selected from one or more of the following: polycaprolactone. polyetherimide. phenoxy, polyarylether of the formula: wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4'-biphenol, a is 0 or 1, b is 1 or greater, and c is 5 to 100, and (d) a structural fiber.

Claim 10

A prepreg comprising (a) a bis(2,3-epoxycyclopentyl)ether, (b) a diamine hardener selected from one or more of 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane. 4,4'-diaminodiphenyl sulfone. 3,3'-diaminodiphenyl sulfone. 3,3'-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 1.4-bis(p-aminophenoxy)benzene. 1.4-bis(m-aminophenoxy)benzene. 1.3-bis-(m-aminophenoxy)benzene, 1.3-bis(p-aminophenoxy) benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4.4-diaminodiphenyl sulfone, (c) a thermoplastic selected from one or more of the following: polycaprolactone. polyetherimide. phenoxy, polyarylether of the formula: wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4'-biphenol, a is 0 or 1, b is 1 or greater, and c is 5 to 100, and (d) a structural fiber.

Claim 11

A prepreg as defined in claim 8 which contains an accelerator which increases the rate of cure.

Claim 12

A composite comprising: (i) a matrix resin comprising: (a) bis(2,3-epoxycyclopentyl)ether, (b) a hardener selected from one or more of 4.4 1- diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane, 4,4'-diaminodiphenyl sulfone. 3,3'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 1.4-bis(p-aminophenoxy)benzene. 1,4-bis(m-aminophenoxy)benzene, 1,3-bis-(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy) benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4.4-diaminodiphenyl sulfone, (c) a thermoplastic selected from one or more of the following: polycaprolactone, polyetherimide, phenoxy, polyarylether of the formula: wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4'-biphenol, a is O or 1, b is 1 or greater, and c is 5 to 100, and (ii) a structural fiber.

Claim 13

A composite comprising: (i) a matrix resin comprising: (a) bis(2,3-epoxycyclopentyl)ether, (b) a hardener selected from one or more of 4.4 1- diaminodiphenyl ether, 4,4'-diaminodiphenyl methane, 3,3'-diaminodiphenyl methane, 4,4'-diaminodiphenyl sulfone. 3,3'-diaminodiphenyl sulfone, 3,3'-diaminobenzophenone, m-phenylenediamine, p-phenylenediamine, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenyl sulfide, 1.4-bis(p-aminophenoxy)benzene. 1,4-bis(m-aminophenoxy)benzene, 1,3-bis-(m-aminophenoxy)benzene, 1,3-bis(p-aminophenoxy) benzene, adducts of epoxy resin with the above diamines, or the adducts of a bisphenol-A epoxy resin with a molar excess of 4.4-diaminodiphenyl sulfone, (c) a thermoplastic selected from one or more of the following: polycaprolactone, polyetherimide, phenoxy, polyarylether of the formula: wherein R is selected from the residuum of hydroquinone, dihydroxydiphenyl sulfone or 4,4'-biphenol, a is O or 1, b is 1 or greater, and c is 5 to 100, and (ii) a structural fiber.

Claim 14

A composite as defined in claim 10 wherein the epoxy resin was cured in the presence of an accelerator which increased the rate of cure.