EP0148157A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Printed circuit boards
Assignee: Resonac Holdings Corp
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Filing: 1985-01-03
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Granted: —
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Expires: 2005-01-03
Abstract
Abstract A flexible, heat resistant printed circuit board which comprises a laminate of:(A) a thin-wall body having a thickness of from 3 µm to less than 5 mm which is a cross-linked product of a mixture composed of (1) at least one of an ethylene-acrylic acid copolymer and an ethylene-methacrylic acid copolymer, and (2) a saponified product of an ethylene-vinyl acetate copolymer, wherein the mixing proportion of copolymer (1) in the mixture is from 20 to 80% by weight and the mixture is cross-linked such that after extraction of the cross-linked product with a boiled toluene for three hours the amount of residue having a size of 0.1 µm or more is at least 80% by weight based on the weight of the cross-linked product, and(B) an electrically conductive metal layer having a thickness of from 100 A to 400 µm.The boards have excellent heat resistance, electrical insulating properties, flexibility, chemical resistance, dimensional stability, etc.
Inventors
- 👤 Masahiko Maeda
- 👤 Kazuya Showa Denko Shataku 235 Nagata
- 👤 Taketsugu Otani
- 👤 Yasutoki Saito
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 09:55
CPC Classifications
C; C08; C08L; C08L23/00; C08L23/02; C08L23/04; C08L23/08; C08L23/0846; C08L23/0853; C08L23/0861; C08L23/0869; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0326; H05K1/0353; H05K1/036; H05K1/0373; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/38; H05K3/388; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31678; Y10T428/31692
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
139 words
A printed circuit board which comprises a laminate of: (A) a thin-wall body having a thickness of from 3 µm to less than 5 mm which is a cross-linked product of a mixture composed of (1) at least one of an ethylene-acrylic acid copolymer and an ethylene-methacrylic acid copolymer, and (2) a saponified product of an ethylene-vinyl acetate copclymer, wherein the mixing proportion of copolymer (1) in the mixture is from 20 to 80% by weight and the mixture is cross-linked such that after extraction of the cross-linked product with a boiled toluene for three hours the amount of residue having a size of 0.1 µm or more is at least 80% by weight based on the weight of the cross-linked product, and (B) an electrically conductive metal layer having a thickness of from 100 A to 400 µm.
Claim 2
Dependent Claim
139 words
A printed circuit board which comprises a laminate of: (A) a thin-wall body having a thickness of from 3 µm to less than 5 mm which is a cross-linked product of a mixture composed of (1) at least one of an ethylene-acrylic acid copolymer and an ethylene-methacrylic acid copolymer, and (2) a saponified product of an ethylene-vinyl acetate copclymer, wherein the mixing proportion of copolymer (1) in the mixture is from 20 to 80% by weight and the mixture is cross-linked such that after extraction of the cross-linked product with a boiled toluene for three hours the amount of residue having a size of 0.1 µm or more is at least 80% by weight based on the weight of the cross-linked product, and (B) an electrically conductive metal layer having a thickness of from 100 A to 400 µm.
Claim 3
Dependent Claim
41 words
A printed circuit board as in claim 1, which further comprises (C) a thermosetting resin layer having a thickness of from 0.005 to 4 mm, and the electrically conductive metal layer and the thermosetting layer are laminated via said thin-wall body.
Claim 4
Dependent Claim
54 words
A printed circuit board as in claim 1, which further comprises (D) a heat resistant thermoplastic polymer layer having a glass transition temperature of 200 to 400°C and a thickness of from 0.005 to 4 mm; and the electrically conductive metal layer and the heat resistant polymer layer are laminated via said thin-wall body.
Claim 5
Dependent Claim
63 words
A printed circuit board as in claim 1, which further comprises (E) an electrically conductive metal layers, wherein the thickness of a first electrically conductive metal layer is from 100 A to 400 µm and the thickness of a second electrically conductive metal layer is from 5 um to 200 um; and said electrically conductive metal layers are laminated via said thin-wall body.
Claim 6
Dependent Claim
96 words
A printed circuit board as in claim 1, wherein the thin-wall body is obtained by extruding the mixture of copolymer (1) and copolymer (2) into a thin-wall form at a temperature of up to 250°C under such conditions that when the extruded mixture is extracted in a boiled toluene for 3 hours the amount of residue having a size of 0.1 µm or more is not more than 15% by weight based on the weight of the extruded mixture, and heating and pressure-treating the extruded mixture at a temperature of from 100 to 400°C to crosslink.
Claim 7
Dependent Claim
96 words
A printed circuit board as in claim 2, wherein the thin-wall body is obtained by extruding the mixture of copolymer (1) and copolymer (2) into a thin-wall form at a temperature of up to 250°C under such conditions that when the extruded mixture is extracted in a boiled toluene for 3 hours the amount of residue having a size of 0.1 µm or more is not more than 15% by weight based on the weight of the extruded mixture, and heating and pressure-treating the extruded mixture at a temperature of from 100 to 400°C to crosslink.
Claim 8
Dependent Claim
96 words
A printed circuit board as in claim 3, wherein the thin-wall body is obtained by extruding the mixture of copolymer (1) and copolymer (2) into a thin-wall form at a temperature of up to 250°C under such conditions that when the extruded mixture is extracted in a boiled toluene for 3 hours the amount of residue having a size of 0.1 µm or more is not more than 15% by weight based on the weight of the extruded mixture, and heating and pressure-treating the extruded mixture at a temperature of from 100 to 400°C to crosslink.
Claim 9
Dependent Claim
96 words
A printed circuit board as in claim 4, wherein the thin-wall body is obtained by extruding the mixture of copolymer (1) and copolymer (2) into a thin-wall form at a temperature of up to 250°C under such conditions that when the extruded mixture is extracted in a boiled toluene for 3 hours the amount of residue having a size of 0.1 µm or more is not more than 15% by weight based on the weight of the extruded mixture, and heating and pressure-treating the extruded mixture at a temperature cf from 100 to 400°C to crosslink.
Claim 10
Dependent Claim
26 words
A printed circuit board as in claim 5, wherein said heating and pressure-treating is carried out at a pressure of at least 5 kg/cm 2 .
Claim 11
Dependent Claim
26 words
A printed circuit board as in claim 6, wherein said heating and pressure-treating is carried out at a pressure of at least 5 kg/cm 2 .
Claim 12
Dependent Claim
25 words
A printed circuit board as in claim 7, wherein said heating and pressure-treating is carried out at a pressure of at least 5 kg/cm .
Claim 13
Dependent Claim
26 words
A printed circuit board as in claim 8, wherein said heating and pressure-treating is carried out at a pressure of at least 5 kg/cm 2 .
Claim 14
Dependent Claim
28 words
A printed circuit board as in claim 1, wherein said thin-wall body contains an inorganic filler having a thermal conductivity of 1 x 10 -3 cal/°C.cm.sec or more.
Claim 15
Dependent Claim
28 words
A printed circuit board as in claim 2, wherein said thin-wall body contains an inorganic filler having a thermal conductivity of 1 x 10 -3 cal/°C.cm.sec or more.
Claim 16
Dependent Claim
28 words
A printed circuit board as in claim 3, wherein said thin-wall body contains an inorganic filler having a thermal conductivity of 1 x 10 -3 cal/°C.cm.sec or more.
Claim 17
Dependent Claim
28 words
A printed circuit board as in claim 4, wherein said thin-wall body contains an inorganic filler having a thermal conductivity of 1 x 10 -3 cal/°C.cm.sec or more.
Claim 18
Dependent Claim
30 words
A printed circuit board as in claim 1, wherein said electrically conductive metal layer is formed by metal deposition to have a thickness of from 100 A to 100 µm.
Claim 19
Dependent Claim
30 words
A printed circuit board as in claim 2, wherein said electrically conductive metal layer is formed by metal deposition to have a thickness of from 100 A to 100 µm.
Claim 20
Dependent Claim
30 words
A printed circuit board as in claim 3, wherein said electrically conductive metal layer is formed by metal deposition to have a thickness of from 100 A to 100 µm.
Claim 21
Dependent Claim
31 words
A printed circuit board as in claim 4, wherein said first electrically coductive metal layer is formed by metal deposition to have a thickness of from 100 A to 100 µm.
References Cited (Backward Citations)
No citation records indexed.
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