Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
107 words
A semiconductor integrated circuit device comprising : a semiconductor chip (22;32) having an output terminal and mounted in a package (21;3l); an outer lead (23;33)positioned on said package; and a wiring board (26;38) interconnecting between said semiconductor chip and said outer lead; characterized in that : said wiring board (26;38) comprising a transmission line fabricated on an insulating plate (28; 38a, 38b,38c), said transmission line having predetermined transmission characteristics by arranging a signal line conductor and a ground conductor plane with a predetermined spacing therebetween, and said signal line conductor interconnecting between an output terminal (25; 35) of said semiconductor chip and said outer lead (23; 33).
Claim 2
Dependent Claim
107 words
A semiconductor integrated circuit device comprising : a semiconductor chip (22;32) having an output terminal and mounted in a package (21;3l); an outer lead (23;33)positioned on said package; and a wiring board (26;38) interconnecting between said semiconductor chip and said outer lead; characterized in that : said wiring board (26;38) comprising a transmission line fabricated on an insulating plate (28; 38a, 38b,38c), said transmission line having predetermined transmission characteristics by arranging a signal line conductor and a ground conductor plane with a predetermined spacing therebetween, and said signal line conductor interconnecting between an output terminal (25; 35) of said semiconductor chip and said outer lead (23; 33).
Claim 3
Dependent Claim
43 words
A semiconductor integrated circuit device according to claim 1, wherein said transmission line is in the form of coplanar guide, which comprises a signal line conductor (20a, 20b,...) and a ground conductor (21a) formed on a common surface of said insulating plate (28).
Claim 4
Dependent Claim
50 words
A semiconductor integrated circuit device according to claim 1, wherein said transmission line is in the form of strip line structure which comprises a signal line conductor (19a) formed on bottom side of said insulating plate (28) and a ground conductor (19c) formed on upper side of said insulating plate.
Claim 5
Dependent Claim
33 words
A semiconductor integrated circuit device according to anyone of claims 1 to 3, characterized in that said transmission line has an impedance matching resistor (20d) which is mounted on the insulating plate (28).
Claim 6
Dependent Claim
42 words
A semiconductor integrated circuit device according to any one of claims 1 to 3, characterized in that said transmission line has a wave forming circuit (20e) which is loaded on the insulating plate (28), and coupled to said signal line conductor (20a).
Claim 7
Dependent Claim
26 words
A semiconductor integrated circuit device according to any one of claims 1 to 5, characterized in that said wiring board comprises a multi-layered wiring board (38).
Claim 8
Dependent Claim
57 words
A semiconductor integrated circuit device according to claim 6, characterized in that said multi-layered wiring board has a plurality of insulating plates (38a, 38b, 38c) and a plurality of levels of signal line conductors, said signal line conductors being interconnected through holes formed in each insulating plate and said insulating plates being piled one above the other.