Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
134 words
A sensor characterized by a housing comprising: a) a base member (10) having a flow channel (11) formed therein, the base member (10) comprising means (22,30) for mounting the sensor (18), the base member (10)also comprising the body of a standard semiconductor package; and b) standard semiconductor package conductors (12) integral to the base member (10), each conductor (12) having first (13) and second (16, 22) terminal portions, the conductors (12) and terminal portions being positioned so that the first terminal portion (13) of a plurality of conductors (12) are each adapted to connect to a higher level package (15) adapted for receiving a standard semiconductor package (10) and so that the second terminal portion (16, 22) of a plurality of conductors (12) are each adapted for electrical connection to the flow sensor (18).
Claim 2
Dependent Claim
134 words
A sensor characterized by a housing comprising: a) a base member (10) having a flow channel (11) formed therein, the base member (10) comprising means (22,30) for mounting the sensor (18), the base member (10)also comprising the body of a standard semiconductor package; and b) standard semiconductor package conductors (12) integral to the base member (10), each conductor (12) having first (13) and second (16, 22) terminal portions, the conductors (12) and terminal portions being positioned so that the first terminal portion (13) of a plurality of conductors (12) are each adapted to connect to a higher level package (15) adapted for receiving a standard semiconductor package (10) and so that the second terminal portion (16, 22) of a plurality of conductors (12) are each adapted for electrical connection to the flow sensor (18).
Claim 3
Dependent Claim
19 words
An apparatus of claim 1, characterized in that the standard semiconductor package (10) comprises a dual-in-line package (Fig. 7).
Claim 4
Dependent Claim
21 words
An apparatus according to claim 1, characterized in that the standard semiconductor package (10) comprises a pin array package (Fig. 9).
Claim 5
Dependent Claim
20 words
An apparatus according to claim 1, characterized in that the standard semiconductor package (10) comprises a single-in-line package (Fig. 6).
Claim 6
Dependent Claim
21 words
An apparatus according to claim 1, characterized in that the standard semiconductor package (10) comprises a leadless chip carrier (Fig. 8).
Claim 7
Independent Claim
36 words
An apparatus according to one of the claims 1 to 5, characterized b y means (16) for electrically connecting the second terminal portion (16, 22) of the conductors (12) to the sensor (18) by wire bonding.
Claim 8
Independent Claim
37 words
An apparatus according to one of the claims 1 to 5, characterized b y means (22, 24) for electrically connecting the second terminal portion (16, 22) of the conductors (12) to the sensor (18) by solderbump techniques.
Claim 9
Independent Claim
45 words
An apparatus according to one of the claims 1 to 7, characterized in that the means for mounting a flow sensor (18) comprises means (30; 22) for orienting the flow sensor for a desired response to the flow, preferably for optimum response to the flow.
Claim 10
Dependent Claim
38 words
An apparatus according to claim 8, characterized in that the means for mounting the flow sensor (18) comprises a cavity (30) in the base member (10) for receiving and positioning at least a portion of the flow sensor.
Claim 11
Independent Claim
35 words
An apparatus according to one of the claims 1 to 9, characterized in that the flow channel (11) comprises nonuniform dimensions for enhancing the velocity of the flow over the flow sensor (18) (Fig. 8).