EP0147807A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method for forming a substrate for tape automated bonding for electronic circuit elements
Assignee: Rogers Corp
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Filing: 1984-12-20
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Granted: —
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Expires: 2004-12-20
Abstract
Abstract A method and apparatus are presented for tape automated bonding of integrated circuits wherein a support ring (40) is formed in the feature window (36) to provide reinforcement for unsupported interconnection leads between the inner and outer lead bond sites.
Inventors
- 👤 Michael J. Maxwell
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-27 21:17
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/077; H10W70/00; H10W70/40; H10W70/453; H10W72/701; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T156/1057; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
197 words
- A method for forming a substrate for tape automated bonding for electronic circuit elements, including the steps of forming a film of insulating material to desired width and having first and second surfaces; applying a layer of adhesive to said first surface of said insulating film; removing material from said insulating film to form a preform of a feature window, the preform including a first opening and second opening means spaced from said first opening to define first web means between said first opening and second opening means; applying a support layer to said second surface of said insulating film; removing material from said insulating film to form third opening means spaced from said first opening and connecting said second opening means to define second web means between said first opening and said third opening means, said first opening, said second opening means and said third opening means cooperating to define a feature window, and said first and second web means being connected together and defining a support ring being supported on said support layer; and bonding a layer of electrically conductive material to said first surface of said insulating film, and to said support ring.
Claim 2
Dependent Claim
197 words
- A method for forming a substrate for tape automated bonding for electronic circuit elements, including the steps of forming a film of insulating material to desired width and having first and second surfaces; applying a layer of adhesive to said first surface of said insulating film; removing material from said insulating film to form a preform of a feature window, the preform including a first opening and second opening means spaced from said first opening to define first web means between said first opening and second opening means; applying a support layer to said second surface of said insulating film; removing material from said insulating film to form third opening means spaced from said first opening and connecting said second opening means to define second web means between said first opening and said third opening means, said first opening, said second opening means and said third opening means cooperating to define a feature window, and said first and second web means being connected together and defining a support ring being supported on said support layer; and bonding a layer of electrically conductive material to said first surface of said insulating film, and to said support ring.
Claim 3
Dependent Claim
23 words
- A method as claimed in Claim 1, including the step of removing said support from said second surface of said insulating film.
Claim 4
Dependent Claim
33 words
- A method as claimed in Claim 1, wherein the step of applying a layer of adhesive to said first surface of said insulating film includes applying a layer of head curable adhesive.
Claim 5
Dependent Claim
24 words
- A method as claimed in Claim 1, wherein said second opening means is a plurality of second openings spaced from said first opening.
Claim 6
Dependent Claim
31 words
- A method as claimed in Claims 1 or 4, wherein said third opening means is a plurality of third openings spaced from said first opening and interconnecting said second openings.
Claim 7
Dependent Claim
19 words
- A method as claimed in Claim 1, including the step of forming registration holes in said insulating film.
Claim 8
Dependent Claim
27 words
- A method as claimed in Claim 1, wherein said layer of adhesive and said support layer extend beyond second opening means and said third opening means.
Claim 9
Dependent Claim
57 words
- A method for tape automated bonding of electronic components, as claimed in anyone of Claims 1 to 7, including the steps of forming a circuit pattern in said layer of electrically conductive material with leads extending across said support ring, placing an electronic component within said support ring, and bonding said leads to said electronic component.
Claim 10
Dependent Claim
90 words
- A substrate for tape automated bonding of electronic components, the substrate having a layer (10) of insulating material, a layer (12) of adhesive material on a first surface of said insulating material, a layer (38) of electrically conductive material on said adhesive layer (12) and bonded by said adhesive layer to said insulating material, a feature window (36) in said layer (10) of insulating material, and a support ring (40) in said feature window (36), said support ring (40) being bonded to said layer (38) of electrically conductive material.
Claim 11
Dependent Claim
90 words
- A substrate for tape automated bonding of electronic components, the substrate having a layer (10) of insulating material, a layer (12) of adhesive material on a first surface of said insulating material, a layer (38) of electrically conductive material on said adhesive layer (12) and bonded by said adhesive layer to said insulating material, a feature window (36) in said layer (10) of insulating material, and a support ring (40) in said feature window (36), said support ring (40) being bonded to said layer (38) of electrically conductive material.
Claim 12
Dependent Claim
29 words
- A substrate as claimed in Claim 9, wherein said support ring (40) and said feature window (36) are formed by selective removal of material from said insulating material.
Claim 13
Dependent Claim
43 words
- A substrate as claimed in Claim 10, wherein said support ring (40) is supported on a temporary support (26) after formation of the support ring (40) and prior to bonding said support ring (40) to said layer (38) of electrically conductive material.
Claim 14
Dependent Claim
50 words
- A substrate as claimed in Claim 9, and further including electronic component means within said support ring (40) and circuit lead means defined in said layer (38) of electrically conductive material, said lead means being supported by said support ring (40) and being connected to said electronic component means.
References Cited (Backward Citations)
No citation records indexed.
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