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EP0142447A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Semiconductor package

Assignee: Fairchild Semiconductor Corp
•
Filing: 1984-11-13
•
Granted: —
•
Expires: 2004-11-13
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Abstract

Abstract An embodiment of the present invention relates to a plastic encapsulated semiconductor device having a lead frame with a plurality of leads, a silicon chip having at least one contact pad supported thereon, and a wire having one end ball-bonded to the pad and the other end bonded to one lead. The lead frame, wire and contact pad are all composed of the same metal or an alloy of that same metal. Preferably, the lead frame, wire and contact pad contain a major amount of aluminum. While electrolyte is present in the plastic encapsulation, the formation of electrochemical cells is inhibited since no diverse metals are present. Accordingly, galvanic corrosion is inhibited.

Inventors

  • 👤 William S. Phy

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 15:50
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W70/00; H10W70/40; H10W72/00; H10W72/01; H10W72/015; H10W72/01551; H10W72/071; H10W72/0711; H10W72/075; H10W72/07511; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 133 words
An electrical device, comprising: a metal lead frame (12) having a plurality of leads (14, 16, 18. 20, 22. 24, 26); a semiconductor element (28) having at least one metal contact pad (32) supported thereon; a metal wire (34) bonded to said contact pad (32) and to one lead (14) of said lead frame (12) to provide an electrical connection between the contact pad and the lead; and a plastic insulating and supporting material (36) encapsulating said semiconductor element (28), contact pad (32), wire (34) and portions of said leads; characterized in that: the metal wire (34). lead frame (12) and contact pad (32) are each composed of the same metal or alloys of that same metal so as to inhibit formation of electrochemical cells in the presence of electrolyte from the plastic.
Claim 2
Dependent Claim 133 words
An electrical device, comprising: a metal lead frame (12) having a plurality of leads (14, 16, 18. 20, 22. 24, 26); a semiconductor element (28) having at least one metal contact pad (32) supported thereon; a metal wire (34) bonded to said contact pad (32) and to one lead (14) of said lead frame (12) to provide an electrical connection between the contact pad and the lead; and a plastic insulating and supporting material (36) encapsulating said semiconductor element (28), contact pad (32), wire (34) and portions of said leads; characterized in that: the metal wire (34). lead frame (12) and contact pad (32) are each composed of the same metal or alloys of that same metal so as to inhibit formation of electrochemical cells in the presence of electrolyte from the plastic.
Claim 3
Dependent Claim 23 words
The device as recited in claim 1. characterized in that the lead frame, contact pad and wire contain a major amount of aluminum.
Claim 4
Dependent Claim 20 words
The device as recited in claim 2, characterized in that the major amount of aluminum is at least 90.0 %.
Claim 5
Independent Claim 34 words
The device of any one of claims 1 to 3, characterized in that the contact pad (32) is deposited aluminum, the wire (34) is aluminum and the lead frame (12) is stamped aluminum alloy.
Claim 6
Dependent Claim 20 words
The device of claim 4, characterized in that the aluminum wire (34) is ball-bonded to the aluminum contact pad (32).

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