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EP0142127A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Redundancy circuit for a semiconductor memory device

Assignee: Toshiba Corp
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Filing: 1984-11-07
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Granted: —
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Expires: 2004-11-07
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Abstract

Abstract A redundancy circuit for a semiconductor memory device of the byte configuration type, in which data is read out for each bit, is comprised of a main memory having a plurality of main memory cells arrayed in a matrix fashion, the matrix array being divided into memory sections (31, 32) in the column direction; a spare memory for saving defective memory cells contained in the main memory, the spare memory comprising spare rows (41-45) of a plurality of spare memory cells arranged in the row direction, the spare row being provided for each of the main memory sections; programmable spare row decoders (45-48) provided foreach row of spare memory cells and for independently selecting each row of the spare memory cell; and main-decoder-disable signal-generating circuits (49, 50) provided for each ofthe memory sections and for placing all of the row main decoders of the corresponding memory section in non-select state in response to a signal derived from the programmed spare row decoder of the corresponding memory section.

Inventors

  • 👤 Makoto C/O Patent Division Segawa
  • 👤 Shoji C/O Patent Division Ariizumi

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-02 20:18
CPC Classifications
G; G11; G11C; G11C29/00; G11C29/70; G11C29/78; G11C29/80; G11C29/808

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 171 words
A semiconductor memory device of the byte configuration type in which data is read out for each bit, characterized by comprising: a main memory having a plurality of memory cells arrayed in a matrix fashion, said matrix array being divided into a plurality of main memory sections (31, 32) in the column direction; a spare memory for saving defective memory cells contained in said main memory, the spare memory comprising spare rows (41-44) of a plurality of spare memory cells arranged in the row direction, the spare row being provided for each of said main memory sections; programmable spare row decoders (45-48) provided for each row of said spare memory cells, and for independently selecting each row of said spare memory cells; and main-decoder-disable signal generating circuits (49, 50) provided for each of said memory sections and for placing all of the row main decoders of the corresponding memory section in a non-select state in response to a signal derived from the programmed spare row decoder of said corresponding memory section.
Claim 2
Dependent Claim 171 words
A semiconductor memory device of the byte configuration type in which data is read out for each bit, characterized by comprising: a main memory having a plurality of memory cells arrayed in a matrix fashion, said matrix array being divided into a plurality of main memory sections (31, 32) in the column direction; a spare memory for saving defective memory cells contained in said main memory, the spare memory comprising spare rows (41-44) of a plurality of spare memory cells arranged in the row direction, the spare row being provided for each of said main memory sections; programmable spare row decoders (45-48) provided for each row of said spare memory cells, and for independently selecting each row of said spare memory cells; and main-decoder-disable signal generating circuits (49, 50) provided for each of said memory sections and for placing all of the row main decoders of the corresponding memory section in a non-select state in response to a signal derived from the programmed spare row decoder of said corresponding memory section.
Claim 3
Dependent Claim 20 words
The redundancy circuit according to claim 1, characterized in that the number of said memory sections (32, 33) is two.

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