EP0139924A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Sealant for integrated circuit modules, polyester suitable therefor and preparation of polyester
Assignee: International Business Machines Corp
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Filing: 1984-08-08
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Granted: —
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Expires: 2004-08-08
Abstract
Abstract Integrated circuit module wherein the cap is sealed to the substrate with a liquid crystalline polyester melt containing about 25 to about 100 mole percent of recurring Units I and about 75 to 0 mole percent of recurring Units II wherein and wherein each R and R, is arylene or cycloalkylene or alkylene or alkylidene.
Inventors
- 👤 James Economy
- 👤 John Richard Susko
- 👤 Willi Volksen
- 👤 Robin Anne Wheater
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 07:37
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; C; C08; C08G; C08G63/00; C08G63/02; C08G63/60; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/42; H01B3/421; H10W74/00; H10W74/10; H10W74/111; H10W74/127; H10W74/40; H10W74/47
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
92 words
Integrated circuit module including a substrate having electrically-conductive pins protruding therefrom having at least one integrated circuit chip attached to the top side of the substrate, a cap covering said at least one integrated circuit chip, characterized in that said cap is sealed to said substrate by a liquid crystalline polyester melt having about 25 to about 100 mole percent of recurring Units I and about 75 to 0 mole percent of recurring Units II wherein and wherein each R and R individually, is arylene, cycloalkylene, alkylene, or alkylidene, or mixtures thereof.
Claim 2
Dependent Claim
92 words
Integrated circuit module including a substrate having electrically-conductive pins protruding therefrom having at least one integrated circuit chip attached to the top side of the substrate, a cap covering said at least one integrated circuit chip, characterized in that said cap is sealed to said substrate by a liquid crystalline polyester melt having about 25 to about 100 mole percent of recurring Units I and about 75 to 0 mole percent of recurring Units II wherein and wherein each R and R individually, is arylene, cycloalkylene, alkylene, or alkylidene, or mixtures thereof.
Claim 3
Dependent Claim
31 words
Module of claim 1 wherein said polyester contains about 50 to about 100 mole percent of recurring Unit I and about 50 to about 0 mole percent of recurring Unit II.
Claim 4
Dependent Claim
31 words
Module of claim 1 wherein said polyester contains about 50 to about 90 mole percent of recurring Unit I and about 50 to about 10 mole percent of recurring Unit II.
Claim 5
Dependent Claim
31 words
Module of claim 1 wherein said polyester contains about 60 to about 80 mole percent of recurring Unit I and about 40 to about 20 mole percent of recurring Unit II.
Claim 6
Dependent Claim
50 words
Module of claim 1 wherein said arylene is substituted with a group selected from alkyl, aryl, alkaryl, aralkyl, alkoxy, or halo; or is unsubstituted and wherein the unsubstituted moiety of the arylene group contains 6-14 carbon atoms; said alkylene and alkylidene contain 1-6 carbon atoms; and said cycloalkylene is cyclohexylene.
Claim 7
Dependent Claim
18 words
Module of claim 1 wherein R is arylene and R 2 is phenylene or cyclohexylene or mixtures thereof.
Claim 8
Dependent Claim
9 words
Module of claim 6 wherein said arylene is phenylene.
Claim 9
Dependent Claim
25 words
Module of claim 7 wherein said phenylene is substituted with a group selected from CH 3 , OCH3, Cl, F, Br, phenyl, or mixtures thereof.
Claim 10
Dependent Claim
72 words
Method for sealing a cap to an integrated circuit carrier which comprises providing a thermoplastic liquid crystalline polyester having about 25 to about 100 mole percent of recurring Unit I and about 75 to 0 mole percent of recurring Unit II wherein and wherein each R and R 2 , individually, is arylene, cycloalkylene, alkylene, or alkylidene, or mixtures thereof between the carrier and cap, thereby sealing the cap to the carrier.
Claim 11
Dependent Claim
72 words
Method for sealing a cap to an integrated circuit carrier which comprises providing a thermoplastic liquid crystalline polyester having about 25 to about 100 mole percent of recurring Unit I and about 75 to 0 mole percent of recurring Unit II wherein and wherein each R and R 2 , individually, is arylene, cycloalkylene, alkylene, or alkylidene, or mixtures thereof between the carrier and cap, thereby sealing the cap to the carrier.
Claim 12
Dependent Claim
65 words
Polyester having recurring Units III and II wherein and wherein R 1 is selected from the group of alkyl, aryl, alkaryl, aralkyl, alkoxy, halo, or mixtures thereof and R 2 is selected from the group of phenylene, cyclohexylene, or mixtures thereof and wherein said polyester comprises about 50 to about 90 mole percent of III and about 50 to about 10 mole percent of II.
Claim 13
Dependent Claim
65 words
Polyester having recurring Units III and II wherein and wherein R 1 is selected from the group of alkyl, aryl, alkaryl, aralkyl, alkoxy, halo, or mixtures thereof and R 2 is selected from the group of phenylene, cyclohexylene, or mixtures thereof and wherein said polyester comprises about 50 to about 90 mole percent of III and about 50 to about 10 mole percent of II.
Claim 14
Dependent Claim
139 words
Method for preparing a polyester of claim 10 having recurring Units III and II wherein and wherein R 1 is selected from the group of alkyl, alkoxy, aryl, alkaryl, aralkyl, halo, or mixtures therof and R 2 is selected from the group of phenylene, cyclohexylene, or mixtures thereof and wherein said polyester comprises about 50 to about 90 mole percent of I I I and about 50 to 10 mole percent of II, which comprises admixing 0.25 to about 0.45 moles of 1,4-cyclohexane-dicarboxylic-acid, or mixtures thereof, about 0.25 to about 0.45 moles of at least one 1,4-diacetoxybenzene substituted in the 2-position with a member selected from the group of alkyl, alkoxy, aryl, alkaryl, aralkyl, or halo and about 0.10 to 0.50 mole of 4-acetoxy-benzoic- acid, and subjecting the admixture to an elevated temperature of about 200 to about 350°C.
References Cited (Backward Citations)
No citation records indexed.
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