Patent FR803382A successfully refreshed from Google Patents.
EP0138672A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of making a printed circuit board
Assignee: Honeywell International Inc
•
Filing: 1984-09-19
•
Granted: —
•
Expires: 2004-09-19
Abstract
Abstract © The invention is a method for providing an electrically conductive path through a substrate. It is especially useful for electrically connecting together electrically conductive paths (25) on opposite sides of a circuit board (20). The method is characterized by the steps of forming a passage (21) through a substrate (20) that connects to at least one conductive path (25) on each side of the substrate (20), filling the passage (21) with an electrically conductive powder (10), applying pressure with a die (30) to obtain a compacted powder (11) in the passage (21), and then heating the compacted powder (11) to a temperature that increases the conductivity and ductility of the compacted powder (11) and its adhesion to the substrate (20) without adversely affecting the shape or condition of the substrate (20).
Inventors
- 👤 Edwin David Lillie
- 👤 Joseph Michael Ilardi
- 👤 Robert Peter Kane
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 11:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/10; H05K3/102; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0108; H05K2203/02; H05K2203/0278; H05K2203/11; H05K2203/1131; H05K3/107
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
79 words
A method of making a circuit board from a substrate comprising the steps of: forming a passage through the substrate and at least one groove on at least one side of the substrate with at least one groove connected to said passage; filling the passage and at least one groove with an electrically conductive metal powder; applying pressure to compact the powder in the passage and the groove; and heating the compacted powder to about its isothermal annealing temperature.
Claim 2
Independent Claim
79 words
A method of making a circuit board from a substrate comprising the steps of: forming a passage through the substrate and at least one groove on at least one side of the substrate with at least one groove connected to said passage; filling the passage and at least one groove with an electrically conductive metal powder; applying pressure to compact the powder in the passage and the groove; and heating the compacted powder to about its isothermal annealing temperature.
Claim 3
Dependent Claim
33 words
The method as described in Claim 1 wherein the step of applying pressure to compact the powder comprises: applying the highest pressure possible to the powder and substrate without adversely affecting the substrate.
Claim 4
Dependent Claim
24 words
The method as described in Claim 1 wherein the pressure applied is about 20,000 to 55,000 psi (2.9 to 8.0 pascals) at room temperature.
Claim 5
Independent Claim
56 words
A method of making a conductive path through a substrate comprising the steps of: forming a passage through the substrate; filling the passage in the substrate with anelectrically conductive metal powder; applying pressure sufficient to increase the bulk density of the powder in the passage; and heating the compacted powder to about its isothermal annealing temperature.
Claim 6
Independent Claim
56 words
A method of making a conductive path through a substrate comprising the steps of: forming a passage through the substrate; filling the passage in the substrate with anelectrically conductive metal powder; applying pressure sufficient to increase the bulk density of the powder in the passage; and heating the compacted powder to about its isothermal annealing temperature.
Claim 7
Dependent Claim
24 words
The method as described in Claim 4 wherein the pressure applied is about 20,000 to 55,000 psi (2.9 to 8.0 Pascals) at room temperature.
Claim 8
Dependent Claim
39 words
The method as described in Claim 4 wherein the electrically conductive powder is a copper electrolytic dust and the temperature to-which the compacted powder is heated is about 200 degrees centigrade for a period of 20 to 60 minutes.
Claim 9
Independent Claim
39 words
A method of making a conductive path through substrate, comprising the steps of: forming a passage through the substrate; filling the passage in the substrate with anelectrically conductive powder; and applying pressure to compact the powder in the passage.
Claim 10
Independent Claim
39 words
A method of making a conductive path through substrate, comprising the steps of: forming a passage through the substrate; filling the passage in the substrate with anelectrically conductive powder; and applying pressure to compact the powder in the passage.
Claim 11
Dependent Claim
13 words
The method as described in Claim 7 wherein the conductive powder is tin.
Claim 12
Independent Claim
67 words
A method of electrically connecting together electrically conductive paths on opposite sides of a substrate, comprising the steps of: forming a passage, between opposite sides of the substrate, that connects to at least one conductive path on each side of said substrate; filling the passage with an electrically conductive powder; applying pressure to compact the powder in the passage; and heating the compacted powder in the passage.
Claim 13
Independent Claim
67 words
A method of electrically connecting together electrically conductive paths on opposite sides of a substrate, comprising the steps of: forming a passage, between opposite sides of the substrate, that connects to at least one conductive path on each side of said substrate; filling the passage with an electrically conductive powder; applying pressure to compact the powder in the passage; and heating the compacted powder in the passage.
Claim 14
Dependent Claim
40 words
The method as described in Claim 9 wherein the electrically conductive powder is a copper electrolytic dust and wherein the compacted powder is heated to a temperature of about 200 degrees centigrade for a period of 20 to 60 minutes.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.