EP0138639A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Inspection method for mask pattern used in semiconductor device fabrication
Assignee: Fujitsu Ltd
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Filing: 1984-08-13
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Granted: —
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Expires: 2004-08-13
Abstract
Abstract An inspection method of a mask pattern such as a reticle pattern (60) used in a fabrication of a semiconductor device, applying an optical system (20) is disclosed. The mask pattern is inspected by an imaging sensor (28) mounted on a stage (30) on which a fabricating object (26) is also mounted. The imaging sensor (28) converts an optical image of the mask pattern (60) being intended to be exposed on the object to a video signal (V a ) and it is inspected comparing with another video signal (V G ) provided from the data for designing the mask pattern (60). This inspection is made before the process of exposing the mask pattern on the fabricating object (26) to avoid the waste of time in the semiconductor patterning process.
Inventors
- 👤 Kenichi Kobayashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 19:27
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/68; G03F1/82; G03F1/84; G03F7/00; G03F7/70; G03F7/70483; G03F7/70591; H; H10; H10P; H10P95/00
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
122 words
An inspection method for a mask pattern used in a semiconductor fabrication applying an optical system (20) by which said mask pattern (60) is exposed on a fabricating object to print said mask pattern, characterized in that it comprises the steps of: projecting an optical image of said mask pattern (60) on an image sensor (28) provided on a stage (30) on which said fabricating object (26) is mounted, said image sensor (28) converting said optical image to a sensor video signal (V a ); and judging whether said mask pattern is normal comparing said sensor video signal (V ) with a data video a signal (V G ) taken from designating data having been used in fabricating said mask pattern (60).
Claim 2
Dependent Claim
122 words
An inspection method for a mask pattern used in a semiconductor fabrication applying an optical system (20) by which said mask pattern (60) is exposed on a fabricating object to print said mask pattern, characterized in that it comprises the steps of: projecting an optical image of said mask pattern (60) on an image sensor (28) provided on a stage (30) on which said fabricating object (26) is mounted, said image sensor (28) converting said optical image to a sensor video signal (V a ); and judging whether said mask pattern is normal comparing said sensor video signal (V ) with a data video a signal (V G ) taken from designating data having been used in fabricating said mask pattern (60).
Claim 3
Dependent Claim
40 words
The inspection method according to claim 1, characterized in that said steps are processed before exposing said mask pattern (60) on said fabricating object (26) and said exposing is processed after said mask pattern has been judged to be normal.
Claim 4
Dependent Claim
22 words
The inspection method according to claim 1, characterized in that said mask pattern comprises a mask pattern (60) on a reticle (12).
Claim 5
Dependent Claim
18 words
The inspection method according to claim 1, characterized in that said mask pattern comprises a single pattern (60).
Claim 6
Dependent Claim
23 words
The inspection method according to claim 4, characterized in that said single mask pattern (60) comprises the mask pattern on a reticle (12).
Claim 7
Dependent Claim
25 words
The inspection method according to claim 1, characterized in that said mask pattern comprises a plurality of patterns each having a same shape and size.
Claim 8
Dependent Claim
24 words
, The inspection method according to claim 6, characterized in that said plurality of said mask patterns comprise the reticle patterns on a reticle.
Claim 9
Dependent Claim
21 words
The inspection method according to claim 1, characterized in that said fabricating object comprises a semiconductor wafer (26) to be fabricated.
Claim 10
Dependent Claim
20 words
The inspection method according to claim 1, characterized in that said fabricating object comprises a photomask (200) to be fabricated.
Claim 11
Dependent Claim
47 words
The inspection method according to claim 1, characterized in that said optical system comprises a single optical system (20) by which said optical image of said mask pattern is projected on either said fabricating object (26) or said image sensor (28) by means of a reducing projection.
Claim 12
Dependent Claim
31 words
The inspection method according to claim 1, characterized in that said optical system comprises different optical systems: one being for said fabricating object and the other being for said image sensor.
Claim 13
Dependent Claim
37 words
The inspection method according to claim 11, characterized in that said optical system for said image sensor comprises a means for having smaller reduction factor than a reduction factor of said optical system for said fabricating object.
Claim 14
Dependent Claim
48 words
The inspection method according to claim 1, characterized in that said image sensor (28) comprises a two-dimensional image sensor having a plurality of sensor elements arranged in a whole image plane which simultaneously converts said optical image of said mask pattern to said sensor video signal (V ).
Claim 15
Dependent Claim
73 words
The inspection method according to claim 1, characterized in that said image sensor (28) comprises a one-dimensional image sensor having a plurality of sensor elements arranged on a line parallel to one side of said optical image of said mask pattern, which converts said optical image of said mask pattern to said sensor video signal (V ) by mechanically scanning said stage (30) in a lateral direction to the line of sensor arrangement.
Claim 16
Dependent Claim
80 words
The inspection method according to claim 1, characterized in that it further comprises a comparator (52) which compares said sensor video signal (V ) and said a data video signal (V G ) reading out the data of a first image memory (40) in which the data of said sensor video signal (V ) are written and the data of a second a image memory (42) in which the data of said data video signal (V G ) are written.
References Cited (Backward Citations)
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