Patent US3170448A successfully refreshed from Google Patents.
EP0133752A2
Expired / Lapsed
EP
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Elements and devices for assembly of electronic components
Assignee: Raychem Corp
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Filing: 1984-07-02
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Granted: —
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Expires: 2004-07-02
Abstract
Abstract A chip carrier mounting device includes a retaining member having a predefined pattern of apertures in which are positioned preforms of joint-forming matenal such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.
Inventors
- 👤 Leslie John Allen
- 👤 Gabe Cherian
- 👤 Stephen H. Diaz
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-26 21:50
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; B23K3/00; B23K3/06; H; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0215; H05K2201/03; H05K2201/0302; H05K2201/0314; H05K2201/0332; H05K2201/0364; H05K2201/0373; H05K2201/10; H05K2201/10227; H05K2201/1028; H05K2201/10378; H05K2201/10424; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10742; H05K2201/10886; H05K2201/10946; H05K2203/00; H05K2203/04; H05K2203/0415; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K3/3421; H05K3/3442; H05K3/40; H05K3/4007; H05K3/4015; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
91 words
A device for connecting electrically conductive elements comprising: a retaining member having a plurality of apertures therein spaced to correspond to preselected points on the electrically conductive elements; and preforms of electrically conductive joint-forming material disposed in or supported by the apertures whereby the ends of the columns are adapted to contact preselected points on the electrically conductive elements and wherein the electrically conductive joint-forming material comprises filled solder, supported solder or conductive elastomer material which substantially retains its preform physical shape while the solder is molten or the elastomer softens.
Claim 2
Independent Claim
91 words
A device for connecting electrically conductive elements comprising: a retaining member having a plurality of apertures therein spaced to correspond to preselected points on the electrically conductive elements; and preforms of electrically conductive joint-forming material disposed in or supported by the apertures whereby the ends of the columns are adapted to contact preselected points on the electrically conductive elements and wherein the electrically conductive joint-forming material comprises filled solder, supported solder or conductive elastomer material which substantially retains its preform physical shape while the solder is molten or the elastomer softens.
Claim 3
Dependent Claim
32 words
A device according to claim 1 wherein the preform of electrically conductive joint-forming material comprises filled solder which substantially retains its preform physical shape while the solder is in a molten state.
Claim 4
Dependent Claim
32 words
A device according to claim 1 wherein the preform of electrically conductive joint-forming material comprises supported solder which substantially retains its preform physical shape while the solder is in a molten state.
Claim 5
Independent Claim
29 words
A device according to any one of claims 1 to 3 wherein the preform of electrically conductive joint-forming material has a height dimension greater than its transverse cross-sectional dimension.
Claim 6
Dependent Claim
37 words
A device according to claim 2 wherein the filled solder comprises solder within which is disposed discrete particles or filaments which are of a material which is solid at a temperature at which the solder is molten.
Claim 7
Dependent Claim
19 words
A device according to claim 3 wherein the support for the solder comprises a spiral metallic wire or tape.
Claim 8
Independent Claim
113 words
A method for forming a resilient connection between preselected points of first and second electrically conductive elements comprising: positioning a first electrically conductive element in alignment with one side of a retaining member having apertures spaced to correspond to the preselected points on the electrically conductive elements and having disposed in said aperture preforms of electrically conductive joint-forming material; effecting a bond between one end of the preforms and the preselected points on the first electrically conductive element; positioning a second electrically conductive element with the opposite side of the retaining member; and effecting a bond between the other end of the preforms and the preselected points on the second electrically conductive element.
Claim 9
Independent Claim
113 words
A method for forming a resilient connection between preselected points of first and second electrically conductive elements comprising: positioning a first electrically conductive element in alignment with one side of a retaining member having apertures spaced to correspond to the preselected points on the electrically conductive elements and having disposed in said aperture preforms of electrically conductive joint-forming material; effecting a bond between one end of the preforms and the preselected points on the first electrically conductive element; positioning a second electrically conductive element with the opposite side of the retaining member; and effecting a bond between the other end of the preforms and the preselected points on the second electrically conductive element.
Claim 10
Dependent Claim
37 words
A method according to claim 7 wherein the bonds between ends of the preforms and the preselected points on the first electrically conductive element and the preselected points on the second electrically conductive member are effected simultaneously.
Claim 11
Dependent Claim
31 words
A method according to claim 7 or 8 comprising the further step of removing the retaining member after the preforms are bonded to both the first and second electrically conductive elements.
Claim 12
Dependent Claim
17 words
A method according to claim 7 or 8 wherein the preforms comprise filled solder or supported solder.
Claim 13
Dependent Claim
57 words
A solder column for forming electrical connections comprising: solder; and disposed in the solder a filler comprising discrete particles or filaments which are of a material which is solid at a temperature at which the solder is molten, and which are present in an amount sufficient substantially to maintain the column-like shape when the solder is molten.
Claim 14
Dependent Claim
57 words
A solder column for forming electrical connections comprising: solder; and disposed in the solder a filler comprising discrete particles or filaments which are of a material which is solid at a temperature at which the solder is molten, and which are present in an amount sufficient substantially to maintain the column-like shape when the solder is molten.
Claim 15
Dependent Claim
16 words
A solder column according to claim 11 wherein the filler comprises a metal powder or filament.
Claim 16
Dependent Claim
15 words
A solder column according to claim 11 wherein the filler comprises lengths of metal wire.
Claim 17
Dependent Claim
67 words
A solder column for forming electrical connections comprising: solder; and disposed about the outside of the solder a support strand or tape which is of a material which is solid at a temperature at which the solder is molten, and which is disposed about the outside of the solder in a pattern whereby the column-like shape of the solder is substantially maintained when the solder is molten.
Claim 18
Dependent Claim
67 words
A solder column for forming electrical connections comprising: solder; and disposed about the outside of the solder a support strand or tape which is of a material which is solid at a temperature at which the solder is molten, and which is disposed about the outside of the solder in a pattern whereby the column-like shape of the solder is substantially maintained when the solder is molten.
Claim 19
Dependent Claim
18 words
A solder column according to claim 14 wherein the support comprises a metal wire or a metal tape
Claim 20
Dependent Claim
73 words
A solder composition comprising: solder; and disposed in the solder a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, which are present in an amount of from 20% to 80% by weight based on the total weight of the solder-filler mixture, and which are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten.
Claim 21
Dependent Claim
73 words
A solder composition comprising: solder; and disposed in the solder a filler comprising discrete particles or filaments which are solid at a temperature at which the solder is molten, which are present in an amount of from 20% to 80% by weight based on the total weight of the solder-filler mixture, and which are of sufficient size and density substantially to maintain the solder in a preformed shape when the solder is molten.
Claim 22
Dependent Claim
15 words
A solder composition according to claim 16 wherein the filler comprises metal particles or filaments.
Claim 23
Dependent Claim
12 words
A solder composition according to claim 17 wherein the metal comprises copper.
References Cited (Backward Citations)
No citation records indexed.
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