Electronic device method using a leadframe with an integral mold vent means

Claim 2

In a leadframe adapted for use in encapsulation of electronic devices in a cavity of a mold, the improvement comprising, integral molding vent means formed in said leadframe.

Claim 3

In a leadframe with side rails, adapted for use in plastic encapsulation of articles in a mold cavity, the improvement comprising, integral molding vent channels formed in said side rails.

Claim 4

In a leadframe with side rails, adapted for use in plastic encapsulation of articles in a mold cavity, the improvement comprising, integral molding vent channels formed in said side rails.

Claim 5

In a leadframe with side rails, adapted for use in plastic encapsulation of electronic devices in a cavity in a mold, the improvement comprising, vent means in said side rails for allowing gas to escape from said mold cavity during introduction of said plastic into said cavity in said mold.

Claim 6

In a leadframe with side rails, adapted for use in plastic encapsulation of electronic devices in a cavity in a mold, the improvement comprising, vent means in said side rails for allowing gas to escape from said mold cavity during introduction of said plastic into said cavity in said mold.

Claim 7

A leadframe adapted for use in plastic encapsulation of electronic devices, comprising: device support means; lead means adjacent said device support means; mold seal means adjacent to said device support means and lead means, adapted to seal against opposing faces of a mold having a mold cavity to contain said die support means; and molding vent means integral with said mold seal means for venting said mold cavity during said plastic encapsulation.

Claim 8

A leadframe adapted for use in plastic encapsulation of electronic devices, comprising: device support means; lead means adjacent said device support means; mold seal means adjacent to said device support means and lead means, adapted to seal against opposing faces of a mold having a mold cavity to contain said die support means; and molding vent means integral with said mold seal means for venting said mold cavity during said plastic encapsulation.

Claim 9

A leadframe adapted for use in encapsulation of electronic devices in a mold cavity, comprising: first and second side rails arranged in substantially parallel spaced apart relationship; multiple device support means coupled to said side rails and arranged in parallel spaced apart relationship substantially perpendicular to said side rails; multiple lead means adjacent each said die support means and coupled to said side rails; and molding vent means, formed in at least one said side rail for allowing gases to escape from said mold cavity during encapsulation.

Claim 10

A leadframe adapted for use in encapsulation of electronic devices in a mold cavity, comprising: first and second side rails arranged in substantially parallel spaced apart relationship; multiple device support means coupled to said side rails and arranged in parallel spaced apart relationship substantially perpendicular to said side rails; multiple lead means adjacent each said die support means and coupled to said side rails; and molding vent means, formed in at least one said side rail for allowing gases to escape from said mold cavity during encapsulation.

Claim 11

The leadframe of claim 5 wherein said molding vent means comprises grooves traversing said at least one side rail.

Claim 12

In a semiconductor device having a molded unitary plastic housing, the combination of: a plurality of metal parts some of which have portions within and without said plastic housing; a semiconductor unit secured to one metal part within said plastic housing and conductively connected within said housing with other of said metal parts; with said portions of said metal parts extending out of said plastic housing to serve as connectors for the semiconductor device and with said metal part portions extending outside said plastic housing being joined by severable tie strip means integral therewith at a point between the plastic housing and the end of each said portion extending outside said plastic housing and retaining said extending portions parallel with one another during molding and serving as a mold sealing point in such molding, wherein said tie strip means contains molding vent means to permit gases to escape said mold during molding of said plastic housing, said tie strip means being retained with the device until after the molding and then being severed from said metal part portions to leave each of said extending portions free relative to one another to act as connectors for the device.

Claim 13

In a semiconductor device having a molded unitary plastic housing, the combination of: a plurality of metal parts some of which have portions within and without said plastic housing; a semiconductor unit secured to one metal part within said plastic housing and conductively connected within said housing with other of said metal parts; with said portions of said metal parts extending out of said plastic housing to serve as connectors for the semiconductor device and with said metal part portions extending outside said plastic housing being joined by severable tie strip means integral therewith at a point between the plastic housing and the end of each said portion extending outside said plastic housing and retaining said extending portions parallel with one another during molding and serving as a mold sealing point in such molding, wherein said tie strip means contains molding vent means to permit gases to escape said mold during molding of said plastic housing, said tie strip means being retained with the device until after the molding and then being severed from said metal part portions to leave each of said extending portions free relative to one another to act as connectors for the device.

Claim 14

In a device as defined in claim 7 wherein the metal parts are originally in a multiple unit one-piece flat structure adapted for automated process construction, wherein said molding vent means are formed in a side rail portion of said tie strip, and wherein the plastic housed devices are separated after plastic encapsulation.

Claim 15

In a method for plastic encapsulation of electronic devices on a leadframe, the improvement comprising, utilizing said leadframe simultaneously as a mold closure seal means and a molding vent means.

Claim 16

In a method for plastic encapsulation of electronic devices on a leadframe, the improvement comprising, utilizing said leadframe simultaneously as a mold closure seal means and a molding vent means.

Claim 17

In a method for plastic encapsulation of electronic devices on a leadframe in a mold, the improvement comprising: providing a leadframe containing integral molding vent means; locating said leadframe between opposing faces of said mold; closing said mold to engage said leadframe at least in part as a mold closure seal; either before or after said locating or closing steps, introducing plastic into said mold; and venting gases from said mold via said integral molding vent means.

Claim 18

In a method for plastic encapsulation of electronic devices on a leadframe in a mold, the improvement comprising: providing a leadframe containing integral molding vent means; locating said leadframe between opposing faces of said mold; closing said mold to engage said leadframe at least in part as a mold closure seal; either before or after said locating or closing steps, introducing plastic into said mold; and venting gases from said mold via said integral molding vent means.