EP0130410A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Printed circuit board structure for metal package containing high-frequency component
Assignee: NEC Corp
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Filing: 1984-06-06
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Granted: —
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Expires: 2004-06-06
Abstract
Abstract The printed circuit board structure mounts a metal package with a circuit component for use in a high-frequency region contained therein. The structure comprises a grounding hole bored partially in an area of the printed circuit board under the metal package and means for connecting the metal package with conductors on the printed circuit board via the grounding hole. This printed circuit board structure improves the characteristics of the high-frequency components contained in the metal package and minimizes the mounting area for a metal package.
Inventors
- 👤 Shinjiro Umetsu
- 👤 Shigeo Yoshizawa
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 15:33
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/10; H03H9/1064; H03H9/1071; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/0243; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3415; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09572; H05K2201/10; H05K2201/10007; H05K2201/1006; H05K2201/10227; H05K2201/10371; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10954; H05K2201/10969; H05K2203/00; H05K2203/04; H05K2203/045; H05K2203/0455; H05K2203/11; H05K2203/1147; H05K3/3447; H05K3/3465; H05K3/3468; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
57 words
A printed circuit board structure mounting a metal package with a circuit component for use ina high-frequency region contained therein, said structure comprising: a grounding hole bored in an area of said printed circuit board under said metal package; and means for connecting said metal package with conductors on said printed circuit board through said grounding hole.
Claim 2
Dependent Claim
57 words
A printed circuit board structure mounting a metal package with a circuit component for use ina high-frequency region contained therein, said structure comprising: a grounding hole bored in an area of said printed circuit board under said metal package; and means for connecting said metal package with conductors on said printed circuit board through said grounding hole.
Claim 3
Dependent Claim
16 words
A printed circuit board structure as claimed in Claim 1 wherein said connecting means comprises solder.
Claim 4
Dependent Claim
54 words
A printed circuit board structure as claimed in Claim 2 wherein said circuit component has lead wires extended from the bottom of said metal package, and wherein said printed circuit board structure includes through-holes, said lead wires passing through said through-holes, and solder connecting said lead wires with conductors on said printed circuit board.
Claim 5
Dependent Claim
18 words
A printed circuit board structure as claimed in Claim 3 wherein said metal package is at earth potential.
Claim 6
Dependent Claim
18 words
A printed circuit board structure as claimed in Claim 3 or 4 wherein said grounding hole is circular.
Claim 7
Dependent Claim
24 words
A printed circuit board structure as claimed in Claim 5 wherein the diameter of said grounding hole is larger than that of said through-holes.
Claim 8
Dependent Claim
41 words
A printed circuit board structure as claimed in any of Claims 3 to 6 wherein conductive patterns of said printed circuit board on the side mounting said metal package are applied with resist except for the areas around said grounding hole.
Claim 9
Dependent Claim
25 words
A printed circuit board structure as claimed in Claim 7 wherein conductive patterns are removed from the area around said through-holes on said mounting side.
Claim 10
Dependent Claim
28 words
A printed circuit board structure as claimed in any of Claims 4 to 8 wherein said circuit component is a band-pass filter including a surface accoustic wave device.
Claim 11
Dependent Claim
21 words
A printed circuit board structure as claimed in Claim 9 wherein said band-pass filter has a frequency band-width of 400 MHz.
Claim 12
Independent Claim
27 words
A method for mounting a metal package containing a circuit component for use ina high-frequency region on a printed circuit board, said method comprising the steps of:
Claim 13
Independent Claim
27 words
A method for mounting a metal package containing a circuit component for use ina high-frequency region on a printed circuit board, said method comprising the steps of:
Claim 14
Dependent Claim
32 words
boring a grounding hole in an area of said printed circuit board under said metal package; and soldering conductors on said printed circuit board with said metal package through said grounding hole.
Claim 15
Dependent Claim
32 words
boring a grounding hole in an area of said printed circuit board under said metal package; and soldering conductors on said printed circuit board with said metal package through said grounding hole.
Claim 16
Dependent Claim
46 words
A method as claimed in Claim 11 further comprising the steps of: boring through-holes in said printed circuit board in order to pass lead wires for terminals of said circuit components; and soldering said lead wires to a part of conductors of said printed circuit board.
References Cited (Backward Citations)
No citation records indexed.
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