Heat radiator assembly for cooling electronic parts
Abstract
Abstract A heat radiator assembly conducts the heat generated by electronic parts mounted on a printed board, such as integrated circuits, resistors, and semiconductor elements, through a first and a second heat sinks to a shield case, so that the heat is radiated therefrom and thus natural air cooling is effected. The first heat sink is provided on the shield case, and the second heat sink is passed through a through hole in the shield case and the first heat sink, threadedly engaged therewith, to come in touch with the electronic parts. If necessary, a lock nut or a lock screw may be used for tightening the threaded engagement of the second heat sink.
Inventors
- 👤 Kenji C/O Mitsubishi Denki K. K. Oogaki
- 👤 Hiroshi C/O Mitsubishi Denki K. K. Sato
Bibliographic Details
Claims Analysis
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