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EP0127115A2
Expired / Lapsed
EP
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Heat sink structure for an electronic package
Assignee: International Business Machines Corp
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Filing: 1984-05-23
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Granted: —
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Expires: 2004-05-23
Abstract
Abstract A heat sink structure for mounting on a semiconductor package includes a plurality of pins (20) affixed to a lid on the package (12-16), and a cooling fin means (26) having a thin walled, cellular configuration with the cells defining parallel elongated openings that extend through the fin means. The pins (20) are seated in the cells of the fin means.
Inventors
- 👤 Eric Bruce Hultmark
- 👤 Claude Georges Metreaud
- 👤 Robert Anthony Yacavonis
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 20:39
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/20; H10W40/22; H10W40/226; H10W40/228
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
113 words
Heat sink structure for an electronic semiconductor package having a substrate (12) with at least one integrated circuit (IC) mounted thereon, and a lid (14) forming with the substrate an enclosure for the said IC, comprising a plurality of pins (20) made of heat conductive material affixed to said lid (14), cooling fin means mounted on said plurality of pins, said fin means comprised of a thin walled, cellular configuration with cells defining parallel elongated openings extending through said fin means, said plurality of pins (20) seated in a plurality of said cells of said fin means, whereby said fin means is mounted on said package to dissipate the heat of said package.
Claim 2
Dependent Claim
113 words
Heat sink structure for an electronic semiconductor package having a substrate (12) with at least one integrated circuit (IC) mounted thereon, and a lid (14) forming with the substrate an enclosure for the said IC, comprising a plurality of pins (20) made of heat conductive material affixed to said lid (14), cooling fin means mounted on said plurality of pins, said fin means comprised of a thin walled, cellular configuration with cells defining parallel elongated openings extending through said fin means, said plurality of pins (20) seated in a plurality of said cells of said fin means, whereby said fin means is mounted on said package to dissipate the heat of said package.
Claim 3
Dependent Claim
28 words
The heat sink structure of claim 1, wherein said cells of said thin walled, cellular configuration are of a honeycomb structure with each cell defining a regular hexagon.
Claim 4
Dependent Claim
26 words
The heat sink structure of claim 2, wherein the lower side of said fin means (26) is spaced from the underlying surface of said lid (14).
Claim 5
Dependent Claim
38 words
The heat sink structure of claim 3, wherein said pins are provided with shoulder stops (24) spaced from the ends (22) affixed to said lid (14) to control the depth of insertion of said pins into said cells.
Claim 6
Dependent Claim
16 words
The heat sink structure of claim 2, wherein said fin means (26) is formed of aluminum.
Claim 7
Dependent Claim
16 words
The heat sink structure of claim 2, wherein said fin means (26) is formed of copper.
Claim 8
Dependent Claim
15 words
The heat sink structure of claim I, wherein said pins (20) are formed of copper.
Claim 9
Dependent Claim
22 words
The heat sink structure of claim 1, wherein said pins (20) have enlarged heads (22) that are bonded to said lid (14).
Claim 10
Dependent Claim
38 words
The heat sink structure of claim 1, wherein plural integrated circuits (ICs) are mounted on said substrate (12) and enclosed by said lid (14), and said pins (20) are located over the heat producing ICs beneath said lid.
Claim 11
Dependent Claim
46 words
The heat sink structure of claim 2, wherein said pins (20) have a circular cross-sectional configuration with a diameter slightly larger than the width of said cells, said pins deforming the walls of said cells upon being introduced, forming a firm frictional and heat conductive engagement.
References Cited (Backward Citations)
No citation records indexed.
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