Solid-state color imaging device and process for fabricating the same

Claim 2

A solid-state color imaging device having a color filter array which is integrally formed with a solid-state image sensor.and which has color filter portions corresponding to a plurality of picture elements, said solid-state image sensor being arranged such that said plurality of picture elements are arrayed on one surface in a two-dimensional array, characterized in that said color filter portions are formed as focusing portions (10) in one-to-one correspondence with the plurality of picture elements (12).

Claim 3

A device according to claim 1, characterized in that only full-color light-transmitting filter portions (W) of said color filter array comprise said focusing portions.

Claim 4

A device according to claim 1, characterized in that all of said color filter portions (W, C, Y or R, G, B) in one-to-one correspondence with said picture elements (12) are used as said focusing portions.

Claim 8

A device according to claim 6, characterized in that an intermediate layer of a transparent resist is formed at least between overlapping edges of said every adjacent color filter portions so as to prevent color mixing.

Claim 12

ll. A process for fabricating a solid-state color imaging device, comprising at least: a first step for forming a base layer on a solid-state image sensor having a plurality of picture elements arrayed in a two-dimensional array so as to provide an even surface of said solid-state image sensor; a second step for forming a first convex lens-like dye receiving portion layer of a transparent resist on even surface portions of said base layer which correspond to first predetermined picture elements of said plurality of picture elements; a third step for dipping a solid-state image sensor structure having said first dye receiving portion layer in a first dye solution so as to dye said first dye receiving portion layer in a first color; a fourth step for forming an intermediate layer on first color filter portions obtained by the third step and on a remaining portion of said base layer surface so as to prevent color mixing; a fifth step for forming a second convex lens-like dye receiving portion layer of a transparent resist on portions of said intermediate layer, obtained by the fourth step, which correspond to second predetermined picture elements of said plurality of picture elements; a sixth step for dipping a resultant solid-state image sensor structure having said second dye receiving portion layer in a second dye solution so as to dye said second dye receiving portion layer in a second color; a seventh step for forming an intermediate layer on second color filter portions obtained by the sixth step and on a remaining portion of said base layer surface so as to prevent color mixing; an eighth step for forming a third convex lens-like dye receiving portion layer of a transparent resist on portions of said intermediate layer, obtained by the seventh step, which correspond to third predetermined picture elements of said plurality of picture elements; and a ninth step for forming an overcoat layer to cover a surface of said third dye receiving portion layer.

Claim 13

ll. A process for fabricating a solid-state color imaging device, comprising at least: a first step for forming a base layer on a solid-state image sensor having a plurality of picture elements arrayed in a two-dimensional array so as to provide an even surface of said solid-state image sensor; a second step for forming a first convex lens-like dye receiving portion layer of a transparent resist on even surface portions of said base layer which correspond to first predetermined picture elements of said plurality of picture elements; a third step for dipping a solid-state image sensor structure having said first dye receiving portion layer in a first dye solution so as to dye said first dye receiving portion layer in a first color; a fourth step for forming an intermediate layer on first color filter portions obtained by the third step and on a remaining portion of said base layer surface so as to prevent color mixing; a fifth step for forming a second convex lens-like dye receiving portion layer of a transparent resist on portions of said intermediate layer, obtained by the fourth step, which correspond to second predetermined picture elements of said plurality of picture elements; a sixth step for dipping a resultant solid-state image sensor structure having said second dye receiving portion layer in a second dye solution so as to dye said second dye receiving portion layer in a second color; a seventh step for forming an intermediate layer on second color filter portions obtained by the sixth step and on a remaining portion of said base layer surface so as to prevent color mixing; an eighth step for forming a third convex lens-like dye receiving portion layer of a transparent resist on portions of said intermediate layer, obtained by the seventh step, which correspond to third predetermined picture elements of said plurality of picture elements; and a ninth step for forming an overcoat layer to cover a surface of said third dye receiving portion layer.

Claim 14

A process according to claim 11, characterized in that said first and second color filter portions comprise cyan and yellow portions, respectively, and said third dye receiving portion layer comprises undyed filter portions.

Claim 15

A process according to claim 11, characterized in that said first and second color filter portions comprise red and green portions, and said third dye receiving portion layer is dyed to give blue filter portions before the eighth step.

Claim 16

A process for fabricating a solid-state color imaging device, comprising at least: a first step for forming a base layer on a solid-state image sensor having a plurality of picture elements arrayed in a two-dimensional array so as to provide an even surface of said solid-state image sensor; a second step for forming a first convex lens-like dye receiving portion layer of a transparent resist on the even surface portions of said base layer which correspond to first predetermined picture elements of said plurality of picture elements; a third step of dipping a solid-state image sensor structure having said first dye receiving portion layer in a first dye solution so as to dye said first dye receiving portion layer in a first color; a fourth step for dipping a resultant solid-state image sensor structure first in an aqueous solution of tannic acid and subsequently in an aqueous solution of arsenic oxide so as to solidify a dye of first color filter portions obtained by the third step and prevent color mixing; a fifth step for forming a second convex lens-like dye receiving portion layer of a transparent resist on said base layer portions of a resultant solid-state image sensor structure, obtained by the fourth step, which correspond to second predetermined picture elements of said plurality of picture elements; a sixth step for dipping a resultant solid-state image sensor structure having said second dye receiving portion layer in a second dye solution so as to dye said second dye receiving portion layer in a second color; a seventh step for forming an intermediate layer on a resultant solid-state image sensor structure obtained by the sixth step; an eighth step for forming a third convex lens-like dye receiving portion layer of a transparent resist on portions of a resultant solid-state image sensor structure, obtained by the seventh step, which correspond to third predetermined picture elements of said plurality of picture elements; and a ninth step for forming an overcoat layer to cover an entire surface of said third dye receiving portion layer and said first and second color filter portions.

Claim 17

A process for fabricating a solid-state color imaging device, comprising at least: a first step for forming a base layer on a solid-state image sensor having a plurality of picture elements arrayed in a two-dimensional array so as to provide an even surface of said solid-state image sensor; a second step for forming a first convex lens-like dye receiving portion layer of a transparent resist on the even surface portions of said base layer which correspond to first predetermined picture elements of said plurality of picture elements; a third step of dipping a solid-state image sensor structure having said first dye receiving portion layer in a first dye solution so as to dye said first dye receiving portion layer in a first color; a fourth step for dipping a resultant solid-state image sensor structure first in an aqueous solution of tannic acid and subsequently in an aqueous solution of arsenic oxide so as to solidify a dye of first color filter portions obtained by the third step and prevent color mixing; a fifth step for forming a second convex lens-like dye receiving portion layer of a transparent resist on said base layer portions of a resultant solid-state image sensor structure, obtained by the fourth step, which correspond to second predetermined picture elements of said plurality of picture elements; a sixth step for dipping a resultant solid-state image sensor structure having said second dye receiving portion layer in a second dye solution so as to dye said second dye receiving portion layer in a second color; a seventh step for forming an intermediate layer on a resultant solid-state image sensor structure obtained by the sixth step; an eighth step for forming a third convex lens-like dye receiving portion layer of a transparent resist on portions of a resultant solid-state image sensor structure, obtained by the seventh step, which correspond to third predetermined picture elements of said plurality of picture elements; and a ninth step for forming an overcoat layer to cover an entire surface of said third dye receiving portion layer and said first and second color filter portions.