EP0123795B1
Expired / Lapsed
EP
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Unitary heat sink for an electronic device module
Assignee: International Business Machines Corp
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Filing: 1984-02-03
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Granted: 1990-05-02
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Expires: 2004-02-03
Abstract
No abstract record available.
Inventors
- 👤 Joseph Louis Horvath
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 19:26
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; F; F28; F28F; F28F3/00; F28F3/02; H10W40/40; H10W40/43
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
239 words
Unitary heat sink for an electronic device module (10) having a substrate with a plurality of ·electronic devices operatively mounted thereon, and a lid element mounted on the substrate forming an enclosure for the electronic devices, the heat sink (12), being formed of heat conducting material bonded to the lid element for dissipating heat generated by the electronic devices, the heat sink having a plurality of cooling fin elements (20) of an essentially square or rectangular cross-section, and positioned orthogonally relative to the top surface of the lid, the fin elements having elongated upwardly extending openings that terminate short of the top of the fin elements and which divide the base of the fin elements into leg sections which are supported by flat quadrilateral base portions individually bonded to the lid, characterized in that -the fin elements (20) are arranged in columns and rows, forming a 2-dimensional array, -the elongated upwardly extending openings (26, 28) are provided in each of the vertical walls of the fin elements thereby dividing the base of each of the fin elements into four leg sections positioned at the corners of the fin elements, and in that -the quadrilateral base portions (30) are arranged in columns and rows, forming a 2- dimensional array, the four individual leg sections of each fin element being connected to four different adjacent quadrilateral base portions, whereby, in turn, each base portion is attached to four different fin elements.
Claim 2
Dependent Claim
239 words
Unitary heat sink for an electronic device module (10) having a substrate with a plurality of ·electronic devices operatively mounted thereon, and a lid element mounted on the substrate forming an enclosure for the electronic devices, the heat sink (12), being formed of heat conducting material bonded to the lid element for dissipating heat generated by the electronic devices, the heat sink having a plurality of cooling fin elements (20) of an essentially square or rectangular cross-section, and positioned orthogonally relative to the top surface of the lid, the fin elements having elongated upwardly extending openings that terminate short of the top of the fin elements and which divide the base of the fin elements into leg sections which are supported by flat quadrilateral base portions individually bonded to the lid, characterized in that -the fin elements (20) are arranged in columns and rows, forming a 2-dimensional array, -the elongated upwardly extending openings (26, 28) are provided in each of the vertical walls of the fin elements thereby dividing the base of each of the fin elements into four leg sections positioned at the corners of the fin elements, and in that -the quadrilateral base portions (30) are arranged in columns and rows, forming a 2- dimensional array, the four individual leg sections of each fin element being connected to four different adjacent quadrilateral base portions, whereby, in turn, each base portion is attached to four different fin elements.
Claim 3
Dependent Claim
46 words
The unitary heat sink of claim 1 wherein each of the cooling fin elements (20) is provided with an opening (24) in the top end which permits downward flow of a cooling medium through the fin elements and exiting outwardly through the elongated upwardly extending openings.
Claim 4
Dependent Claim
15 words
The unitary heat sink of claim 2 wherein the heat conductive material is a metal.
Claim 5
Dependent Claim
14 words
The unitary heat sink of claim 3 wherein the heat conductive material is aluminium.
Claim 6
Dependent Claim
38 words
The unitary heat sink of claim 1 wherein the ratio between the height dimension of the cooling fin elements (20) and the width of the upwardly extending openings (26, 28) is in the range of 5 to 50.
Claim 7
Dependent Claim
46 words
The unitary heat sink of claim 1 wherein the four leg sections are formed by the intersection of two transverse slots (26, 28), where the width of the slots (26, 28) is from 1/3 to 1/2 of the total horizontal width of the fin elements (20).
Claim 8
Dependent Claim
201 words
A process for producing a unitary heat sink, such as claimed in claim 1, for an electronic device module (10) having a substrate with a plurality of electronic devices operatively mounted thereon, and a lid element mounted on the substrate forming an enclosure for the electronic: devices, the process comprising the steps of providing a rectangular block of heat conducting material, forming a plurality of first parallel spaced slots (26) in the bottom of the block in a first direction, forming a plurality of second parallel spaced slots (28) in the bottom of the block in a second direction that is transverse to the first direction, forming a plurality of third parallel spaced slots (44) in the top of the block in said first direction that are positioned between and in overlapping relation to the first spaced slots (26), forming a plurality of fourth parallel spaced slots (46) in the top of the block in said second direction that are positioned between and in overlapping relation to the second spaced slots (28), and forming openings (24) in the top surface of each of the resultant cooling fin elements (20) formed by the plurality of the third (44) and fourth (46) slots.
References Cited (Backward Citations)
No citation records indexed.
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