EP0122631A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Electronic device having a multi-layer wiring structure
Assignee: Hitachi Microcomputer System Ltd
•
Filing: 1984-04-16
•
Granted: —
•
Expires: 2004-04-16
Abstract
Abstract An electronic device having a multi-layer wiring structure comprises an inorganic resin material film as an interlayer insulation film (14) between a lower wiring (13) and an upper wiring (15), an organic insulative material film such as polymide as a protection film (17a, 17b) for protecting an uppermost wiring and resin mold (19) for molding the electronic device.
Inventors
- 👤 Kazumichi Fujioka
- 👤 Tokio Kato
- 👤 Eiichi Takahashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 13:10
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/45; H10W20/48; H10P; H10P14/00; H10P14/60; H10P14/69; H10P14/692; H10P14/6921; H10P14/6922; H10P14/6923; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
47 words
An electronic device having a multi-layer wiring structure comprising an inorganic insulative material film as an interlayer insulation film (14) between a lower wiring (13) and an upper wiring (15) and an organic resin material film as a protection film (17a, 17b) for protecting an uppermost wiring.
Claim 2
Dependent Claim
47 words
An electronic device having a multi-layer wiring structure comprising an inorganic insulative material film as an interlayer insulation film (14) between a lower wiring (13) and an upper wiring (15) and an organic resin material film as a protection film (17a, 17b) for protecting an uppermost wiring.
Claim 3
Dependent Claim
56 words
An electronic device having a multi-layer wiring structure comprising an inorganic insulative material layer as an interlayer insulation film (14) between a lower wiring (13) and an upper wiring (15), an organic resin material layer as a protection film (17a, 17b) for protecting an uppermost wiring and a resin mold (19) for molding said electronic device.
Claim 4
Dependent Claim
56 words
An electronic device having a multi-layer wiring structure comprising an inorganic insulative material layer as an interlayer insulation film (14) between a lower wiring (13) and an upper wiring (15), an organic resin material layer as a protection film (17a, 17b) for protecting an uppermost wiring and a resin mold (19) for molding said electronic device.
Claim 5
Dependent Claim
23 words
An electronic device having a multi-layer wiring structure according to Claim 2 wherein said resin mold is formed by a transfer molding technique.
Claim 6
Dependent Claim
102 words
An electronic device having a multi-layer wiring structure which comprises: a substrate (10) having formed thereon a first metal layer of wiring (13); an interlayer insulation layer (14) disposed on said first metal layer, said interlayer insulation layer being composed of a plasma insulation film, an insulative glass film and a phosphorus silicate glass film; a second metal layer of wiring (15) disposed on said interlayer insulation layer; a phosphorus silicate glass film (17a) disposed on said second metal layer; a polyimide resin film (17b) disposed on said phosphorus silicate glass film; and a sealing resin (19) covering said polyimide resin film.
Claim 7
Dependent Claim
102 words
An electronic device having a multi-layer wiring structure which comprises: a substrate (10) having formed thereon a first metal layer of wiring (13); an interlayer insulation layer (14) disposed on said first metal layer, said interlayer insulation layer being composed of a plasma insulation film, an insulative glass film and a phosphorus silicate glass film; a second metal layer of wiring (15) disposed on said interlayer insulation layer; a phosphorus silicate glass film (17a) disposed on said second metal layer; a polyimide resin film (17b) disposed on said phosphorus silicate glass film; and a sealing resin (19) covering said polyimide resin film.
Claim 8
Dependent Claim
31 words
An electronic device having a multi-layer wiring structure according to Claim 4, wherein an insulative glass film (17c) is interposed between said polyimide resin film and said phosphorus silicate glass film.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.