EP0121268A1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Flat-card-shaped semiconductor device with electric contacts on both faces and process for its manufacture
Assignee: STMicroelectronics SRL
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Filing: 1984-01-16
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Granted: —
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Expires: 2004-01-16
Abstract
Abstract Two superimposed series of electric contacts (3, 4) in the shape of metal-sheet strips, electrically connected to a metallic place (2) which supports a semiconductor chip (5), are electrically separated but mechanically connected by an interposed layer of adhesive material (8) at high insulation. The whole is completely inserted in a covering (14) of insulating material, which forms a flat support, from which, at opposite faces, only limited adjacent contact portions (9,10) of said electric contacts emerge. The place (2) and at least one of the two series of contacts (3,4) make part of a single starting metallic frame (1) on which the other series of contacts is superimposed. This latter in its turn can make part of the same metallic frame (1) and to be superimposed by refolding or can be prepared separately and then applied on the first series.
Inventors
- 👤 Giuseppe Marchisi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 11:40
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/699; G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07743; H10W70/40; H10W70/451; H10W74/00; H10W74/10; H10W74/111; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49135
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
95 words
Semiconductor device in the shape of a flat card comprising a plate insulating support, a semiconductor chip and two superimposed series of electric contacts characterized in that said electric contacts are constituted by sheet-metal strips electrically connected to a support metallic place of the semiconductor chip and said flat support comprises a layer of adhesive material at high insulation interposed between the two series of electric contacts and a covering or package of in sulating material from which, at opposite faces of said flat support, only limited adjacent contact portions of said electric contacts emerge.
Claim 2
Dependent Claim
95 words
Semiconductor device in the shape of a flat card comprising a plate insulating support, a semiconductor chip and two superimposed series of electric contacts characterized in that said electric contacts are constituted by sheet-metal strips electrically connected to a support metallic place of the semiconductor chip and said flat support comprises a layer of adhesive material at high insulation interposed between the two series of electric contacts and a covering or package of in sulating material from which, at opposite faces of said flat support, only limited adjacent contact portions of said electric contacts emerge.
Claim 3
Dependent Claim
19 words
Device according to claim 1, characterized in that said semiconductor chip is provided with an encapsulation of valuable resin.
Claim 4
Dependent Claim
22 words
Device according to claim 1; characterized in that said layer of adhesive material is formed by epoxide glue at high in sulation.
Claim 5
Dependent Claim
18 words
Device according to claim 1, characterized in that said covering of insulating material is formed by epoxide resin.
Claim 6
Dependent Claim
124 words
Process for the manufacture of a semiconductor device ac cording to the previous claims, characterized in that it provides the use, as starting element, of a flat metall ic frame including a support place for the semiconductor chip and at least one first series of electric cont.acts in the shape of metal-sheet strips, the deposition of the semiconductor chip on said place, the superimposition of a second scries of electric contacts in the shape of metal-sheet strips on said first series with interposition of a layer of adhesive material at high insulation and finally the realization of a covering of insulating material to form a flat support or package from which, at opposite faces, only limited adjacent contact portions of said electric contacts emmerge.*
Claim 7
Dependent Claim
41 words
Process according to claim 5, characterized in that the second series of electric contacts is also contained in said flat metallic frame, at the opposite part with respect to the first series, and then superimposed to the first one by refolding.
Claim 8
Dependent Claim
24 words
Process according to claim 5, characterized in that said second series of electric contacts is prepared separately and then applied on the first one.
Claim 9
Dependent Claim
34 words
Process according to claim 5, characterized in that, befo re the realisation ion of said covering of insulating material, the re is carried out the encapsulation of the semiconductor chip in a valuable resin.
References Cited (Backward Citations)
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